HST9-B400 ABRACON | Alldatasheet
Document overview
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Technical content
Features
Silicon NPN phototransistor Right angle Black epoxy Wide spectral range of sensitivity from 700 nm to 1100 nm Peak sensitivity at 920 nm Angle of half sensitivity of ±20 degrees
Applications
Office and factory automation Home appliances CAUTION! This package is ESD sensitive per ANSI/ESDA/JEDEC JS-001. Observe appropriate precautions during handling and processing. Refer to Application Note 1142 for additional details. HST9-B400 Side-View Surface-Mount Phototransistor
HST9-B400 Data Sheet Side-View Surface-Mount Phototransistor Figure 1: Package Drawing NOTE: All dimensions are in millimeters (mm). The tolerance is ±0.10 mm unless otherwise specified. Absolute Maximum Ratings Optical and Electrical Characteristics (TA = 25°C) Parameter Value Unit Collector-Emitter Voltage, VCE 30 V Emitter-Collector Voltage, VEC 5V Collector Current, ICA 20 mA Power Dissipation, Pd 100 mW Operating Temperature Range –40 to +85 °C Storage Temperature Range –40 to +85 °C Parameter Value Unit Test ConditionMin. Typ. Max. Collector Light Current, ICA 4.0 6.0 — mA Ee = 1 mW/cm2, λ = 940 nm, VCE = 5V Wavelength of Peak Sensitivity, λsmax — 920 — nm — Spectral Range of Sensitivity, λ0.1 700 — 1100 nm — Angle of Half Sensitivity, φ —± 2 0—° — Dark Current, ICEO —— 1 0 0 n A Ee = 0 mW/cm2, VCE = 10V Collector-Emitter Saturation Voltage, VCEsat —— 0 . 4 V Ee = 1 mW/cm2, λ = 940 nm, ICA = 100 μA
HST9-B400 Data Sheet Side-View Surface-Mount Phototransistor Figure 10: Reel Dimensions NOTE: All dimensions are in millimeters (mm). PRODUCT LABEL USER FEED DIRECTION 9.0 178.5 60.0
HST9-B400 Data Sheet Side-View Surface-Mount Phototransistor Broadcom HST9-B400-DS100 Precautionary Notes Soldering Do not perform reflow soldering more than twice. Observe necessary precautions for handling moisture- sensitive devices as stated in the following section. Do not apply any pressure or force on the package during reflow and after reflow when the package is still hot. Use reflow soldering to solder the package. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: – Soldering iron tip temperature = 310°C max. – Soldering duration = 2 seconds max. – Number of cycles = 1 only – Power of soldering iron = 50W max. Do not touch the package body with the soldering iron except for the soldering terminals, as it may cause damage to the package. Confirm beforehand whether the functionality and performance of the package are affected by hand soldering. Figure 11: Recommended Lead-Free Reflow Soldering Profile Handling Precautions This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note 5305, Handling Moisture-Sensitive Surface-Mount LEDs, for additional details and a review of proper handling procedures. Before use: – An unopened moisture barrier bag (MBB) can be stored at <40°C/90% RH for 12 months. If the actual shelf life exceeds 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the packages per the original MSL rating. – Do not open the MBB prior to assembly (for example, for IQC). If unavoidable, the MBB must be properly resealed with fresh desiccant and HIC. The exposed duration must be taken in as floor life. Control after opening the MBB: – Read the HIC immediately upon opening the MBB. – Keep the packages at <30°/60% RH at all times, and complete all high-temperature-related processes, including soldering, curing, or rework, within 168 hours. Control for unfinished reels: – Store unused packages in a sealed MBB with desiccant or a desiccator at <5% RH. Control of assembled boards: – If the PCB soldered with the packages is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or a desiccator at <5% RH to ensure that all packages have not exceeded their floor life of 168 hours. Baking is required if: – The HIC indicates a change in color for 10% and 5%, as stated on the HIC. – The LEDs are exposed to conditions of >30°C/60% RH at any time. – The LED’s floor life exceeds 168 hours. The recommended baking condition is 60±5ºC for 20 hours. Baking can be done only once. Application Precautions If the package is intended to be used in a harsh or outdoor environment, protect it against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stresses, and so on. 10 SEC. MAX. 6°C/SEC. MAX. 255 – 260°C 3°C/SEC. MAX. 217°C 200°C 150°C 3°C/SEC. MAX. 60 – 120 SEC. 60 SEC. MAX. TIME TEMPERATURE
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