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Document overview
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Technical content
Features
- Processed with High Voltage CMOS technology
- Output voltages to 225V using a ramped supply voltage
- SINK current minimum 100mA
- Shift register speed 8.0MHz
- Strobe and enable inputs
- CMOS compatible inputs
- Forward and reverse shifting options
Description
HV5122 / HV5222 are low-voltage serial to high-volt- age parallel converters with open-drain outputs. These devices are primarily designed for use as a driver for AC electroluminescent displays. HV5122 / HV5222 can also be used in any application requiring multiple high- voltage, current-sinking output capabilities such as driving inkjet and electrostatic print heads, plasma pan- els, vacuum fluorescent, or large matrix LCD displays. These devices consist of a 32-bit shift register and con- trol logic to perform the Output Enable and all-on func- tions. Data is shifted through the shift register on the high-to-low transition of the clock. HV5122 shifts in the counter-clockwise direction when viewed from the top of the package and HV5222 shifts in the clockwise direction. For cascading devices, HV5122 / HV5222 provides a data output buffer that reflects he current status of the last bit of the shift register. Operation of the shift regis- ter is not affected by the OE (Output Enable) or the STR (Strobe) inputs. HV5122 / HV5222 are designed to be used in systems which either switch off the high voltage supply before changing the state of the high voltage outputs or which limit the current through each output. 32-Channel, Serial-to-Parallel Converter with Open-Drain Outputs
DS20005418B-page 2 2015 Microchip Technology Inc. Package Type Functional Block Diagram 44-Lead PLCC See Table 2-1 for pin information 44-Lead PQFP 1 446 40 HVOUT2
28 Additional
2015 Microchip Technology Inc. DS20005418B-page 3 HV5122 / HV5222
1.0 ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS† 1: Duty cycle is limited by the total power dissipated in the package. 2: For operation above 25°C ambient derate linearly to maximum operating temperature at 20mW/°C. † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: ELECTRICAL CHARACTERISTICS Electrical Specifications: Over recommended conditions unless otherwise specified Symbol Parameter Min Max Units Conditions DC Characteristics IDD VDD supply current - 15 mA f CLK= 8.0MHz, fDATA= 4.0MHz IDDQ Quiescent VDD supply current - 100 µA DIN= 0V, all input logic pins = 0V, all outputs off IO(OFF) Off-state output current - 10 µA All outputs high, all switches parallel IIH High level logic input current - 1.0 µA V IN= VDD IIL Low level logic input current - -1.0 µA V IL= 0 VOH High level output data out V DD - 1.0V -V IDOUT= -100µA VOL Low level output voltage HVOUT -1 5 V IHVOUT= +100mA Data out - 1.0 I DOUT= +100µA VOC HVOUT clamp voltage - -1.5 V I OL= -100mA AC Characteristics (VDD = 12V, TA=25°C) fCLK Clock frequency - 8.0 MHz tW Clock width, high or low 62 - ns tSU Data setup time before CLK falls 25 - ns tH Data hold time after CLK falls 10 - ns tON Turn-on time, HVOUT from strobe - 500 ns R L= 2.0kΩ to 200V tDHL Data output delay after H to L CLK - 100 ns C L= 15pF tDLH Data output delay after L to H CLK - 100 ns C L= 15pF TABLE 1-2: TYPICAL THERMAL RESISTANCE Package θja 44-Lead PQFP 51°C/W 44-Lead PLCC 37°C/W
DS20005418B-page 4 2015 Microchip Technology Inc.
2.0 PIN DESCRIPTION
The locations of the pins are listed in Package Type. TABLE 2-1: PIN DESCRIPTION PQFP Pin # HV5122 HV5222 Description 1H V OUT11 HV OUT22 High voltage outputs. 2H V OUT12 HV OUT21 3H V OUT13 HV OUT20 4H V OUT14 HV OUT19 5H V OUT15 HV OUT18 6H V OUT16 HV OUT17 7H V OUT17 HV OUT16 8H V OUT18 HV OUT15 9H V OUT19 HV OUT14
10 HV OUT20 HV OUT13
11 HV OUT21 HV OUT12
12 HV OUT22 HV OUT11
13 HV OUT23 HV OUT10
14 HV OUT24 HV OUT9
15 HV OUT25 HV OUT8
16 HV OUT26 HV OUT7
17 HV OUT27 HV OUT6
18 HV OUT28 HV OUT5
19 HV OUT29 HV OUT4
20 HV OUT30 HV OUT3
21 HV OUT31 HV OUT2
22 HV OUT32 HV OUT1
23 DATA OUT DATA OUT Data output for cascading to the data input of the next device. N/C N/C No connect.25
28 OE OE
Output enable input. When OE is LOW, all HV outputs are forced into a LOW state, regardless of data in each channel. When OE is HIGH, all HV outputs reflect data latched. 29 CLK CLK Data shift register clock. Input are shifted into the shift register on the positive edge of the clock. 30 GND GND Logic and high voltage ground. 31 VDD VDD Low voltage logic power rail. 32 STR STR Strobe. 33 DATA IN DATA IN Serial data input. Data needs to be present before each rising edge of the clock. 34 N/C N/C No connect.
2015 Microchip Technology Inc. DS20005418B-page 5 HV5122 / HV5222
35 HV OUT1H V OUT32
High voltage outputs.
36 HV OUT2H V OUT31
37 HV OUT3H V OUT30
38 HV OUT4H V OUT29
39 HV OUT5H V OUT28
40 HV OUT6H V OUT27
41 HV OUT7H V OUT26
42 HV OUT8H V OUT25
43 HV OUT9H V OUT24
44 HV OUT10 HV OUT23
TABLE 2-1: PIN DESCRIPT ION PQFP (CONTINUED) Pin # HV5122 HV5222 Description TABLE 2-2: PIN DESCRIPTION PLCC Pin # HV5122 HV5222 Description 1H V OUT16 HV OUT17 High voltage outputs 2H V OUT17 HV OUT16 3H V OUT18 HV OUT15 4H V OUT19 HV OUT14 5H V OUT20 HV OUT13 6H V OUT21 HV OUT12 7H V OUT22 HV OUT11 8H V OUT23 HV OUT10 9H V OUT24 HV OUT9
10 HV OUT25 HV OUT8
11 HV OUT26 HV OUT7
12 HV OUT27 HV OUT6
13 HV OUT28 HV OUT5
14 HV OUT29 HV OUT4
15 HV OUT30 HV OUT3
16 HV OUT31 HV OUT2
17 HV OUT32 HV OUT1
18 DATA OUT DATA OUT Data output for cascading to the data input of the next device. N/C N/C No connect.20
23 OE OE
Output enable input. When OE is LOW, all HV outputs are forced into a LOW state, regardless of data in each channel. When OE is HIGH, all HV outputs reflect data latched. 24 CLK CLK Data shift register clock. Input are shifted into the shift register on the positive edge of the clock. 25 GND GND Logic and high voltage ground. 26 VDD VDD Low voltage logic power rail. 27 STR STR Strobe.
DS20005418B-page 6 2015 Microchip Technology Inc. 28 DATA IN DATA IN Serial data input. Data needs to be present before each rising edge of the clock. 29 N/C N/C No connect.
30 HV OUT1H V OUT32
High voltage outputs.
31 HV OUT2H V OUT31
32 HV OUT3H V OUT30
33 HV OUT4H V OUT29
34 HV OUT5H V OUT28
35 HV OUT6H V OUT27
36 HV OUT7H V OUT26
37 HV OUT8H V OUT25
38 HV OUT9H V OUT24
39 HV OUT10 HV OUT23
40 HV OUT11 HV OUT22
41 HV OUT12 HV OUT21
42 HV OUT13 HV OUT20
43 HV OUT14 HV OUT19
44 HV OUT15 HV OUT18
TABLE 2-2: PIN DESCRIPT ION PLCC (CONTINUED) Pin # HV5122 HV5222 Description
2015 Microchip Technology Inc. DS20005418B-page 7 HV5122 / HV5222
3.0 FUNCTIONAL DESCRIPTION
Table 3-1 provides functional information about HV5122 / HV5222. Note 1: H = high level, L = low level, X = irrelevant, ↓ = high-to-low transition 2: ●= dependent on previous stage’s state before the last CLK high-to-low transition
3.1 Power-Up and Recommended
To power-up HV5122 / HV5222, perform the following power-up sequence: 1. Connect ground 2. Apply V DD 3. Set all inputs to a known state To power-down the device, reverse the steps above. FIGURE 3-1: Input and Output Equivalent Circuits TABLE 3-1: FUNCTIONAL TABLE Function Inputs Outputs Data In CLK OE STR Shift Reg HV Outputs Data Out TABLE 3-2: RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Units VDD Logic voltage supply 10.8 12 13.2 V HVOUT High voltage output -0.3 - 225 V VIH High-level input voltage V DD-2.0 - V DD V VIL Low-level input voltage 0 - 2.0 V fCLK Clock frequency - - 8.0 MHz TA Operating free-air temperature -40 - +85 °C VDD INPUT GND HVOUT Logic Inputs GND DATA OUT Logic Data Output High Voltage Outputs VDD HVIN GND
DS20005418B-page 8 2015 Microchip Technology Inc. FIGURE 3-2: Switching Waveforms DATA IN Data Valid 1 CLK DATA OUT DATA OUT STR tDLH tSU tH tWLtWH tDHL HVOUT 50% 50% 50% 50% 50% 15V tON 12V 12V
2015 Microchip Technology Inc. DS20005418B-page 9 HV5122 / HV5222
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
Legend: XX...X Product Code or Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo. 44-lead PLCC Example XXXXXXXXX XXXXXXXXXXX YYWWNNN XXXXXXXXXXX HV5122PJ 1526343e3 44-lead PQFP Example XXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN HV5122PG 1526343e3
DS20005418B-page 10 2015 Microchip Technology Inc. 44-Lead PQFP Package Outline (PG) 10.00x10.00mm body, 2.35mm height (max), 0.80mm pitch Symbol A A1 A2 b D D1 E E1 e L L1 L2 ș Dimension (mm) 0.80 BSC 0.73 1.95 REF 0.25 BSC JEDEC Registration MO-112, Variation AA-2, Issue B, Sep.1995. 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ Drawings not to scale. S D # DSPD 44PQFPPG V i C041309 Seating Plane Gauge Plane θL View B View B Seating Plane Top View D E b e Side View A2A Note 1 (Index Area D1/4 x E1/4) Note: 1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEH DPROGHGPDUNLGHQWL¿HU DQHPEHGGHGPHWDOPDUNHU RU a printed indicator.
2015 Microchip Technology Inc. DS20005418B-page 11 HV5122 / HV5222 44-Lead PLCC Package Outline (PJ) .653x.653in body, .180in height (max), .050in pitch Symbol A A1 A2 b b1 D D1 E E1 e R Dimension (inches) .050 BSC .025 JEDEC Registration MS-018, Variation AC, Issue A, June, 1993. † This dimension differs from the JEDEC drawing. Drawings not to scale. .150 MAX .048/.042 x 45O .075 MAX 6 40 D E1 E Top View Horizontal Side View View B A A2 Seating Plane e b Note 1 (Index Area) .056/.042 x 45O .020max (3 Places) .020 MIN Vertical Side View View B Note 2 Base Plane R Notes: 1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEH DPROGHGPDUNLGHQWL¿HU DQHPEHGGHGPHWDOPDUNHU RU a printed indicator. 2. $FWXDOVKDSHRIWKLVIHDWXUHPD\\YDU\\
DS20005418B-page 12 2015 Microchip Technology Inc. APPENDIX A: REVISION HISTORY Revision A (August 2015)
- Update file to new format Revision B (October 2015)
- Updated Continuous total power dissipation in Absolute Maximum Ratings on page 3
- Corrected a typo on page 13
2015 Microchip Technology Inc. DS20005418B-page 13 HV5122 / HV5222 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: HV5122 = 32-Channel Serial to Parallel Converter, data shifts in counter-clockwise direction HV5222 = 32-Channel Serial to Parallel Converter, data shifts in clockwise direction Package: PG = 44-Lead PQFP PJ = 44-Lead PLCC Environmental G = Lead (Pb)-free/ROHS-compliant package Media Type: (blank) = 96/Tray for PG package = 27/Tube for PJ package Examples: a) HV5122PG-G Data shifts in counter- clockwise direction, 44- Lead PQFP package, 96/Tray b) HV5222PJ-G Data shifts in clockwise direction, 44-Lead PLCC package, 27/Tube PART NO. X Device X Environmental XX Package Options Media - - Type
DS20005418B-page 14 2015 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application me ets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting fr om such use. No licenses are conveyed, implicitly or ot herwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC 32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP , Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-882-6 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal meth ods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==
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