IAM-92516 HP | Alldatasheet
Document overview
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Technical content
Features
DC = 5V @ 26 mA (T yp.) RF = 1.91 GHz, Pin RF = -10 dBm; LO = 1.7 GHz, PinLO = -3 dBm; IF = 210 MHz unlesss otherwise specified
- Lead-free Option Available
- High Linearity: 27 dBm IIP3
- Conversion Loss: 6 dB typical
- Wide band operation: 400-3500 MHz RF & LO input DC – 300 MHz IF output
- Fully differential or single ended operation
- High P1dB: 9 dBm typical
- Low current consumption: 5V@ 26 mA typical
- Excellent uniformity in product specifications
- Small LPCC 3.0 x 3.0 x 0.75 mm package
- MTTF > 300 years[1]
- MSL-1 and lead-free
- Tape-and-Reel packaging option available
Applications
- Frequency up/down converter for base station radio card, microwave link transceiver, and MMDS
- Modulation and demodulation for receiver and transmitter
- General purpose resistive FET mixer for other high linearity
Notes: Package marking provides orientation and identification “M3” = Device Code “X” = Month code indicates the month of manufacture Notes: 1. Refer to reliability datasheet for detailed MTTF data. 2. Conform to JEDEC reference outline MO229 for DRP-N Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model (Class A) ESD Human Body Model (Class 1A) Refer to Agilent Application Note A004R: Electrostatic Discharge Damage and Control.
Parameter Units Absolute Max.
- Operation of this device above any one of these
parameters may cause permanent damage.
- Assuming DC quiescent conditions and
- Board (package belly) temperature T B is
- Channel-to-board thermal resistance
TA = 25°C, DC =5V @ 26 mA, RF =1.91 GHz, PinRF = -10 dBm; LO =1.7 GHz, PinLO = -3 dBm, IF = 210 MHz unless otherwise specified.
- Standard deviation number is based on measurement of at least 500 parts from three non-consecutive wafer lots during the init ial characterization of
this product and is intended to be used as an estimate for distribution of the typical specification.
- Conversion loss, P1dB and NF data have de-embedded balun loss = 0.8 dB @ 210 MHz.
Figure 1. IAM-92516 Test Board.
Ordering Information
Part Number Devices per Container Container IAM-92516-TR1 1000 7" reel IAM-92516-TR2 5000 13" reel IAM-92516-BLK 100 antistatic bag LPCC 3x3 Package Dimensions PCB Layout and Stencil Design Refer to Agilent’s web site www.agilent.com/view/rf DIMENSIONS ARE IN MILLIMETERS 1GL 3X3-0.50 MIN. 0.80 2.90 1.70 2.90 1.70 0.20 NOM. 0.90 3.00 1.80 3.00 1.80 0.50 BSC. 0.02 0.20 REF. MAX. 1.00 3.10 1.90 3.10 1.90 0.05 REF. A D E e k Bottom View Top View Side View PACKAGE A3 A1 A E D 2 D2 E D k eINDEX AREA (D/2 X E/2) SEATING PLANE e
Notes: 1. Measured from centerline of sprocket hole to centerline of pocket 2. Cumulative tolerance of 10 sprocket holes is ±0.20 3. Other material available 4. All dimensions in millimeter unless otherwise stated CL 0.3±0.05 3.3±0.1 1.55±0.1 ∅1.6±0.1 R 0.3 Typical ∅1.55±0.05 1.75±0.1 5.5±0.1[1] 12.0±0.3 3.3±0.18.0±0.1
www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. November 1, 2004 5989-0975EN