HV5812

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Document overview

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• PDF pages: 16

Technical content

Features

• H V C M O S® Technology for High Performance
• Operating Voltage of up to 80V
• High-speed Source Driver
• 5V CMOS Logic Circuitry
• Up to 5 MHz Data Input Rate
• Excellent Noise Immunity
• Flexible High-voltage Supplies

Applications

• Display Driver General Description The HV5812 is a 20-channel serial-input vacuum fluore scent display driver. It combines a 20-bit CMOS shift register, data latche s and control circuitry with high-voltage MOSFET outputs. The HV5812 is primari ly designed for vacuum fluorescent displays. The CMOS shift register and latches allow direct interfacing with mi croprocessor-based system s. Data input rates are typically over 5 MHz with 5V logic supply. Especially useful for interdigit blanking, the blanking input disables the output source drives and turns on the sink drivers. Using with TTL may require external pull-up resistors to ensure an input logic high. Package Type 28-lead PDIP (Top view) See Table 2-1 for pin information. 28 1 1 28 4 26 1 28 28-lead PLCC (Top view) 28-lead SOW (Top view) s 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid

DS20005629A-page 2  2016 Microchip Technology Inc. Functional Block Diagram

 2016 Microchip Technology Inc. DS20005629A-page 3 HV5812

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings† Power Dissipation: † Notic e: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Parameter Sym. Min. Typ. Max. Unit Conditions Supply Voltage VDD 4.5 — 5.5 V Supply Voltage VPP 20 — 80 V Operating Junction Temperature TJ –40 — +125 °C DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Over recommended operating conditions; TA = 25°C unless otherwise indicated. Parameter Sym. Min. Typ. Max. Unit Conditions Output Leakage Current IDSS — –5 –15 µA VOUT = 0V, TA = +70°C High-level Output VOH HVOUT 78 78.5 — V IOUT = –25 mA, VPP = 80V,  TJ = +25°C 77 78 — IOUT = –25 mA, VPP = 80V,  TJ = +125°C DATA OUT 4.5 4.7 — V IOUT = –200 µA, VDD = 5V Low-level Output VOL HVOUT — 1.5 3 V IOUT = 1 mA, TJ = +25°C, VDD = 5V — 2.3 4 IOUT = 1 mA, TJ = +125°C, VDD = 5V DATA OUT — 200 250 V IOUT = +200 µA, VDD = 5V Output Pull-down Current ISINK 2 3.5 — mA VOUT = 5V to VPP, VDD = 5V High-level Logic Input Voltage VIH 3.5 — 5.3 V VDD = 5V Low-level Logic Input Voltage VIL –0.3 — 0.8 V High-level Logic Input Current IIH — 0.05 0.5 µA VIN = VDD, VDD = 5V Low-level Logic Input Current IIL — –0.05 –0.5 µA VIN = 0.8V, VDD = 5V Quiescent VDD Supply Current IDDQ — 100 300 µA All outputs high, VDD = 5V — 100 300 All outputs low, VDD = 5V Quiescent VPP Supply Current IPPQ — 10 100 µA All outputs high, no load — 10 100 All outputs low, no load

AC ELECTRICAL CHARACTERISTICS Electrical Specifications: Over recommended operating conditions; TA = 25°C unless otherwise indicated. Parameter Sym. Min. Typ. Max. Unit Conditions Blanking to Output Delay tPHL — 2000 — ns CL = 30 pF, 50% to 50%, VDD=5V tPLH — 1000 — Output Fall Time tr — 1450 — ns CL = 30 pF, 90% to 10%, VDD = 5V Output Rise Time tf — 650 — ns CL = 30 pF, 10% to 90%, VDD = 5V Data Set-up Time tSU 75 — — ns See Timing Waveforms. Data Hold Time tH 75 — — ns See Timing Waveforms. Minimum Data Pulse Width tPWD 150 — — ns See Timing Waveforms. Minimum Clock Pulse Width tPWCLK 150 — — ns See Timing Waveforms. Minimum Time between Clock Acti vation and Strobe tCKS 300 — — ns See Timing Waveforms. Minimum Strobe Pulse Width tPWS 100 — — ns SeeTiming Waveforms. Typical Time between Strobe Act ivation and Output Transition tSTO — 500 — ns See Timing Waveforms. Maximum Clock Frequency fCLK — 8 — MHz TJ = +25°C, VDD = 5V — 5 — TJ = +125°C, VDD = 5V TEMPERATURE SPECIFICATIONS Parameter Sym. Min. Typ. Max. Unit Conditions TEMPERATURE RANGE Operating Junction Temperature TJ –40 — +125 °C Storage Temperature TS –55 — +150 °C PACKAGE THERMAL RESISTANCE 28-lead PDIP  JA — 43 — °C/W 28-lead PLCC JA — 48 — °C/W 28-lead SOW JA — 55 — °C/W HV5812 DS20005629A-page 4  2016 Microchip Technology Inc.

 2016 Microchip Technology Inc. DS20005629A-page 5 HV5812 Timing Waveforms CLK DATA IN STROBE BL HVOUT tPWCLK tPWS tPHL tf tr tPLH tSU 50% 90% 10% 50% 10% th tPWD tCKS tSTO 90% 50% 50% 50% 50% 50% 50% VIH VIL VIH VIL VIH VIL VIH VIL VOH VOL 50% 50%

DS20005629A-page 6  2016 Microchip Technology Inc.

2.0 PIN DESCRIPTION

The details on the pins of HV5812 28-lead PDIP , 28-l ead PLCC and 28-lead SOW are listed on Table 2-1. Refer to Package Types for the location of pin TABLE 2-1: PIN FUNCTION TABLE Pin Number Pin Name Description

1 VPP High-voltage power rail

2 Data Out Serial data output. Data output for cascading to the data input of the next device.

3 HVOUT20 High-voltage output

4 HVOUT19 High-voltage output

5 HVOUT18 High-voltage output

6 HVOUT17 High-voltage output

7 HVOUT16 High-voltage output

8 HVOUT15 High-voltage output

9 HVOUT14 High-voltage output

10 HVOUT13 High-voltage output

11 HVOUT12 High-voltage output

12 HVOUT11 High-voltage output

13 BLANKING Blank

14 GND Logic and high-voltage ground

15 CLOCK Data shift register clock

16 STROBE Strobe

17 HVOUT10 High-voltage output

18 HVOUT9 High-voltage output

19 HVOUT8 High-voltage output

20 HVOUT7 High-voltage output

21 HVOUT6 High-voltage output

22 HVOUT5 High-voltage output

23 HVOUT4 High-voltage output

24 HVOUT3 High-voltage output

25 HVOUT2 High-voltage output

26 HVOUT1 High-voltage output

27 Data In Serial data input

28 VDD Low-voltage logic power rail

 2016 Microchip Technology Inc. DS20005629A-page 7 HV5812

3.0 FUNCTIONAL DESCRIPTION

Follow the steps below to power up and power down the HV5812: POWER-UP AND POWER-DOWN SEQUENCE Power-up Power-down Step Description Step Description 1 Connect ground. 1 Remove VPP. 2 Apply VDD. 2 Remove all inputs. 3 Set all inputs (Data, CLK, etc.) to a known state 3 Remove VDD. 4 Apply VPP. (Note 1) 4 Disconnect ground. Note 1: Th e VPP should not drop below VDD during operation. FUNCTION TABLE (Note 1) Serial Data Input Clock Inp ut Shift Register Contents Serial Dat a Output Strobe Inp ut Latch Contents Blanking Output Contents Note 1: L = Low logic level H = High logic level X = Irrelevant  P = Present state R = Previous state VDD INPUT GND VPP L/T GND HVOUT Logic Inputs GND Data Out Logic Data Output High Voltage Outputs VDD FIGURE 3-1: IO Circuits.

DS20005629A-page 8  2016 Microchip Technology Inc.

4.0 PACKAGE MARKING INFORMATION

4.1 Packaging Information

Legend: XX...X Product Code or Cust omer-specific information Y Year code (last digit of calendar year)  YY Year code (last 2 digits of calendar year)  WW Week code (week of January 1 is week ‘01’)  NNN Alphanumeric traceability code  Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo. XXXXXXX e3 YYWWNNN e3HV5812WG 1678896 28-lead SOW Example 28-lead PLCC Example XXXXXXXXX YYWWNNNe3 HV5812PJ 1611231e3

28-Lead PDIP (.600in Row Spacing) Package Outline (P) 1.565x.580in body, .250in height (max), .100in pitch Note 1 (Index Area) D L A1 A A2 Seating Plane e D1D1 E A A Side View Top View View A - A eA eB b View B View B Note: 1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEH DPROGHGPDUNLGHQWL¿HU DQHPEHGGHGPHWDOPDUNHU RU DSULQWHGLQGLFDWRU Symbol A A1 A2 b b1 D D1 E E1 e eA eB L Dimension (inches) MIN .100 BSC .600 BSC .600* .115 -('(&5HJLVWUDWLRQ069DULDWLRQ$%,VVXH%-XQH 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ ‚7KLVGLPHQVLRQGLIIHUVIURPWKH-('(&GUDZLQJ Drawings not to scale.  2016 Microchip Technology Inc. DS20005629A-page 9 HV5812

28-Lead PLCC Package Outline (PJ) Symbol A A1 A2 b b1 D D1 E E1 e R Dimension (inches) MIN .050 BSC .025 JEDEC Registration MS-018, Variation AB, Issue A, June, 1993. Drawings not to scale. .150 MAX .048/.042 x 45O

075 MAX

D E1 E Top View View A A A2A1 Seating Plane e Note 1 (Index Area) .056/.042 x 45O Base Plane .020 MIN b View A Horizontal Side View Vertical Side View Note 2 .020max (3 Places) R Notes: 1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEH DPROGHGPDUNLGHQWL¿HU DQHPEHGGHGPHWDOPDUNHU RU a printed indicator. 2. $FWXDOVKDSHRIWKLVIHDWXUHPD\\YDU\\ HV5812 DS20005629A-page 10  2016 Microchip Technology Inc.

28-Lead SOW (Wide Body) Package Outline (WG) 17.90x7.50mm body, 2.65mm height (max), 1.27mm pitch Symbol A A1 A2 b D E E1 e h L L1 L2 șș Dimension (mm) MIN 1.27 BSC 0.25 0.40 1.40 REF 0.25 BSC 0O 5O JEDEC Registration MS-013, Variation AE, Issue E, Sep. 2005. 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ Drawings are not to scale. S# S 28SO G 0 1309 D Seating Plane Gauge Plane L Top View Side View View B View B θ E1 E A A2 A A Seating Plane e b h h Note 1 Note 1 (Index Area 0.25D x 0.75E1) View A - A Note: 1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEH DPROGHGPDUNLGHQWL¿HU DQHPEHGGHGPHWDOPDUNHU RU a printed indicator.  2016 Microchip Technology Inc. DS20005629A-page 11 HV5812

DS20005629A-page 12  2016 Microchip Technology Inc. NOTES:

 2016 Microchip Technology Inc. DS20005629A-page 13 HV5812 APPENDIX A: REVISION HISTORY Revision A (October 2016)

• Converted Supertex Doc# DSFP- HV5812 to Microchip DS20005629A
• Changed the packaging quantity of 28-lead PLCC (PJ M904) from 500/Reel to 750/Reel and 28-lead SOW (WG) from 1000/Reel to 1600/Reel
• Made minor text changes throughout the docu - ment

DS20005629A-page 14  2016 Microchip Technology Inc. PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: a) HV5812P-G: 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid, 28-lead PDIP, 13/Tube b) HV5812PJ-G: 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid, 28-lead PLCC, 38/Tube c) HV5812PJ-G-M904: 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid, 28-lead PLCC, 750/Reel d) HV5812WG-G: 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid, 28-lead SOW, 1600/Reel PART NO. Device Device: HV5812 = 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid Packages: P = 28-lead PDIP PJ = 28-lead PLCC WG = 28-lead SOW Environmental: G = Lead (Pb)-free/RoHS-compliant Package Media Types: (blank) = 13/Tube for a P Package = 38/Tube for a PJ Package = 1600/Reel f or a WG Package M904 = 750/Reel for a PJ Package XX Package - X - X Environmental Media Type Options

 2016 Microchip Technology Inc. DS20005629A-page 15 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO RE PRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting fr om such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0999-1 Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal meth ods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==

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