HZ0805D152R-10 LSTD | Alldatasheet
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PHYSICAL_DIMENSIONS: = DOCUMENT [079] ; [.008] ELECTRICAL CHARACTERISTICS: B 1.25 [.049] + 0.20 [.008] A 7 © 100MHe DCR Roles Past Lozo} F025] re a c na{ | Z vs FREQUENCY Be 1875 | 0.400 | 400 ma ‘000 IMPEDANCE UNDER DC BIAS NOTES: UNLESS OTHERWISE SPECIFIED 0 fe D 1. TAPED AND REELED per CURRENT EIA
1400 Cas SPECIFICATIONS 7” REELS, 4000 PCS/REEL,
Dra == 5 PAPER TAPE. ~ seo sma \\ 2. TERMINATION FINISH IS 100% TIN. J vo 20 k 3. COMPONENTS SHOULD BE ADEQUATELY 4 sore t PREHEATED BEFORE SOLDERING. = 4. OPERATING TEMP. RANGE: —40°C~+125°C 400 ‘ (INCLUDING SELF—HEATING) Saad : LAND PATTERNS FOR REFLOW SOLDERING RECOMMENDED SOLDERING CONDITIONS i ~ 10 100 1000 0.66 REFLOW SOLDERING -F[.026] 255.4 PRE-HEATNG __ SOLDERING 256 510 FREQUENCY (MHz) 2 (ao) {_] NATURAL IZ| , R, AND X vs. FREQUENCY = ey ee 0 ‘COOLING vos ilo Siw | ‘ee [.058] wo, BD 1400 \\ p (268, Ss = Zw 3.93 | as cmos wh acim soos zm [127] = ow [For wave soldering, add 0.763 [.030] to this dimension. ]
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