HVC SEI | Alldatasheet

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  • Manufacturer or author: LCLOUD
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Technical content

Rev Date: 11/18/2020 1 www.seielect.com This specification may be changed at any time without prior notice marketing@seielect.com Please confirm technical specifications before you order and/or use. HVC Series High Voltage Thick Film Chip Resistor Stackpole Electronics, Inc. Resistive Product Solutions Features:

  • Ohmic values to 50G
  • Available with wire bondable terminations
  • Tight tolerances to 0.1%
  • Utilizes fine film resistor deposition technology
  • Superior pulse handling capabilities
  • Low TCR to 25 ppm/ºC
  • Low VCR to 1 ppm/volt
  • Very low noise
  • Ultra-high stability
  • Custom sizes available
  • Higher (up to 1TΩ) or lower resistance values may be available (contact Stackpole)
  • Standard HVC parts are unmarked
  • RoHS compliant and halogen free
  • REACH compliant Electrical Specifications Mechanical Specifications H Body Height (Max.) HVC0603 HVC0805 Top Termination b Bottom Termination W Body Width UnitType / Code aL Body Length ±50 10K - 100M ±100 ±200 10K - 10G 10K - 50G ±50 ±100 ±200 10K - 50G ±25 1M - 100M ±50 100K - 100M 100K - 100M ±100 ±200 10K - 50G ±25 1M - 100M ±50 100K - 100M 100K - 100M ±100 ±200 10K - 50G ±25 1M - 100M ±50 100K - 100M 100K - 500M ±100 ±200 ±25 1M - 100M ±50 100K - 100M 100K - 500M ±100 ±200 Proper terminal isolation is required to achieve the voltage ratings for each given size. (1) The continuous maximum voltage applied cannot exceed the maximum power rating and is ohmic value dependent. Note: Other case sizes and tolerances are available. HVC3512 3 3500 HVC2010 HVC2512 1 2000 2 3000 HVC1206 0.33 HVC0805 0.2 1500 Type / Code TCR (ppm/ºC) 600 10K - 100M 10K - 500M 10K - 1G HVC0603 0.06 400 Power Rating (W) @ 70ºC Maximum Working Voltage (V) (1) 10K - 100M 10K - 500M 10K - 1G 10K - 100M 10K - 500M 1M - 500M 100K - 1G 100K - 10G 100K - 50G10K - 10G - 10K - 500M 10K - 1G 1M - 100M 100K - 500M 10K - 1G 1M - 100M 100K - 500M 10K - 10G 10K - 1G 10K - 10G 1M - 500M 100K - 1G 10K - 10G 100K - 10G 100K - 50G 10K - 100M 10K - 100M 10K - 500M 10K - 1G 10K - 100M Ohmic Range (Ω) and Tolerance 10K - 500M 10K - 1G 10K - 500M 10K - 1G10K - 10M 10K - 10M 10K - 1G 10K - 10G 10K - 1G

Rev Date: 11/18/2020 2 www.seielect.com This specification may be changed at any time without prior notice marketing@seielect.com Please confirm technical specifications before you order and/or use. HVC Series High Voltage Thick Film Chip Resistor Stackpole Electronics, Inc. Resistive Product Solutions Performance Characteristics Power Derating Curve: Recommended Pad Layouts Mechanical Specifications (cont.) H Body Height (Max.) L W a b UnitBody Length Body Width Top Termination Bottom Termination HVC3512 HVC2010 HVC2512 Type / Code Test Typical Performance Short Time Overload 0.1% Load Life 0.1% Temperature Cycle 0.1% Moisture Resistance 0.1% Shock 0.05% Vibration 0.05% Dielectric Withstanding Voltage 0.05% Resistance to Soldering Heat 0.05% Parameter Typical TCR measured from 25°C to 75°C 10X rated wattage Consult Stackpole for custom pulse applications Measured at 100V Consult Stackpole for custom test voltages Operating temperature range is -55ºC to +150ºC Pulse Capability Resistance Value Type / Code A B C Unit 0.031 0.083 0.035 inches 0.80 2.10 0.90 mm 0.047 0.118 0.051 inches 1.20 3.00 1.30 mm HVC0603 HVC0805

Rev Date: 11/18/2020 3 www.seielect.com This specification may be changed at any time without prior notice marketing@seielect.com Please confirm technical specifications before you order and/or use. HVC Series High Voltage Thick Film Chip Resistor Stackpole Electronics, Inc. Resistive Product Solutions Recommended Solder Profile This information is intended as a reference for solder profiles for Stackpole resistive components. These profiles should be compatible with most soldering processes. These are only recommendations. Actual numbers will depend on board density, geometry, packages used, etc., especially those cells labeled with “*”. 100% Matte Tin / RoHS Compliant Terminations Soldering iron recommended temperatures: 330°C to 350°C with minimum duration. Maximum number of reflow cycles: 3. Wave Soldering Description Maximum Recommended Minimum Preheat Time 80 seconds 70 seconds 60 seconds Temperature Diff. 140°C 120°C 100°C Solder Temp. 260°C 250°C 240°C Dwell Time at Max. 10 seconds 5 seconds * Ramp DN (°C/sec) N/A N/A N/A Temperature Diff. = Defference between final preheat stage and soldering stage. Convection IR Reflow Description Maximum Recommended Minimum Ramp Up (°C/sec) 3°C/sec 2°C/sec * Dwell Time > 217°C 150 seconds 90 seconds 60 seconds Solder Temp. 260°C 245°C * Dwell Time at Max. 30 seconds 15 seconds 10 seconds Ramp DN (°C/sec) 6°C/sec 3°C/sec * Recommended Pad Layouts (cont.) Type / Code A B C Unit 0.087 0.165 0.063 inches 2.20 4.20 1.60 mm 0.138 0.240 0.110 inches 3.50 6.10 2.80 mm 0.150 0.315 0.138 inches 3.80 8.00 3.50 mm HVC2010 HVC2512 HVC1206

Rev Date: 11/18/2020 4 www.seielect.com This specification may be changed at any time without prior notice marketing@seielect.com Please confirm technical specifications before you order and/or use. HVC Series High Voltage Thick Film Chip Resistor Stackpole Electronics, Inc. Resistive Product Solutions RoHS Compliance Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the v arious regulatory requirements now prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substance s” (RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the availability o f our compliant components. All our standard part numbers are compliant to EU Directive 2011/65/EU of the European Parliament a s amended by Directive (EU) 2015/863/EU as regards the list of restricted substances. “Conflict Metals” Commitment We at Stackpole Electronics, Inc. are joined with our industry in opposing the use of metals mined in the “conflict region” of the eastern Democratic Republic of the Congo (DRC) in our products. Recognizing that the supply chain for metals used in the electronics industry is very complex, we work closely with our own suppliers to verify to the extent poss ible that the materials and products we supply do not contain metals sourced from this conflict region. As such, we are in compliance with the requirements of Dodd-Frank Act regarding Conflict Minerals. Compliance to “REACH” We certify that all passive components supplied by Stackpole Electronics, Inc. are SVHC (Substances of Very High Concern) free and compliant with the requirements of EU Directive 1907/2006/EC, “The Registration, Evaluation, Authorization and Restriction of Chemicals”, otherwise referred to as REACH. Contact us for complete list of REACH Substance Candidate List. RoHS Compliance Status HVC High Voltage Thick Film Surface Mount Chip Resistor SMD YES(1) 100% Matte Sn ("T") Always Always Note (1): RoHS Compliant by means of exemption 7c-I. Standard Product Series

Description

Mfg. Effective Date (Std Product Series) Lead-Free Effective Date Code (YY/WW) Recommended Lead Free Resistor Reflow Profile

Rev Date: 11/18/2020 5 www.seielect.com This specification may be changed at any time without prior notice marketing@seielect.com Please confirm technical specifications before you order and/or use. HVC Series High Voltage Thick Film Chip Resistor Stackpole Electronics, Inc. Resistive Product Solutions 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 H V C B 2 5 1 2 F K C 1 0 M 0 Environmental Policy It is the policy of Stackpole Electronics, Inc. (SEI) to protect the environment in all localities in which we operate. We continually strive to improve our effect on the environment. We observe all applicable laws and regulations regarding the protection of our environment and all requests related to the environment to which we have agreed. We are committed to the prevention of all forms of pollution. How to Order Resistance Value Code Description Code W Code Tol Code Description Size Quantity Code ppm 0603 0.06 B 0.1% 0603, 0805 5000 E 25 0805 0.2 C 0.25% 1206 4000 C 50 HVCG Wire bondable (gold) 1206 0.33 D 0.5% 2010 4000 D 100 10 Kohm = 10K0 Solderable single surface 2010 1 F 1% 2512 2000 L 200 1 Mohm = 1M00 (Sn/Pb) 2512 2 G 2% 7" Reel - Paper Tape 0603, 0805, 1206 1000 M 300 10 Gohm = 10G0 Solderable single surface 3512 3 J 5% 7" Reel - Plastic Tape 2010, 2512, 3512 1000 (100% matte tin) K 10% 7" Reel - Paper Tape 0603, 0805, 1206 500 M 20% 7" Reel - Plastic Tape 2010, 2512, 3512 500 B Bulk All Sizes 1000 T TCRPackaging 7" Reel - Plastic Tape K HVCZ HVCB Solderable wraparound (100% matte tin) Product Series Tolerance HVCS Size Four characters with the multiplier used as the decimal holder.7" Reel - Paper Tape D