HSSR-8060 HP | Alldatasheet

Document overview

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Technical content

Features

  • Compact Solid-State Bidirectional Switch
  • Normally-Off Single-Pole Relay Function (1 Form A)
  • 60 V Output Withstand Voltage in Both Polarities at
  • 0.75/1.5 Amp Current Ratings (See Schematic for Connections A & B)
  • Low Input Current; CMOS Compatibility
  • Very Low On-resistance: 0.4 Ω Typical at 25°C
  • ac/dc Signal and Power Switching
  • Input-to-Output Momentary Withstand Insulation Voltage: 2500 Vac, 1 Minute
  • 16-kV ESD Immunity: MIL- STD-883, Method 3015
  • IEEE Surge Withstand Capability (IEEE STD 472-1974)
  • CSA Approved
  • UL 508 Approved

Applications

  • Programmable Logic Controllers CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Functional Diagram TRUTH TABLE (POSITIVE LOGIC) LED ON OFF OUTPUT L H H 5965-3575E

6-Pin DIP 4-Pin DIP Maximum ON Output Output Hermetic (300 Mil) (300 Mil) Speed Resistance Voltage Current Minimum 8-Pin Single Dual t(ON) R(ON) VO(off) Io(ON) Input Single Channel Channel msec Ω V mA Current Channel Package Package 25 °C2 5 °C2 5 °C2 5 °C mA Packages HSSR-8400[1] 0.95 10 400 150 5 HSSR-8060 1.4 0.7 60 750 5 HSSR-8200[1] 1.5 200 200 40 1 6 1 90 800 5 HSSR-7110 [1] Note: 1. Technical data are on separate HP publication.

Ordering Information

Specify part number followed by Option Number (if desired). HSSR-8060#XXX 300 = Gull Wing Surface Mount Lead Option 500 = Tape/Reel Package Option (1 k min.) Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information. Schematic IF VF SWITCH DRIVER 5

6-pin DIP Package (HSSR-8060) 9.40 (0.370) 9.90 (0.390) PIN ONE DOT HP RXXXX YYWW TYPE NUMBER DATE CODE 2.16 (0.085) 2.80 (0.110) 0.51 (0.020) MIN. 0.45 (0.018) 0.65 (0.025) 4.70 (0.185) MAX. 2.92 (0.115) MIN. 6.10 (0.240) 6.60 (0.260) 0.20 (0.008) 0.33 (0.013) 5° TYP. 7.36 (0.290) 7.88 (0.310) DIMENSIONS IN MILLIMETERS AND (INCHES). 321 1.78 (0.070) MAX.

Figure 1. Maximum Solder Reflow Thermal Profile.

Insulation and Safety Related Specifications Parameter Symbol Value Units Conditions Min. External Air Gap L(IO1) 7.0 mm Measured from input terminals to output (External Clearance) terminals, shortest distance through air Min. External Tracking Path L(IO2) 8.5 mm Measured from input terminals to output (External Creepage) terminals, shortest distance path along body Min. Internal Plastic Gap 0.5 mm Through insulation distance, conductor to (Internal Clearance) conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity Tracking Resistance CTI 200 V DIN IEC 112/VDE 0303 PART 1 (Comparative Tracking Index) Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 – surface mount classification is Class A in accordance with CECC 00802. Absolute Maximum Ratings (Pulse Width ≤ 1 ms; duty cycle ≤ 50%) (Pulse Width ≤ 200 µs; duty cycle ≤ 1%) Output Voltage (T A = 25°C) Average Output Current - Figure 3 (TA = 25°C, TC ≤ 70°C) Single Shot Peak Output Current (100 ms pulse width, TA = 25°C, IF = 10 mA) Infrared and Vapor Phase Reflow Temperature Thermal Resistance Typical Output MOSFET Junction to Case – θ JC = 55°C/W Demonstrated ESD Performance Human Body Model: MIL-STD- 883 Method 3015.7 - 16 kV Machine Model: EIAJ 1988.3.28 Version 2), Test Method 20, Condition C – 1200 V Surge Withstand Capability IEEE STD 472-1974

For -40oC ≤ TA ≤ +85°C unless otherwise specified. All Typicals at TA = 25°C. Connec- Output A |V O(OFF)|6 0 V V F = 0.8 V, IO = 250 µA, 5 Withstand T A = 25°C Voltage 55 V F = 0.8 V, IO = 250 µA AR (ON) 0.4 0.7 Ω 6,7 3 B 0.1 0.2 A 1.6 I F = 10 mA, IO = 750 mA B 0.4 Output A I O(OFF) 10-4 1.0 µAV F = 0.8 V, VO = 60 V, 13 Leakage T A = 25°C Current Output Off- A C (OFF) 135 pF V F = 0.8 V, VO = 25 V, 14 Capacitance f = 1 MHz Output Off- A |V OS|1 µVI F = 5 mA, IO = 0 mA 18 4 set Voltage Input Reverse V R 3V I R = 100 µA Breakdown Voltage Input V F 1.3 1.6 1.85 V I F = 10 mA, TA = 25°C1 5 Forward Voltage Input Diode ΔVF/ΔTA -1.3 mV/ oCI F = 10 mA Temperature Coefficient Input C IN 72 pF V F = 0 V, f = 1 MHz Capacitance Recommended Operating Conditions Parameter Symbol Min. Max. Units Input Current (ON) I F(ON) 52 0 m A Input Voltage (OFF) V F(OFF) 0 0.8 Volt Operating Temperature T A -40 +85 °C Output Voltage Connection A V O(OFF) -55 55 Volt Connection B 0 55 Output Current Connection A I O(ON) -0.75 0.75 A Connection B -1.5 1.5 Output On- Resistance (pulse duration ≤ 30 ms) IF = 10 mA, IO = 750 mA (pulse duration ≤ 30 ms), TA = 25oC

For -40°C ≤ TA ≤ +85°C with Connection A, unless otherwise specified. All Typicals at TA = 25°C. Parameter Symbol Min. Typ. Max. Units Test Conditions Fig. Notes Turn On Time t ON 0.93 1.4 ms I F = 10 mA, VDD = 60 V , 2,8, 7 IO = 750 mA, TA = 25°C 9,10, 1.8 ms I F = 10 mA, VDD = 55 V , IO = 750 mA Turn Off Time t OFF 0.013 0.1 ms I F = 10 mA, VDD = 60 V, 2,8, IO = 750 mA, TA = 25°C 11,12, 0.1 ms I F = 10 mA, VDD = 55 V, IO = 750 mA Output |dV O/dt| 1000 V/ µsV (peak) = 60 V, RM ≥ 1 MΩ ,1 6 Transient C M = 1000 pF, TA = 25°C Rejection Input-Output |dV I-O /dt| 2500 V/ µsV DD = 5 V, VI-O(peak) = 1000 V, 17 Transient R L = 1 kΩ , CL = 25 pF, Rejection T A = 25°C Package Characteristics For 0°C ≤ TA ≤ 70°C, unless otherwise specified. All typicals at TA = 25°C. Parameter Symbol Min. Typ. Max. Units Test Conditions Fig. Notes Input-Output V ISO 2500 V rms RH ≤ 50%, t = 1 min, TA = 25°C 5,6 Momentary With- stand Voltage* Resistance R I-O 100 G Ω VI-O = 500 Vdc, t = 1 min, 5 Input-Output RH = 45% Capacitance C I-O 1.0 pF V I-O = 0 V, f = 1 MHz 5 Input-Output *The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification, or HP Application Note 1074, “Optocoupler Input-Output Endurance Voltage.” 20,21 Notes: 1. The case temperature, TC, is measured at the center of the bottom of the package. 2. For derating, see Figure 4. The output power P O derating curve is obtained when the part is handling the maximum average output current IO as shown in Figure 3. 3. During the pulsed RON measurement (IO duration ≤ 30 ms), ambient (TA) and case temperature (TC) are equal. 4. VOS is a function of IF, and is defined between pins 4 and 6, with pin 4 as the reference. VOS must be measured in a stable ambient (free of temperature gradients). 5. Device considered a two terminal device: pins 1, 2, and 3 shorted together and pins 4, 5, and 6 shorted together. 6. This is a momentary withstand proof test. These parts are 100% tested in production at 3000 V rms, one second. 7. For a faster turn-on time, the optional peaking circuit shown in Figure 2 may be implemented. 20,21