GY020SEI POWER-ONE | Alldatasheet

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High Density - Board Mounted Power Division Powering Communications and Technology IES020YG-A 10 20 30 40 50 60 70 80 90 100 LOAD % EFF. (18v) EFF. (24v) EFF. (36v) Efficiency vs. Load (48V Input)

  • 20W Standard Package
  • 100°C Case Operation
  • 3.3V Output Available
  • Open Frame or Encapsulated
  • 88% Efficiency at 5V
  • Wide Range Input
  • 1500V Isolation
  • Short Circuit Protection

DESCRIPTION

FEATURES

Efficiency vs. Load (24V Input) IES SERIES

20 WATT

IES DC/DC converters provide up to 20 Watts of output power in an industry standard package. With 88% efficiency and a maximum case temperature of 100°C, the IES is well suited for the most demanding telecom, networking, and industrial applications. The IES features 1500 VDC isolation, short circuit, and overtemperature protection. Notes † MTBF predictions may vary slightly from model to model. Specifications typically at 25°C, normal line, and full load, unless otherwise stated. Soldering Conditions: I/O pins, 260°C, ten seconds; fully compatible with commercial wave-soldering equipment. Safety: Agency approvals may vary from model to model. Please consult factory for specific model information. Units are water-washable and fully compatible with commercial spray or immersion post wave-solder washing equipment. Turn-On Time 10 ms Remote Shutdown Positive Logic Switching Frequency 300 kHz Open Frame / 450 kHz Cased Isolation Input - Output 1500 VDC Input - Case (24 Vin Units) 500 VDC Output - Case (48 Vin Units) 500 VDC Temperature Coefficient 0.03%/°C Case Temperature Operating Range -40 To +100°C Storage Range -40 To +125°C Humidity Max., Non-Condensing 95% Vibration, 3 Axes, 5 Min Each 5 g, 10 - 55 Hz MTBF† (Bellcore TR-NWT-000332) 1.9 x 10 6 hrs Safety UL, CSA, EN60950 Weight (approx.) 1.2 oz General Setpoint Accuracy ±1% Line Regulation Vin Min. - Vin Max., Iout Rated 0.2% V out Load Regulation Iout Min. - Iout Max., Vin Nom. 0.5% V out Minimum Output Current 10 % Dynamic Regulation, Loadstep 25% I out Pk Deviation 4% V out Settling Time 500 µs Voltage Trim Range ±10% Short Circuit / Overcurrent Protection Shutdown / Hiccup Current Limit Threshold Range, % of I out Rated 110 - 140% OVP Trip Range 115 - 140% V out Nom. OVP Type Second Control Loop, Self-Recovering TECHNICAL SPECIFICATIONS Voltage Range

24 VDC Nominal 16 - 36 VDC

48 VDC Nominal 36 - 72 VDC

Input Undervoltage Lockout <34V or <17V UVLO Hysteresis 1V Nom. Reflected Ripple 25 mA Input Reverse Voltage Protection Shunt Diode IES020ZG-A 10 20 30 40 50 60 70 80 90 100 LOAD % EFF. (36v) EFF. (48v) EFF. (72v) Output Input

Thermal Impedance Tolerances IES SERIES Inches: (Millimeters) Pin: ± 0.002 ± 0.05 Case: (Dimensions as listed unless otherwise specified.) Note: Thermal impedance data is dependent on many environmental factors. The exact thermal performance should be validated for specific application. Encapsulated Open Frame Modules Modules Natural Convection 15.4 °C/W 14.9 °C/W 100 LFM 12.2 °C/W 11.3 °C/W 200 LFM 9.3 °C/W 8.3 °C/W 300 LFM 7.4 °C/W 6.8 °C/W 400 LFM 6.4 °C/W 5.4 °C/W Pin Function 1+ V in 2- V in

3 No Pin

4 Shutdown

7 Trim

8 No Pin

9 No Pin

MODELS - (See the last page of Section for options.) t r a h C n o i t c e l e S l e d o M n i V ) s t l o V ( e g n a R n i V ) s t l o V ( * . x a M n i I ) s p m A ( t u o V ) s t l o V ( d e t a R t u o I ) s p m A ( e s i o N & e l p p i R ) V m ( k P - k P y c n e i c i f f E * * . p y T A - G Y 0 2 0 S E I A - E Z 3 1 0 S E I A - G Z 0 2 0 S E I 4 2 8 4 8 4 6 3 - 6 1 2 7 - 6 3 2 7 - 6 3 3 2 . 1 5 4 . 0 5 6 . 0 0 . 5 3 . 3 0 . 5 0 . 4 0 . 4 0 . 4 5 7 0 5 1 5 7 % 7 8 % 3 8 % 7 8 . r e w o p t u p t u o d e t a r m u m i x a m , e g a t l o v t u p n i m u m i n i m t a t n e r r u c t u p n i m u m i x a M * . t u p t u o d e t a r , n i V l a n i m o n t A * * High Density - Board Mounted Power Division Powering Communications and Technology

When ordering equipment options, use the following suffix information. Select the option(s) that you prefer and add them to the model number. Example ordering options are located below the options table. Example Options: HBS050ZG-ANT3V = HBS050ZG-A with negative logic, Lucent compatible trim, and 0.95” vertical heatsink. LES015YJ-3N = LES015YJ with optional trim and enable, negative logic. QBS066ZG-AT8 = QBS066ZG-A with Lucent compatible trim and 0.110” pin length. NUCLEAR AND MEDICAL APPLICATIONS - Power-One products are not authorized for use as critical components in life support systems, equipment used in hazardous environments, or nuclear control systems without the express written consent of the President of Power-One, Inc. TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the date manu- factured. Specifications are subject to change without notice. OPTIONS SUFFIX APPLICABLE SERIES REMARKS Negative Logic N HAS, HBD, HBS, HES, HLS, LES, TTL "Low" Turns Module ON QBS, QES, QLS, TES, TQD TTL "High" Turns Module OFF Lucent Compatible Trim T HAS, HBD, HBS, HES, HLS, QBS, QES, QLS Terminal Strip TS XWS, XWD, XWT Trim 1 IAS, LES Enable 2 IAD, IAS, LES, SMS Trim and Enable 3 IAS, LES Current Share 4 SMS Headerless Y Encapsulated EWS, IWS, OWS PIN LENGTH AND HEATSINK OPTIONS Standard Pin Length is 0.180" (4.6mm) 0.110" (2.8mm) Pin Length 8 All Units (Except SMS) 0.150" (3.8mm) Pin Length 9 All Units (Except SMS) 0.24" (6.1mm) Horizontal Heatsink 1H All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages) Includes Thermal Pad 0.24" (6.1mm) Vertical Heatsink 1V All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages) Includes Thermal Pad 0.45" (11.4mm) Horizontal Heatsink 2H All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages) Includes Thermal Pad 0.45" (11.4mm) Vertical Heatsink 2V All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages) Includes Thermal Pad 0.95" (24.1mm) Horizontal Heatsink 3H All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages) Includes Thermal Pad 0.95" (24.1mm) Vertical Heatsink 3V All Units (Except DIP, HLS, HLD, QLS, SIP, SM TLD, and TKD Packages) Includes Thermal Pad High Density - Board Mounted Power Division Powering Communications and Technology