HV265 MICROCHIP | Alldatasheet
Document overview
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Technical content
Features
- Four Independent High Voltage Amplifiers
- Up to +205 V Output Voltage
- Gain of 82 V/V with Internal Feedback Resistors
- 0.02 V/ s Minimum Output Slew Rate
- Less than 10 ms Settling Time
- Less than 1 k Output Impedance
- Up to 200 pF Output Load
- 30 kHz Gain Bandwidth Product
- 24-lead TSSOP Package Application
- M E M S D r i v e r General Description The HV265 device is a 4-channel high-voltage operational amplifier array with an optional internal feedback resistor network. The amplifier array IC operates on a 225 V high-voltage supply and a 5 V low-voltage supply. Each channel has its independent input and output ports. When the internal feedback resistor network is used, the closed- loop gain is set to 82 V/V. High value SiCr resistors are used for internal feedback networks to minimize the power consumption. The input accepts voltage in the range of 0.05V and 2.5V. The output impedance of the amplifier is less than 1 k and the output can drive a capacitive load up to 200 pF. The amplifier is designed to have good temperature stability and low output drift. Typical Application Circuit 4-Channel, 205V , High-Voltage Amplifiers Array
DS20006234A-page 2 2019 Microchip Technology Inc. Package Types (Top View) Block Diagram HV265 24-Lead TSSOP See Table 2-1.
2019 Microchip Technology Inc. DS20006234A-page 3 HV265 NOTES:
DS20006234A-page 4 2019 Microchip Technology Inc.
1.0 ELECTRICAL
Absolute Maximum Ratings † † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: OPERATING SUPPLY VOLTAGES Electrical Specifications: Unless otherwise specified: TA = +25°C. Boldface specifications apply over the TA range of -40 to +85°C. Parameter Sym. Min. Typ. Max. Units Conditions High Voltage Supply V PP 50 — 225 V Note 1 Low Voltage Supply V DD 4.5 5.0 5.5 V Note 1: Specification is obtained by characterization and is not 100% tested.
ELECTRICAL CHARACTERISTICS
Electrical Specifications: unless otherwise specified, VDD = 5.0V, VPP = 225V, TA = +25°C. Parameter Sym. Min. Typ. Max. Units Conditions Input Ground Range R GND 00 V DD V Input Analog Voltage V IN 0— 3 . 3 V Quiescent VPP Supply Current I PPQ — 300 500 µA V IN =0 o r 5 V Quiescent VDD Supply Current I DDQ— 3 5 m A V IN=0 o r 5 V VPP Supply Current I PP —— 500 µA V IN=2 VP-P 100 Hz sine, CL = 200 pF VDD Supply Current I DD —— 5 mA V IN= 2VP-P 100 Hz sine, CL = 200 pF HVOUT Output Voltage Range HV OUT 1.85 V PP - 10 VC L = 200 pF HVOUT Sink Current I SINK 3m A C L = 200 pF HVOUT Source Current I SOURCE 3m A C L = 200 pF HVOUT High Level Output V OH 204.8 V C L = 200 pF, VIN= 2.7V HVOUT Input DC Offset HV OS ±16 mV Note 3 CL = 200 pF HVOUT Drift Over Time (Room Temperature) Drift ±30 mV Note 3 CL = 200 pF, VIN= 2.5V HVOUT Temperature Coefficient (Drift Over Temperature) Temp. ±115 mV Note 3 CL = 200 pF, VIN= 2.5V TJ = -40°C to 85°C Note 1: Recommended Operating Conditions: V IN=0V, VDD=5.0V, VPP=+225V unless noted. Tj=25°C 2: Design guidance only. 3: Specification is obtained by characterization and is not 100% tested.
2019 Microchip Technology Inc. DS20006234A-page 5 HV265 AC ELECTRICAL CHARACTERISTICS Electrical Specifications: unless otherwise specified, VDD = 5.0V, VPP = 225V, TA = +25°C. Parameter Sym. Min. Typ. Max. Units Conditions HVOUT Output Impedance Z OUT 1000 Note 3 VIN= 1.25 VDC Test Frequency = 100 Hz C L = 200 pF Gain Bandwidth Product GBWP 30 kHz Note 3 CL = 200 pF Slew Rate (HVOUT from 10% to 90% and from 90% to 10%) SR 0.02 -- V / s CL = 200 pF Settling Time (Within 1% of final HVOUT) tST 10 ms Note 3 CL = 200 pF, VIN= 0 to 2.4 V Feedback Impedance Rf + Ri RFB 4.9 7.0 - M Note 2 Closed Loop Gain (dVo/dVin) (Internal Feedback Resistor Network) AV 75.4 82 88.4 V/V CL = 200 pF HVOUT Capacitive Load C L 0 200 pF Note 2 Output Referred Noise V N 10 mV RMS Note 3 Noise from 1 Hz to 10 kHz. VDD Power Supply Rejection PSRR1 30 dB Note 3 1 kHz VPP Power Supply Rejection PSRR2 50 dB Note 3 1 kHz Crosstalk Rejection Xtalk 80 dB Note 3 VIN= 0 to 2.5V
100 Hz sine, CL = 200 pF
Note 1: Recommended Operating Conditions: V IN=0V, VDD=5.0V, VPP=+225V unless noted. Tj=25°C 2: Design guidance only. 3: Specification is obtained by characterization and is not 100% tested.
DS20006234A-page 6 2019 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS Electrical Specifications: unless otherwise specified, VDD = 5.0V, VPP = 225V Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Junction Temperature Range T J -40 — +85 °C Maximum Junction Temperature T J(MAX) — — +125 °C Storage Temperature Range T A -65 — +150 °C Package Thermal Resistances Thermal Resistance, 24L-TSSOP JA —8 7 — ° C / W
2019 Microchip Technology Inc. DS20006234A-page 7 HV265
1.1 Typical Performance Curves
FIGURE 1-1: Typical Small-Signal Pulse Response (VIN=0.9~1.1V pulse 100 Hz. CL=200 pF). FIGURE 1-2: Typical Large-Signal Pulse Response (VIN = 0~2V pulse 100 Hz. CL=200 pF). FIGURE 1-3: Typical Rise Time (VIN = 0~2V Pulse 100 Hz. CL=200 pF). FIGURE 1-4: Typical Fall Time (VIN = 0~2V Pulse 100 Hz. CL=200 pF). FIGURE 1-5: Typical Bode Plot of Small Signal Input (VIN=100 mVp-p with 1.25 VDC). FIGURE 1-6: Typical Crosstalk Rejection vs Frequency. Note: The graphs and tables provided below are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g. outside specified power supply range) and therefore outside the warranted range. 100 1000 10000 100000 1000000M agnit ude in dB Frequency in Hz Typical Bode Plot Vin = 0.1V rms + 1.25VDC, CL = 220pF 100 105 10 100 1000 10000 Crosstalk Rejecti on in dB Frequency in Hz Crosstalk Rejection HVOUT = Full Swing, CL = 220pF
2019 Microchip Technology Inc. DS20006234A-page 9 HV265 NOTES:
DS20006234A-page 10 2019 Microchip Technology Inc.
2.0 PIN DESCRIPTION
The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin Number Symbol Description
1 VIN1 Amplifier Input 1
2 RGND1 Resistor Ground 1. Typically grounded.
3 GND Low Voltage Ground
4 VIN2 Amplifier Input 2
5 RGND2 Resistor Ground 2. Typically grounded.
6 VDD Positive Low Voltage Supply
7 GND Low Voltage Ground
8 VIN3 Amplifier Input 3
9 RGND3 Resistor Ground 3. Typically grounded.
10 GND Low Voltage Ground
11 VIN4 Amplifier Input 4
12 RGND4 Resistor Ground 4. Typically grounded.
13 NC No Connection
14 FB4 Feedback Input 4
15 HVOUT4 High Voltage Output 4
16 FB3 Feedback Input 3
17 HVOUT3 High Voltage Output 3
18 HVGND High Voltage Ground
19 VPP Positive High Voltage Supply
20 FB2 Feedback Input 2
21 HVOUT2 High Voltage Output 2
22 FB1 Feedback Input 1
23 HVOUT1 High Voltage Output 1
24 NC No Connection
2019 Microchip Technology Inc. DS20006234A-page 11 HV265
3.0 DEVICE DESCRIPTION
3.1 Power-On/Power-Off Sequence
The device can be damaged by an improper power- up/down sequence. The acceptable power-on/off sequences are shown in Table 3-1 and Table 3-2. The user may add an external diode across V PP and V DD for additional protection. The anode of the diode is connected to VDD and the cathode is connected to VPP. Any low-current high-voltage diode such as a 1N4004 is adequate. TABLE 3-1: ACCEPTABLE POWER-ON SEQUENCES TABLE 3-2: ACCEPTABLE PO WER-OFF SEQUENCES Option 1 Option 2 Steps Description Steps Description
1 VDD 1V DD
2 VPP 2 Inputs
3 Inputs 3 V PP
Steps Description Steps Description
1 Inputs 1 V PP
3 VDD 3V DD
DS20006234A-page 12 2019 Microchip Technology Inc. NOTES:
2019 Microchip Technology Inc. DS20006234A-page 13 HV265
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
Legend: XX...X Product Code or Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. 24-Lead TSSOP Example HV265 QEX l 123 1910 3eXXXXXXXX XXXXNNN3e YYWW
DS20006234A-page 14 2019 Microchip Technology Inc. (DATUM B) (DATUM A) Microchip Technology Drawing C04-284A Sheet 1 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 24-Lead Thin Shrink Small Outline Package (QE) - 4.40 mm Body [TSSOP] Supertex Legacy & Micrel Legacy Package BA N TOP VIEW SIDE VIEW VIEW A-A 0.05 C E
0.10 C A-B D
C SEATING PLANE D A 24X b e 2X N
2 TIPS
A A SEE DETAIL B SHEET 2 0.20 C 0.10 C 24X
2019 Microchip Technology Inc. DS20006234A-page 15 HV265 Microchip Technology Drawing C04-284A Sheet 2 of 2 REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensioning and tolerancing per ASME Y14.5M 24-Lead Thin Shrink Small Outline Package (QE) - 4.40 mm Body [TSSOP] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Supertex Legacy & Micrel Legacy Package H L (L1) DETAIL B T Molded Package Thickness Dimension Limits Mold Draft Angle Top Foot Length Lead Width Molded Package Width Overall Length Overall Width Foot Angle Footprint Standoff Overall Height Lead Pitch Number of Leads 0.750.600.45L
6.40 BSC
1.00 REF
D b 0.19 12° REF D E 0.30 1.00
0.65 BSC
A e 0.05 0.80 0.85 Units N MIN 1.15 0.15 1.20 0.10 MAX T 7.907.807.70 4.504.404.30
DS20006234A-page 16 2019 Microchip Technology Inc. Microchip Technology Drawing C04-2284A 24-Lead Thin Shrink Small Outline Package (QE) - 4.40 mm Body [TSSOP] C E G BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Supertex Legacy & Micrel Legacy Package RECOMMENDED LAND PATTERN Dimension Limits Units Contact Pitch MILLIMETERS E MAX Contact Pad Length (X24) Contact Pad Width (X24) 1.50 0.45 NOM CContact Pad Spacing 5.80 Contact Pad to Center Pad (X20) G1 0.20 SILK SCREEN
2019 Microchip Technology Inc. DS20006234A-page 17 HV265 APPENDIX A: REVISION HISTORY Revision A (July 2019)
- Original release of this document.
DS20006234A-page 18 2019 Microchip Technology Inc. NOTES:
2019 Microchip Technology Inc. DS20006234A-page 19 HV265 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . PART NO. /XX PackageDevice Device: HV265: 4-Channel, 205V, High-Voltage Amplifiers Array Temperature Range: I = -40°C to +85°C Package: QE = 24LD TSSOP 4.4mm Example: a) HV265-I/QE: 4-Channel 205V High-Voltage Amplifier Array, -40°C to +85°C, 24LD TSSOP package Temperature Range
DS20006234A-page 20 2019 Microchip Technology Inc. NOTES:
2019 Microchip Technology Inc. DS20006234A-page 21 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY , PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP , INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2019, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-4776-4 Note the following details of the code protection feature on Microchip devices:
- Microchip products meet the specification cont ained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are co mmitted to continuously improvin g the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.
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