HV20822 MICROCHIP | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 18
Technical content
Features
- 220V Operating Conditions
- 2 2 Ω Typical Output On-Resistance
- 5V and 12V CMOS Logic Compatibility
- –10 µA Low Quiescent Current Consumption
- –45 dB Minimum Off Isolation at 7.5 MHz
- Low Parasitic Capacitance
- Excellent Noise Immunity
- Flexible High-Voltage Supplies
Applications
- Medical Ultrasound Imaging
- Piezoelectric Transducer Drivers General Description The HV20822 is a 220 V, 16-channel high- voltage analog switch integrated circuit (IC) configured as two sets of eight single-pole, single-throw analog switches. It is intended for use in applications requiring high-voltage switching controlled by low-voltage control signals, such as ultrasound imaging and printers. The two sets of eight analog switches are controlled by two input logic controls, DIN1 and DIN2. A logic high on DIN1 will turn on Switc hes 0 to 7, and a logic high on DIN2 will turn on Switches 8 to 15. Package Type See Table 2-1 for pin information. 48-lead LQFP (Top view) 16-Channel High-Voltage Analog Switch
DS20007085A-page 2 2026 Microchip Technology Inc and its subsidiaries Functional Block Diagram VDD DIN1 DIN2 LE GND VPP VNN SW0A SW0B SW7A SW7B SW8A SW8B SW15A SW15B Latch 1 Level Translator 1 Latch 2 Level Translator 2
2026 Microchip Technology Inc. and its subsidiaries DS20007085A-page 3 HV20822
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†) Power Dissipation: †N o t i c e : Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Expo- sure to maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Parameter Sym. Min. Typ. Max. Unit Conditions Logic Power Supply Voltage V DD 4.75 — 12.6 V Note 1, Note 3 Positive High-Voltage Supply V PP +50 — +110V V Note 1, Note 3 Negative High-Voltage Supply V NN –10 — V PP–220V V Note 1, Note 3 High-Level Input Voltage V IH VDD–1V — V DD V Low-Level Input Voltage V IL 0— 1 V Analog Signal Voltage Peak-to-Peak V SIG VNN+10V — V PP–10V V Note 2 Operating Free-Air Temperature T A 0— 7 0 ° C Note 1: Power-up/down sequence is arbitrary except GND must be powered up first and powered down last. 2: VSIG must be VNN ≤ VSIG ≤ VPP or floating during power-up/down transition. 3: Rise and fall times of power supplies VDD, VPP, and VNN should not be less than 1 millisecond.
DS20007085A-page 4 2026 Microchip Technology Inc and its subsidiaries DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all values are over operating conditions. Parameter Sym. 0°C +25°C +70°C Small Signal Switch On-Resistance RONS —3 0— 2 6 3 2 —4 0 Ω VSIG = 0V, ISIG = 5 mA, VPP = 50V, VNN = –170V —2 5— 2 2 2 7 —3 5 Ω VSIG = 0V, ISIG = 200 mA, VPP = 50V, VNN = –170V —2 5— 2 2 2 7 —3 0 Ω VSIG = 0V, ISIG = 5 mA, VPP = 110V, VNN = –110V —2 0— 1 8 2 2 —2 5 Ω VSIG = 0V, ISIG = 200 mA, VPP = 110V, VNN = –110V Small Signal Switch On-Resistance Matching ΔRONS —2 0—52 0 —2 0 % VSIG = 0V, ISIG = 5 mA, VPP = 110V, VNN = –110V Large Signal Switch On-Resistance RONL ——— 1 5 — —— Ω VSIG = 0V, ISIG = 1 mA Switch-Off Leakage per Switch ISOL —5— 1 1 0 — 1 5 μA VSIG = VPP–10V and VNN +10V DC Offset Switch Off VOS 300 — — 100 300 — 300 mV RL= 100 KΩ RL= 100 KΩDC Offset Switch On 500 — — 100 500 — 500 mV VPP Supply Quiescent Current IPPQ ——— 1 0 5 0 —— μA All switches off VNN Supply Quiescent Current INNQ — — — –10 –50 — — μA All switches off VPP Supply Quiescent Current IPPQ ——— 1 0 5 0 —— μA All switches on, ISW = 5 mA VNN Supply Quiescent Current INNQ — — — –10 –50 — — μA All switches on, ISW = 5 mA Switch Output Peak Current ISW —3— 32 —2 A V SIG duty cycle ≤ 0.1% Output Switching Frequency fSW — — — — 50 — — kHz Duty cycle = 50% IPP Supply Current I PP —8 . 1—— 8 . 8 —1 0m A VPP = 50V, VNN = –170V All SWs I turning on and off at 50 KHz—5— — 6 . 3 — 6 . 9 m A VPP = 110V, VNN = –110V INN Supply Current I NN VNN = –170V All SWs I turning on and off at VNN = –110V Logic Supply Average Current IDD —2— — 2 —2m A DIN1 = DIN2 = 3 M H z , LE = high Logic Supply Quiescent Current IDDQ —1 0— — 1 0 —1 0 μA All logic states are at DC
2026 Microchip Technology Inc. and its subsidiaries DS20007085A-page 5 HV20822 AC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all values are over operating conditions. Parameter Sym. 0°C +25°C +70°C Unit Conditions Min. Max Min. Typ. Max Min. Max Time to Turn Off VSIG t SIG(OFF 0—0 — —0—n s Note 1 Time Width of LE tWLE 150 — 150 —— 150 — ns Time Width of DIN tWDIN 150 — 150 —— 150 — ns Set-up Time before LE Rises tSD 150 — 150 — — 150 — ns Turn-on Time t ON —5——5—5 μs VSIG = VPP–10V, RLOAD = 10 kΩ Turn-off Time t OFF —5——5—5 μs VSIG = VPP–10V, RLOAD = 10 kΩ Off Isolation K O 1 kΩ// 15 pF load dB f = 7.5 MHz, RLOAD = 50Ω load Switch Crosstalk K CR –45 — –45 — — –45 — dB f = 5 MHz, RLOAD = 50Ω load Off Capacitance SW to GND CSG(OFF) 5 17 5 12 17 5 17 pF 0V, f = 1 MHz On Capacitance SW to GND CSG(ON) 25 50 25 38 50 25 50 pF 0V, f = 1 MHz Output Voltage Spike Note 1: Time required for analog signal to turn off before output switch turns off TEMPERATURE SPECIFICATIONS Parameter Sym. Min. Typ. Max. Unit Conditions TEMPERATURE RANGE Storage Temperature T S –65 — +150 °C PACKAGE THERMAL RESISTANCE 48-lead LQFP θ JA —5 2— ° C / W
DS20007085A-page 6 2026 Microchip Technology Inc and its subsidiaries Timing Waveforms VDD DIN 50% 50% 50% 10% 90% 50% tSD tON tWLE tOFF VDD LE ON SW OFF
2026 Microchip Technology Inc. and its subsidiaries DS20007085A-page 7 HV20822
2.0 PIN DESCRIPTION
The details on the pins in HV20822 are listed in Table 2-1. Refer to Package Type for the location of pins. TABLE 2-1: PIN FUNCTION TABLE Pin Number Pin Name Description
1 VNN Negative supply voltage
2 N/C No connection
3 VPP Positive supply voltage
4 N/C No connection
6L E Latch-enable logic input 7D IN2 Data logic input 2
8 N/C No connection
9 N/C No connection
10 VDD Logic supply voltage
11 GND Ground
12 N/C No connection
13 N/C No connection
14 SW15A Terminal A of Analog Switch 15
15 SW15B Terminal B of Analog Switch 15
16 SW14A Terminal A of Analog Switch 14
17 SW14B Terminal B of Analog Switch 14
18 SW13A Terminal A of Analog Switch 13
19 SW13B Terminal B of Analog Switch 13
20 SW12A Terminal A of Analog Switch 12
21 SW12B Terminal B of Analog Switch 12
22 SW11A Terminal A of Analog Switch 11
23 SW11B Terminal B of Analog Switch 11
24 N/C No connection
25 SW10A Terminal A of Analog Switch 10
26 SW10B Terminal B of Analog Switch 10
27 SW9A Terminal A of Analog Switch 9
28 SW9B Terminal B of Analog Switch 9
29 SW8A Terminal A of Analog Switch 8
30 SW8B Terminal B of Analog Switch 8
31 SW7A Terminal A of Analog Switch 7
32 SW7B Terminal B of Analog Switch 7
33 SW6A Terminal A of Analog Switch 6
34 SW6B Terminal B of Analog Switch 6
35 SW5A Terminal A of Analog Switch 5
36 SW5B Terminal B of Analog Switch 5
37 SW4A Terminal A of Analog Switch 4
38 N/C No connection
39 SW4B Terminal B of Analog Switch 4
40 N/C No connection
DS20007085A-page 8 2026 Microchip Technology Inc and its subsidiaries
41 SW3A Terminal A of Analog Switch 3
42 SW3B Terminal B of Analog Switch 3
43 SW2A Terminal A of Analog Switch 2
44 SW2B Terminal B of Analog Switch 2
45 SW1A Terminal A of Analog Switch 1
46 SW1B Terminal B of Analog Switch 1
47 SW0A Terminal A of Analog Switch 0
48 SW0B Terminal B of Analog Switch 0
TABLE 2-1: PIN FUNCTION TABLE Pin Number Pin Name Description
2026 Microchip Technology Inc. and its subsidiaries DS20007085A-page 9 HV20822
3.0 TEST CIRCUITS
Figure 3-1 to Figure 3-8 show the test circuits for HV20822. FIGURE 3-1: Switch Off Leakage. FIGURE 3-2: TON/TOFF Test Circuit. FIGURE 3-3: Isolation Diode Current. FIGURE 3-4: DC Offset ON/OFF. FIGURE 3-5: OFF Isolation. FIGURE 3-6: Crosstalk. VPP VPP VDD GND 5.0V VNN VPP VPP - 10V ISOL VNN + 10 VPP VPP VDD GND 5.0V VNN VPP VPP - 10V VOUT 10kΩ RL VPP VPP VDD GND 5.0V VNN VPP VSIG VNN IID VPP VPP VDD GND 5.0V VNN VPP VOUT 100kΩ RL VPP VPP VDD GND 5.0V VNN VPP VOUT RL VIN = 10VP-P @5.0MHz KCR = 20Log VOUT VIN VPP VPP VDD GND 5.0V VNN VPP KCR = 20Log VOUT VIN 50Ω NC VIN = 10VP-P @5.0MHz VOUT 50Ω
2026 Microchip Technology Inc. and its subsidiaries DS20007085A-page 11 HV20822 TABLE 3-1: TRUTH FUNCTION TABLE DIN2D IN1L E SW0 to SW7 SW8 to SW15 LLL O f f O f f LHL O n O f f HLL O f f O n HHL O n O n X X H Hold Previous State
DS20007085A-page 12 2026 Microchip Technology Inc and its subsidiaries
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
Legend: XX...X Product Code or Cust omer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC ® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part num ber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo. 48-lead LQFP Example NNN YYWW XXXXXXX XX 343 2640 20822FG HV
2026 Microchip Technology Inc. and its subsidiaries DS20007085A-page 13 HV20822 Microchip Technology Drawing C04-278 Rev A Sheet 1 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 48-Lead Low-profile Plastic Quad Flat Pack Package (R8) -7x7 mm Body [LQFP] Supertex Legacy Package B D
0.20 C A-B D
0.20 H A-B D
0.08 C A-B D
C SEATING PLANE N TOP VIEW SIDE VIEW 0.10 C 0.08 C D E A 48X b 48X TIPS A e H AA 48X
DS20007085A-page 14 2026 Microchip Technology Inc and its subsidiaries Microchip Technology Drawing C04-278 Rev A Sheet 2 of 2 REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensioning and tolerancing per ASME Y14.5M 48-Lead Low-profile Plastic Quad Flat Pack Package (R8) -7x7 mm Body [LQFP] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Supertex Legacy Package H L (L1) SECTION A-A T Molded Package Thickness Dimension Limits Mold Draft Angle Top Foot Length Lead Width Molded Package Length Molded Package Width Overall Length Overall Width Foot Angle Footprint Standoff Overall Height Lead Pitch Number of Leads 0.750.600.45L 0.22
7.00 BSC
9.00 BSC
3.5°
1.00 REF
D b 0.17 11° D E 13° 0.27 1.40
0.50 BSC
A e 0.05 1.35 1.40 Units N MIN 1.45 0.15 1.60 0.10 1.50 MAX T 12°
2026 Microchip Technology Inc. and its subsidiaries DS20007085A-page 15 HV20822 RECOMMENDED LAND PATTERN Dimension Limits Units C2Contact Pad Spacing Contact Pitch MILLIMETERS E MAX 8.40 Contact Pad Length (X48) Contact Pad Width (X48) 1.50 0.30 Microchip Technology Drawing C04-2278 Rev A NOM 48-Lead Low-profile Plastic Quad Flat Pack Package (R8) -7x7 mm Body [LQFP] SILK SCREEN E G C1Contact Pad Spacing 8.40 Contact Pad to Contact Pad (X44) G 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Supertex Legacy Package
DS20007085A-page 16 2026 Microchip Technology Inc. and its subsidiaries APPENDIX A: REVISION HISTORY Revision A (January 2026)
- Converted Supertex Doc# DSFP-HV20822 to Microchip DS20005445A
- Removed the “HVCMOS® Technology for high performance” from the Features section
- Changed the package marking format
- Added some sections to comply with the standard Microchip format
- Updated package outline drawings
- Made minor text changes throughout the document
2026 Microchip Technology Inc. and its subsidiaries DS20007085A-page 17 HV20822 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: a) HV20822FG-G: 12-Channel High-Voltage Analog Switch, 48-lead b) HV20822FG-G-M931: 12-Channel High-Voltage Analog Switch, 48-lead PART NO. Device Device: HV20822 = 16-Channel High-Voltage Analog Switch Package: FG = 48-lead LQFP Environmental: G = Lead (Pb)-free/RoHS-compliant Package Media Types: (blank) = 250/Tray for FG Package M931 = 1000/Reel for FG package XX Package - X - X Environmental Media Type Options
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