I2C_AADJ

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Technical content

High accuracy and small size absolute pressure sensor with low current con- sumption

• Measure absolute pressure and temperature with high accuracy.  Built in low noise 24 bits ADC.  Digital control and output via I2C interface  Automatically power down non working circuit to minimize current consumption  Individual calibration parameters stored in OTP *. * One Time Programmable Non Volatile Memory Application Example
• Smart Phone  Activity monitor  Wearable device

Ordering Information

■ Standard Models with Surface Mounting Terminals RoHS compliant Structure Packaging Model Minimum Order Quantity Minimum Packing Unit 8-pin QFN Tape and Reel 2SMPB-01-01-TR 1,000 1,000 Embossed Carrier Tape 2SMPB-01-01 10 10

Ratings, Specifications, and Function ■ Use conditions and recommended operating conditions * Never use corrosive gases. ■ Absolute Maximum Ratings ■ Operating Ratings ■ Electrical Characteristics (At Ta = 25°C, VDD = 2.5 V, unless otherwise noted) * These characteristics are guaranteed by design. Note: Above table shows the characteristics without mounting board. Please confirm performance of this sensors in your application and use your own judgment to determine the appropriateness of using them in such application. Type of Pressure Absolute pressure Medium Air * Operating Pressure Range 30 kPa to 110 kPa Item Symbol Rating Unit Remark Power Supply Voltage Vddmax 4.0 V Input Voltage (other than power) Vmax -0.2 to Vopr+0.2 V Maximum Pressure Pmax 160 kPa Storage Temperature Tstr -40 to 85 °C with no condensation or icing Storage Humidity Hstr 10 to 95 %RH with no condensation Item Symbol Min. Typ. Max. Unit Remark Operating Voltage Vopr 2.25 2.5 3.6 V VDD Vddio 1.62 2.5 3.6 V VDDIO Operating Temperature Topr -40 - 85 °C Item Name Min. Typ. Max. Unit Remarks Average Current * Ihp - 9 - µA 1 sample/s High accuracy mode Current Consumption Idd - 500 610 µA Sleep Mode Current Consumption Isleep - 0.3 0.6 µA Measureable Pressure Range Popr 30 - 110 kPa Absolute Pressure Accuracy * Pabs1 -750 - 750 Pa 70 k to 110 kPa High accuracy mode Relative Pressure Accuracy * Prel1 - 6 - Pa 70 k to 110 kPa High accuracy mode rms Noise * Pnois - 2 - Pa 70 k to 110 kPa High accuracy mode Absolute Temperature Accuracy Tabs -2 - 2 °C Pressure Resolution * Pres - 0.06 - Pa High accuracy mode Temperature Resolution * Tres - 0.0002 - °C High accuracy mode Discharge time of VDD * Toff - 60 - sec Time@ VDD From 2.5 V to 0.01 V

■ I2C Characteristics (At Ta = 25°C, VDD = 2.5 V, unless otherwise noted) Power On Reset Note 1: When the power is turned on, please activate power on reset. For more information, please refer to the section of “Power on Reset” (p. 8). Note 2: About detailed I2C bus information, please refer to the I2C-bus specification and user manual presented by NXP. ■ Characteristics by Power Mode *1. Please see “I2C_SREQ: Sensor Request Register” (p. 13) for setting up power mode. *2. Please see “Execute timing chart” (p. 6) for meaning of waiting time. These characteristics are guaranteed by design. Item Name Standard Mode Fast Mode Unit Remark MIN. MAX. MIN. MAX. SCLK Clock Frequency fscl - 100 - 400 kHz Digital Input L (I2C) Vil2 -0.2 VDD×0.2 -0.2 VDD×0.2 V Digital Input H (I2C) Vih2 VDD×0.8 VDD+0.2 VDD×0.8 VDD+0.2 V Digital Output L (I2C) Vol2 0 0.4 0 0.4 V Pull-up Resister Rpullup 2.2 10 2.2 10 kΩ Capacitive Load Cb - 400 - 400 pF Power On Supply Startup Waiting Time Tpor - 0.8 - 0.8 msec Power On Start Up Time tstart - 2 - 2 msec Pulse Width of Asynchronous Reset trar 100 - 100 - µsec Mode *1 Waiting Time [msec] *2 Average Current @1 sample/s [µA] *2 rms Noise [Pa] *2 Low power mode 7 4 6 Standard mode 9 5 3 High accuracy mode 17 9 2 VDD Tpor 0.1 V 2.4 V

■ Block Diagram ■ Pin Description and Layout (Top view) * These pins are for test purpose only. Please leave open (Non-connect) while operating. ■ Typical Connection SCL SDA VDD GND VPPTESTA RST VDDIO Vsensor, Vcm Logic Block Vsensor I2C (100 kHz /400 kHz) N.V. Memory ΔΣ ADC VREF CLK Gen. POR Voltage Supply BG 4 1 DIGITAL FILTER PTAT Pin No. Symbol Description

1 VPP OTP write enable *

3 VDDIO Digital I/O Power

4 TESTA Analog out for test *

5 RST Asynchronous reset

6 SCL I2C clock

7 SDA I2C data

8 GND Ground

1 µF1 µF I2C Interface 4.7 kΩ 4.7 kΩ N.C. N.C. N.C.

Dimensions (Unit: mm) ■ Package Package Type: QFN (Quad Flat No-lead package) 8 pin Package Size: 3.8 mm × 3.8 mm × 1.0 mm (max.) ■ Outline Dimension ■ Mounting PAD Dimensions (Top View) : recommended ■ Marking structure @3.80±0.10 @2.90±0.10 @3.60±0.10 1.50 1.50 0.60 0.60 0.92±0.08 1 pin 1 pin index Terminal surface material : Gold Plate Top view Top view Top view Front view Bottom view 0.20±0.05 0.72±0.08 0.70 1.50 PCB Land Pad 1.50 0.70 PB0 1 (Type : Fixed) Sequence number (from 0 to 9, from A to Z (without O, Q, I)) Week of manufacture (from 01 to 5*) Year of manufacture (One digit at the end of the year)

■ Outline of Sensor Operation This page describes the typical operation after power on. 1. Wait until OTP initialization. (waiting for OTP automatically initialize finish) 2. Start-up ADC by setting up I2C_SETUP register - Write 02h in I2C_SETUP register. 3. Access COE_* registers and get calibration parameters. - Write 25h in I2C_AADJ register to enable OTP read operation. - Access COE_* registers and get calibration data. - After completion of read operation, write 65h to I2C_AADJ register. 4. Set up I2C_SREQ register to enable temperature measurement. 5. Get temperature data from I2C_TXD0 register after waiting time. 6. Set up I2C_SREQ register to enable pressure measurement. 7. Get pressure data from I2C_TXD0 register after waiting time. 8. Correct measured data with calibration data got at step 3. 9. Repeat 6 to 8. May need step 4, 5, and 8 when ambient temperature is changed. Execute timing chart ■ Outline of Sleep Operation Sleep operation of this sensor is controlled by start/stop internal clock.  System will automatically stop clock and sleep after completion of analog to digital conversion.  ADC and Digital Filter Block are powered down while sleeping.  Other part such as OTP (N.V.Memory) and I2C continue working during sleep, then can communicate outside via I2C interface.  ADC and Digital Filter Block can be awaken by I2C_SREQ bit 4 (ACTBIT) = “1”. I2C_TXD0 I2C_SREQI2C_SREQ Valid pressure data Valid PTAT data Select Pressure Read Pressure Select PTAT Read PTAT I2C Access Sleep_mode Internal Data Waiting time (Note) Default Is Sleep Wake up after I2C access Sleep Automatically I2C and OTP (N.V.Memory) are active even under sleep mode. Note: About waiting time, please refer to section “Characteristics by Power Mode.

■ Compensation of pressure and temperature  Read calibration data which are contained in internal NVM through I2C. These coefficients are used at compensation calculation below step (4) or step (5).  Read temperature data which are output by absolute pressure sensor through I2C. This temperature data is used at step (4) using coefficients of step (1) for compensation.  Read pressure data which are output by absolute pressure sensor through I2C. This pressure data is used at step (5) using coefficients of step (1) for compensation.  Using coefficients of step (1) and temperature data of step (2), the operator corrects temperature data by using following tem perature compensation formula. Tr = (Dt – ca) × ba0 = (Dt – ca) × ba × 2-19 Tr: Calculation result [1/256°C] Dt: 2SMPB-01 digital output of temperature (internal) [digit] ba: 2SMPB-01 calibration coefficient (16 bits read value of COE_PTAT2 Reg) ca: 2SMPB-01 calibration coefficient (24 bits read value of COE_PTAT3 Reg and COE_CEX Reg) : Read Values through I2C I/F : Calculate outside MCU START (1) Read Calibration Data from N.V Memory (2) Read Uncompensated Temperature Value (3) Read Uncompensated Pressure Value (4) Compensate Temperature Value (5) Compensate Pressure Value

• Using coefficients of step (1) and pressure data of step (3), the operator corrects pressure data by using following pressure compensa- tion formula. Pl = (Dp – cp) × bp0 = (Dp – cp) × bp × 2-19 Pl: Calculation result. This result is a relative value from 90 kPa. [Pa] Dp: 2SMPB-01 digital output of pressure [digit] bp: 2SMPB-01 calibration coefficient (16 bits read value of COE_PR2 Reg) cp: 2SMPB-01 calibration coefficient (24 bits read value of COE_PR3 Reg and COE_CEX Reg) The next by using the result data of step (4), the operator corrects pressure data temperature compensation. Ta 25 [°C] Po = Pl + 90000 + (Pl + 90000) (ct0 + bt0 × Tr) - 90000 = Pl + 90000 + (Pl + 90000) (ct × 2-18 + bt × 2-31 × Tr) - 90000 Ta < 25 [°C] Po = Pl + 90000 + (Pl + 90000) (ct20 + bt20 × Tr) - 90000 = Pl + 90000 + (Pl + 90000) (ct2 × 2-18 + bt2 × 2-31 × Tr) - 90000 Note: Temperature calibration of the pressure is calculated after converting to absolute pressure value because Pl is a relative value from 90 [kPa]. Po: Final compensated result. This result is a relative value from 90 kPa. [Pa] bt: 2SMPB-01 calibration coefficient (16 bits read value of COE_TEMP2 Reg) ct: 2SMPB-01 calibration coefficient (16 bits read value of COE_TEMP3 Reg) bt2: 2SMPB-01 calibration coefficient (16 bits read value of COE_TEMP22 Reg) ct2: 2SMPB-01 calibration coefficient (16 bits read value of COE_TEMP23 Reg)

■ Power on Reset Power-on reset circuit of 2SMPB-01 is using the CR delay. Therefore power-on reset is not working properly on below situations. At the time of the following circumstances when power is switched on again:  The potential of the VDD pin is not 0 volt.  The instantaneous voltage drop occurs in the VDD pin. Circuit diagram of a power-on reset and discharge characteristics of the VDD pin are as follow. When the power is turned on, the power-on reset should be activated. If the power-on reset is not working properly, it can be r eturned to normal operation by executing reset using the asynchronous reset pin, hardware reset or software reset. Example of reset using the asynchronous reset pin Note: Please fix the No.5 pin into Low during normal operation. Power On Reset Circuit Discharge characteristic of VDD Terminal (VDD Terminal OPEN at OFF) VDD [V] 02 0 4 0 6 0 80 time [sec] 0.5 1.5 2.5 Reset pulse Digital clock Reset circuit VDD L (0) H (VDD) 100 µsec 321 7 6 5 VDDVDDIO 1 µF1 µF I2C Interface 4.7 kΩ 4.7 kΩ N.C. N.C. Reset Pulse 2SMPB-01-01 Examples of the reset pulse (reset at the potential of High) Pulse width : 100 µsec. or more

Example of the software reset Sequence for searching the slave address No. Register Operation Write address I2C Order MCU Operation Explanation 1 0x05 Read (search slave address of module by I2C_FIND0) Note: Refer to the next section of sequence for searching the slave address Run for the searched slave address below. The searched slave address is shown as Y . 2 0x03 Write 0x10 Write 0x10 to slave address Y , resister address 0x03 Single operation Setting low power mode for for clear early

3 Waiting 20 msec or more

Find the slave address of the module using the I2C_FIND0 register Note: For details, see sequence for searching the slave ad- dress in next section Run for the slave address that searched, slave address is Y 5 0x04 Write 0x50 Write 0x50 to slave address Y , resister address 0x04 To ASIC forced mode of operation (internal clock starts oscillating) => It is required for writing to 0x07 address 6 0x0A Write 0x02 Write 0x02 to slave address Y , resister address 0x0A Normal initialization of Setup register 7 0x0C Write 0x00 Write 0x00 to slave address Y , resister address 0x0C Normal initialization of IOTEST register 8 0x08 Write 0x25 Write 0x25 to slave address Y , resister address 0x08 Change AADJ resister, transision to OTP read mode

9 Waiting 10 msec or more Waiting of transission to OTP read mode (Waiting time can

afford) 10 0x09 Write 0x22 Write 0x22 to slave address Y , resister address 0x09 Normal initialization of WAKEUP register 11 0x30 Read Read 16 bit from slave address Y , resister address 0x30, and save as Z upper 8 bits. Trimming value of W/T results acquisition Note: It is required OTP read mode on 8 Address of Z are 0x01, 0x02, 0x03...0x0F. 12 0x07 Write Write Z to slave address Y , resister adress 0x07 In particular, run the I2C communication less than 100 kHz. Henceforth, slave address return 0x70. 13 0x04 Write 0x10 Write 0x10 to slave address 0x70, resister address 0x04 Normal initialization of MODESEL register ASIC ; sleep mode, DSP ; nomal mode 14 0x08 Write 0x65 Write 0x65 to slave address 0x70, resister address 0x08 Normal initialization of AADJ register 15 0x03 Write 0x16 Write 0x16 to slave address 0x70, resister address 0x03 Single operation on high accuracy mode

16 Waiting 20 msec or more

17 Reset program of absolute pressure sensor module

subsequent Slave Address. Read 8 bits data from 0x05 Return Ack Result of Reading is 0x5A End Slave address 0x70 YES NO YES NO YES NO Slave address is 0x7F Abnormal termination, error code issue +1 on slave address

■ About I2C Slave Address The 2SMPB-01-01 module I2C slave address is shown below. Write Access : Please set LSB of slave address as “0”, and this byte is E0h (1110_0000b). (70h << 1 + WR (0)) Read Access : Please set LSB of slave address as “1”, and this byte is E1h (1110_0001b). (70h << 1 + RD (1)) ■ I2C Access Protocol Examples Symbol  START : START condition  STOP : STOP condition  Re-START : Re-START condition for Read  SACK : Acknowledge by Slave  MACK : Acknowledge by Master  MNACK : Not Acknowledge by Master (1) Register Write Access Protocol (Application: Addresses other than OTP Registers (20h - 34h) ) Example: Write data (8 bits) to address (03h) (2) Register Read Access Protocol (Application: Pressure/Temperature Data Register = I2C_TXD0 ) Example: Read pressure data (24 bits) from I2C_TXD0=address (00h). Pressure/Temperature data consists of 24 bits and output as three blocks of 8 bits. Data will be output as H, L and XL order and each 8 bits also output as MSB first. 24 bits data format is below. In order to read only data (L) or data (XL), use next protocol (3). Bit bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 Add [6] Add [5] Add [4] Add [3] Add [2] Add [1] Add [0] R/W V a l u e 11100001 / 0 Data Read Data H Read Data L Read Data XL SDA SCLK 76543210 765432 10 76543210 SACK Word Address => 03h Address Write Data => 1Ch WR data Device Address + W/R => E0h (70h + “WR”) START SACK SACK SACK STOP 76543210 76543210 76543210 76543210 76543210 76543210 START SACK SACKSDA SCLK SDA SCLK Device Address + W/R E0h (70h + “WR”) Word Address 00h Address Re-START SACK MACK MACK Device Address + W/R => E1h ( 70h + “RD”) Read Data (H, 8 bits) 12h Read data MNACK STOP Read Data (L, 8 bits) 34h Read data Read Data (XL, 8 bits) 56h Read data

(3) Register Read Access Protocol (Application: Addresses other than OTP Registers (20h - 34h), I2C_TXD0.) Example: Read data (8 bits) from I2C_SREQ = address (03h) Each 8 bits data will be output as MSB first. (4) Register Read Access Protocol (Application: OTP Registers (20h - 34h)) Example: Read calibration data (16 bits) from COE_PR2 = address (22h). Set VBGACT bit “L ” of I2C_AADJ before this operation. Each 8 bits data will be output as MSB first. ■ I2C Register Register Name Address Bits R/W Default Contents I2C_TXD0 00h 8 bits R/- 00h Data Register MSB (24-17 bits) I2C_TXD1 01h 8 bits R/- 00h Data Resister LSB (16-9 bits) I2C_TXD2 02h 8 bits R/- 00h Data Resister XLSB (8-1 bits) I2C_SREQ 03h 8 bits R/W 00h Sense Request I2C_AADJ 08h 8 bits R/W 65h OTP Read Register I2C_SETUP 0Ah 8 bits R/W 00h Setup Register COE_PR2 22h 16 bits R/- 00h Pressure Linearity Calib.2: 1 st Coefficient COE_PR3 24h 16 bits R/- 00h Pressure Linearity Calib.3: offset COE_TEMP2 26h 16 bits R/- 00h Temp Calibration 2: 1 st Coefficient COE_TEMP3 28h 16 bits R/- 00h Temp Calibration 3: offset COE_TEMP22 2Ah 16 bits R/- 00h Temp Calibration 2-2: 1 st Coefficient-2 COE_TEMP23 2Ch 16 bits R/- 00h Temp Calibration 2-3: offset-2 COE_PTAT2 2Eh 16 bits R/- 00h PTAT Linearity Calib.2: 1 st Coefficient COE_PTAT3 32h 16 bits R/- 00h PTAT Linearity Calib.3: offset COE_CEX 34h 16 bits R/- 00h Pressure & PTAT Linearity extend bits Bit [15:8] => COE_PR3 extend bit [23:16] Bit [7:0] => COE_PTAT3 extend bit [23:16] 76543210 76543210 76543210 76543210 SACK Re-START SACK MNACKSDA SCLK START SACK STOP Device Address + W/R => E0h (70h + “WR”) Word Address => 03h Device Address + W/R => E1h (70h + “RD”) Read Data (L side 8 bits) => 35h RD data 76543210 76543210 76543210 76543210 76543210 SDA SCLK Re-START SACK MACK MNACK STOP SDA SCLK START SACK SACK Device Address + W/R => E0h (70h + “WR”) Word Address => 22h Address Device Address + W/R => E1h (70h + “RD”) Read Data (H, 8 bits) => 12h Read Data Read Data (L, 8 bits) => 34h Read Data

I2C_TXDx: Sensor Data TXD0 (A ddress = 00h), TXD1 (Address = 01h) or TXD2 (Address = 02h) ADC output is stored with 22 to 24bit accuracy which depend on power mode. Data can be retrieved as 24 bits by one operation. If data consists of less than 24 bits, additional “0” will be filled as show n in the table below. The data are read out in an unsigned. I2C_TXD0 address can be accessed by memory map method. I2C_SREQ: Sensor Request Register (Address = 03h) Note: Proper operation will not be assured wit h bit combination not specified above. I2C AADJ: OTP Read Register (Address = 08h) Note: Proper operation will not be assured wit h bit combination not specified above. Bit bit23 bit22 bit21 ... bit2 bit1 bit0 R/W R/- R/- R/- ... R/- R/- R/- Initial 000. .. 000 Bit 232 22 1. .. 3 2 1 0 22 bits data (Low power mode) valid valid valid ... valid valid 0 0 24 bits data (Standard & High Accuracy mode) valid valid valid ... valid valid valid valid Bit bit7b it6b it5b it4b it3b it2b it1b it0 R/W Resv Resv R/- -/W R/W R/W R/W R/W Initial 00000000 Bit7 Reserved Reserved. Set “0” when write register I2C_SREQ Bit6 Reserved Reserved. Set “0” when write register I2C_SREQ Bit5 Sleep state (SLEEPST) Indicate operation mode while reading. 1: sleep mode 0: operating mode Set “0” when write register I2C_SREQ Bit4 Wake up request (ACTREQ) Control sleep mode. Set “1” when write register I2C_SREQ. 1: Awaken the system 0: Not awaken the system Bit3 to 1 Mode select Select measurement mode. “0_0_0” Low power mode “0_1_0” Standard mode “0_1_1” High accuracy mode Bit0 Sensor select (PTATSEL) Sensor Input Select 1: PTAT 0: Pressure (Default) Bit bit7b it6b it5b it4b it3b it2b it1b it0 R/W Resv R/W Resv Resv Resv Resv Resv Resv Initial 01100101 Bit7 Reserved Reserved. Set “0” when write register I2C_ADDJ Bit6 OTP Read Mode (VBGACT) 0: OTP Read Enabled 1: OTP Read Disabled (Default) Bit5 to 4 Reserved Reserved. Set “1_0” when write register I2C_ADDJ. Bit3 to 2 Reserved Reserved. Set “0_1” when write register I2C_ADDJ. Bit1 to 0 Reserved Reserved. Set “0_1” when write register I2C_ADDJ.

I2C_SETUP: Set Up Register (Address = 0Ah) Note 1: This set-up is required to start ADC operation. Note 2: Proper operation will not be assured with bit combination not specified above. COE_PR*: Calibration Data Register for Pressure Linearity (OTP Register) (Address = 22h to 24h) Read only. Calibration data is stored. The data are read out in an unsigned. I2C_AADJ bit6 (VBGACT bit) should be set to “0” to enable read operation of these OTP registers. COE_TEMP*: Calibration Data Register fo r Temperature Correction of Pressure (OTP Register) (Address = 26h to 2Ah) Read only. Calibration data is stored. The data are read out in an unsigned. I2C_AADJ bit6 (VBGACT bit) should be set to “0” to enable read operation of these OTP registers. COE_PTAT*: Calibration Data Register for PTAT Linearity (OTP Register) (Address = 2Ch to 32h) Read only. Calibration data is stored. The data are read out in an unsigned. I2C_AADJ bit6 (VBGACT bit) should be set to “0” to enable read operation of these OTP registers. COE_CEX: Calibration Data Register for Extend Bits for PR3 & PTAT3 (OTP Register) (Address = 34h) Read only. Calibration data is stored. The data are read out in an unsigned. Bit15 to 8: These bits are extend bits of COE_PR3 register. Bit7 to 0: These bits are extend bits of COE_PTAT3 register. I2C_AADJ bit6 (VBGACT bit) should be set to “0” to enable read operation of these OTP registers. Bit bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 R / W R e s vR e s vR e s vR e s vR e s vR e s vR / W R / W Initial 00000010 bit7 to 2 Reserved Reserved. Set “0” when write register I2C_SETUP bit1 to 0 Setup ADC Power Up Mode “1_0”: Start ADC Setup (Default) Bit bit15 bit14 bit13 ... bit3 bit2 bit1 bit0 R/W R/- R/- R/- ... R/- R/- R/- R/- Initial 000. .. 0000 Bit bit15 bit14 bit13 ... bit3 bit2 bit1 bit0 R/W R/- R/- R/- ... R/- R/- R/- R/- Initial 000. .. 0000 Bit bit15 bit14 bit13 ... bit3 bit2 bit1 bit0 R/W R/- R/- R/- ... R/- R/- R/- R/- Initial 000. .. 0000 Bit bit15 bit14 bit13 ... bit3 bit2 bit1 bit0 R/W R/- R/- R/- ... R/- R/- R/- R/- Initial 000. .. 0000

■ 2SMPB-01-01-TR / Tape and Reel Configuration of shipment Taping Emboss pitch 4 mm type & tape width 12 mm type Model Packaging Minimum Order Quantity Minimum Packing Unit 2SMPB-01-01-TR Tape and Reel 1,000 1,000 2SMPB-01-01 Embossed Carrier Tape 10 10 Packaging Embossed Carrier Tape Quantity SPQ 1,000 pcs Max. 5,000 pcs/reel 1 reel / 1 Interior box Reel model EIAJ reel (330 mm dia.) Insert method see below Core side of the reel Core side of the reel Cover Tape (no Sensor) (The same dimensions as the embossed carrier tape) Cover Tape (no Sensor) Cover Tape Direction to pull out Trailer (no Sensor) 500 - 550 mm Embossed Carrier Tape Sensor housing unit Leader (no Sensor) 540 - 590 mm 540nm or more540 mm - 550 mm 1 pin mark in the upper left

■ 2SMPB-01-01 / Embossed Carrier Tape Taping To ensure the reel for small shipment, the tape will be cut into multiple units of 10 pieces length. Individual packing box These are chosen the packaging box following two patterns.  Packing small reel cut type in the box with air cap.  Packing the reel cut products shaped ring in the box with air cap. (1) (2) (4) (6) (5) (4) (3) (7) No. Item (1) EIAJ reel (2) Desiccant (3) Reel band (4) Identification tag (5) Humidity indicator (6) Aluminum bag (7) Individual packing box Embossed Carrier Tape Sensor housing unit (10 pcs) × n Cover Tape

Recommended Soldering Method ■ Soldering method air reflow (Max. 2 times) ■ Condition of Temperature Max. 260°C, within 10 seconds ■ Recommended Soldering Method Temperature profile conditions of reflow soldering should be set as shown in the below table, and then confirm that actual cond itions coincide with the conditions shown in the table.  We recommend a thickness of 150 to 200 µm for the solder cream.  Since the pressure sensor chip is exposed to atmosphere, cleaning fluid shall not be allowed to enter inside the sensor’s case.  We recommend that the recommended mounting PAD dimensions should be used for the land pattern. Item Preheating (T1 to T2, t1) Soldering (T3, t2) Peak value (T4) Terminal 150°C to 180°C 120 s max. 230°C min. 30 s max. 250°C max. Upper surface of case - - 255°C max. Time (s) Preheating Soldering t1 t2 Temperature (°C)

(1) Only air can be used as pressure media on the product directly. It is prohibited to use pressure media including corrosive gases (e.g. organic solvents gases, sulfur dioxide and hydrogen sulfide gases), fluid and any other foreign materials. (2) The product are not water proof. The product shall be kept dry in use including the sensor port. (3) The product shall not be used under dew-condensing conditions. Frozen fluid on sensor chips may cause fluctuation of sensor out - put and other troubles. (4) The product shall be used within rated pressure. Usage at pressure out of the range may cause breakage. (5) The product may be damaged by static electricity. Charged materials (e.g. a workbench and a floor) and workers should provide measures against static electricity, including ground connection. (6) Overpowering pins may deform terminals and detract solder abilities of sensor terminals. The product shall not be dropped and han- dled roughly. (7) The product shall not be used under dusty or damp condition. (8) Please connect the sensor terminals according to the connection diagram. (9) The product shall not be used under high-frequency vibration including ultrasonic wave. (10) This product uses the elastic adhesive for bonding the lid, so do not add excessive stress to the lid. (11) If you use other conditions described in this document, please check yourself in advance. Environmental conditions for transport and storage (1) The product shall not be kept with corrosive gases (e.g. organic solvents gases, sulfur dioxide and hydrogen sulfide gases). (2) The product are not water proof. The product shall be kept dry during storage. (3) By condition of the place and storage period, there are cases that strength of outer boxes may be degraded. Please use the product in order. (4) For this product, please keep away from direct sunlight or ultraviolet rays. (5) The product shall be kept in appropriate conditions of temperature and humidity. (6) Sometimes the color of terminals of the product may change depending on the conditions. It is not covered under warranty. (7) The product shall not be kept under dusty or damp condition. Note: Specifications in this document are subject to change without notice. Precautions for Correct Use

• Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product.
• Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad systems, aviation systems, vehicles, combustion systems, medical e quipment, amusement machines, safety equipment, and other systems or e quipment that may have a serious influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the prod uct provide a margin of safety for the system or equipment, and be sure to provide the system or equipment with double safety mechanisms. OMRON Corporation Electronic and Mechanical Components Company Contact: www.omron.com/ecb Cat. No. A233-E1-03 0615(0614)(O) Note: Do not use this document to operate the Unit.