HSSR711X HP | Alldatasheet

Document overview

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Technical content

Features

  • Dual Marked with Device Part Number and DSCC Standard Microcircuit Drawing
  • ac/dc Signal & Power Switching
  • Compact Solid-State Bidirectional Switch
  • Manufactured and Tested on a MIL-PRF-38534 Certified Line
  • QML-38534
  • MIL-PRF-38534 Class H
  • Space Level Processing Available
  • Hermetically Sealed 8-Pin Dual In-Line Package
  • Small Size and Weight
  • Performance Guaranteed over -55 °C to +125°C
  • Connection A 0.8 A, 1.0 Ω
  • Connection B 1.6 A, 0.25 Ω
  • 1500 Vdc Withstand Test Voltage
  • High Transient Immunity
  • 5 Amp Output Surge Current

Applications

  • Military and Space
  • High Reliability Systems
  • Standard 28 Vdc and 48 Vdc Load Driver
  • Standard 24 Vac Load Driver
  • Aircraft Controls
  • ac/dc Electromechanical and Solid State Relay Replacement
  • I/O Modules
  • Harsh Industrial Environments eight-pin, hermetic, dual-in-line, ceramic packages. The devices operate exactly like a solid-state relay. The products are capable of operation and storage over the full military temperature range and can be purchased as a standard product (HSSR-7110), with full MIL-PRF-38534 Class H testing (HSSR-7111), or from the DSCC Standard Microcircuit Drawing (SMD) 5962-93140. These devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details. Standard Microcircuit (SMD) parts are available for each lead style.

Description

The HSSR-7110, HSSR-7111 and SMD 5962-9314001 are single channel power MOSFET optocouplers, constructed in Functional Diagrams TRUTH TABLE INPUT OUTPUT H CLOSED L OPEN CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. HSSR-711X* 5962-9314001 *See matrix for available extensions CONNECTION A AC/DC CONNECTION NC NC CONNECTION B DC CONNECTION IF VF IO VO NC NC IF VF IO VO

All devices are manufactured and tested on a MIL-PRF-38534 certi- fied line and are included in the DSCC Qualified Manufacturers List, QML-38534 for Hybrid Microcircuits. Each device contains an AlGaAs light emitting diode optically coupled to a photovoltaic diode stack which drives two discrete power MOSFETs. The device operates as a solid-state replacement for single-pole, normally open, (1 Form A) relays used for general purpose switching of signals and loads in high reliability applications. The devices feature logic level input control and very low output on-resistance, making them suitable for both ac and dc loads. Connection A, as shown in the Functional Diagram, allows the device to switch either ac or dc loads. Connection B, with the polarity and pin configuration as shown, allows the device to switch dc loads only. The advantage of Connection B is that the on-resistance is significantly reduced, and the output current capability increases by a factor of two. The devices are convenient replacements for mechanical and solid state relays where high component reliability with standard footprint lead configu- ration is desirable. Devices may be purchased with a variety of lead bend and plating options. See Selection Guide table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. The HSSR-7110, HSSR-7111, and SMD 5962-93140 are designed to switch loads on 28 Vdc power systems. They meet 80 V surge and ± 600 V spike requirements. Outline Drawing 8-pin DIP Through Hole Selection Guide–Package Styles and Lead Configuration Options HP Part # and Options Commercial HSSR-7110 MIL-PRF-38534 Class H HSSR-7111 Standard Lead Finish Gold Solder Dipped Option #200 Butt Joint/Gold Plate Option #100 Gull Wing/Soldered Option #300 Crew Cut/Gold Plate Option #600 SMD Part # Prescript for all below 5962- Either Gold or Soldered 9314001HPX Gold Plate 9314001HPC Solder Dipped 9314001HPA Butt Joint/Gold Plate 9314001HYC Butt Joint/Soldered 9314001HYA Gull Wing/Soldered 9314001HXA Crew Cut/Gold Plate 9314001HZC Crew Cut/Soldered 9314001HZA /n00/n00 /n00/n00/n00/n00 /n00/n00 3.81 (0.150) MIN. 4.32 (0.170) MAX. 9.40 (0.370) 9.91 (0.390) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 0.76 (0.030) 1.27 (0.050) 8.13 (0.320) MAX. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) 7.16 (0.282) 7.57 (0.298) NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

Recommended Operating Conditions Parameter Symbol Min. Max. Units Input Current (on) I F(ON) 52 0 m A Input Voltage (off) V F(OFF) 0 0.6 V Operating Temperature T A -55 +125 °C Device Marking Absolute Maximum Ratings (1.6 mm below seating plane) (Pulse Width < 100 ms; duty cycle < 50%) (Pulse Width < 0.2 ms; duty cycle < 0.1%) Average Output Current – Figure 2 Single Shot Output Current – Figure 3 Output Voltage Thermal Resistance Maximum Output MOSFET Junction to Case – θJC = 15°C/W ESD Classification COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) HP QYYWWZ XXXXXX XXXXXXX XXX USA 50434 COUNTRY OF MFR. HP FSCN* HP LOGO DSCC SMD* PIN ONE/ ESD IDENT HP P/N DSCC SMD* * QUALIFIED PARTS ONLY

Hermetic Optocoupler Options 100 Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product. 200 Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product. DSCC Drawing part numbers contain provisions for lead finish. 300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product. This option has solder dipped leads. 600 Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product. Note: Dimensions in millimeters (inches). /n00/n00/n00/n00 /n00/n00/n00 1.14 (0.045) 1.40 (0.055) 4.32 (0.170) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) /n00/n00/n00 /n00/n00/n00 0.51 (0.020) MIN. 4.57 (0.180) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 1.40 (0.055) 1.65 (0.065) 9.65 (0.380) 9.91 (0.390) 5° MAX. 4.57 (0.180) MAX. 0.20 (0.008) 0.33 (0.013) /n00/n00/n00 /n00/n00/n00 3.81 (0.150) MAX. 1.02 (0.040) TYP. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013)

TA =-55°C to +125°C, unless otherwise specified. See note 9. Group A, Sub- Output Withstand | V O(OFF)| 1, 2, 3 V F = 0.6 V, IO = 10 µA 90 110 V 5 Voltage Output Connection R (ON) 1, 2, 3 I F = 10 mA, IO = 800 mA, 0.40 1.0 Ω 6,7 3 On- A (pulse duration ≤ 30 ms) Resistance Connection I F = 10 mA, IO = 1.6 A, 0.12 0.25 B (pulse duration ≤ 30 ms) Output Leakage I O(OFF) 1, 2, 3 V F = 0.6 V, VO = 90 V , 10 -4 10 µA8 Current Input Forward V F 1, 2, 3 I F = 10 mA 1.0 1.24 1.7 V 9 Voltage Input Reverse V R 1, 2, 3 I R = 100 µA 5.0 V Breakdown Voltage Input-Output I I-O 1 RH ≤ 45%, t = 5 s, 1.0 µA 4, 5 Insulation V I-O = 1500 Vdc, TA = 25°C Turn On Time t ON 9, 10, 11 I F = 10 mA, VDD = 28 V, 1.25 6.0 ms 1,10, IO = 800 mA 11,12, Turn Off Time t OFF 9,10,11 I F = 10 mA, 0.02 0.25 ms 1,10, VDD = 28 V, IO = 800 mA 14,15 Output Transient dVo 9 V PEAK = 50 V, 1000 V/ µs1 7 Rejection dt C M = 1000 pF, CL = 15 pF, RM ≥ 1 MΩ Input-Output dVio 9 V DD = 5 V, 500 V/ µs1 8 Transient Rejection dt V I–O(PEAK) = 50 V, RL = 20 kΩ , CL = 15 pF *All typical values are at TA = 25°C, IF(ON) = 10 mA, VF(OFF) = 0.6 V unless otherwise specified.

maximum case temperature, and maximum junction temperature. Figure 1. Recommended Input Circuit. All typical values are at TA = 25°C, IF(ON) = 10 mA, VF(OFF) = 0.6 V unless otherwise specified.

  1. Maximum junction to case thermal resistance for the device is 15°C/W, where case temperature, TC, is measured at the center of the
  2. For rating, see Figure 4. The output power PO rating curve is obtained when the part is handling the maximum average output current
  3. During the pulsed RON measurement (IO duration <30 ms), ambient (TA) and case temperature (TC) are equal.
  4. Device considered a two terminal device: pins 1 through 4 shorted together and pins 5 through 8 shorted together.
  5. This is a momentary withstand test, not an operating condition.
  6. For a faster turn-on time, the optional peaking circuit shown in Figure 1 may be implemented.

(free of temperature gradients).

  1. Zero-bias capacitance measured between the LED anode and cathode.
  2. Standard parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD and class H parts receive 100% testing at 25°C, 125°C and

-55°C (Subgroups 1 and 9, 2 and 10, 3 and 11 respectively). R3, C = OPTIONAL PEAKING CIRCUIT.

Figure 17. Output Transient Rejection Test Circuit. OVERSHOOT ON V PEAK IS TO BE 10%.

Output Circuit: Unlike electro- mechanical relays, the designer should pay careful attention to the output on-resistance of solid state relays. The previous section, ”On- Resistance and Rating Curves” describes the issues that need to be considered. In addition, for strictly dc applications the designer has an advantage using Connection B which has twice the output current rating as Connec- tion A. Furthermore, for dc-only applications, with Connection B the on-resistance is considerably less when compared to Connection A. Output over-voltage protection is yet another important design consideration when replacing electro-mechanical relays with the HSSR-7110. The output power MOSFETs can be protected using Metal oxide varistors (MOVs) or TransZorbs against voltage surges that exceed the 90 volt output withstand voltage rating. Examples of sources of voltage surges are inductive load kick- backs, lightning strikes, and electro-static voltages that exceed the specifications on this data sheet. For more information on output load and protection refer to Application Note 1047. References: 1. Application Note 1047, ”Low On-Resistance Solid State Relays for High Reliability Applications.” 2. Reliability Data for HSSR-7110. MOV is a registered trademark of GE/RCA Solid State. TransZorb is a registered trademark of General Semiconductor. MIL-PRF-38534 Class H and DSCC SMD Test Program Hewlett-Packard’s Hi-Rel Optocouplers are in compliance with MIL-PRF-38534 Class H. Class H devices are also in compliance with DSCC drawing 5962-93140. Testing consists of 100% screen- ing and quality conformance inspection to MIL-PRF-38534. www.hp.com/go/isolator For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright © 1998 Hewlett-Packard Co. Obsoletes 5965-1142E Printed in U.S.A. 5968-0470E (7/98) 610 mA. A check with Figure 4 shows that the output power dissipation at T A = 95°C and IO = 610 mA, will be limited to less than 0.35 W. This yields an R SS of 0.94 Ω . Design Considerations for Replacement of Electro-Mechanical Relays The HSSR-7110 family can replace electro-mechanical relays with comparable output voltage and current ratings. The following design issues need to be consid- ered in the replacement circuit. Input Circuit: The drive circuit of the electro-mechanical relay coil needs to be modified so that the average forward current driving the LED of the HSSR- 7110 does not exceed 20 mA. A nominal forward drive current of 10 mA is recommended. A recommended drive circuit with 5 volt V CC and CMOS logic gates is shown in Figure 1. If higher VCC voltages are used, adjust the current limiting resistor to a nominal LED forward current of 10 mA. One important considera- tion to note is that when the LED is turned off, no more than 0.6 volt forward bias should be applied across the LED. Even a few microamps of current may be sufficient to turn on the HSSR- 7110, although it may take a considerable time. The drive circuit should maintain at least 5 mA of LED current during the ON condition. If the LED forward current is less than the 5 mA level, it will cause the HSSR-7110 to turn on with a longer delay. In addition, the power dissipation in the output power MOSFETs increases, which, in turn, may violate the power dissipation guidelines and affect the reliability of the device.