HSP45102_05 INTERSIL | Alldatasheet

Document overview

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Technical content

Features

 33MHz, 40MHz Versions  32-Bit Frequency Control  BFSK, QPSK Modulation  Serial Frequency Load  12-Bit Sine Output  Offset Binary Output Format  0.009Hz Tuning Resolution at 40MHz  Spurious Frequency Components <-69dBc  Fully Static CMOS L o w C o s t  Pb-Free Plus Anneal Available (RoHS Compliant)

Applications

 Direct Digital Synthesis  Modulation  PSK Communications  Related Products - HI5731 12-Bit, 100MHz D/A Converter Block Diagram

Ordering Information

PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. # HSP45102SC-33 HSP45102SC-33 0 to 70 28 Ld SOIC M28.3 HSP45102SC-33Z (Note) HSP45102SC-33Z 0 to 70 28 Ld SOIC (Pb-free) M28.3 HSP45102SC-40 HSP45102SC-40 0 to 70 28 Ld SOIC M28.3 HSP45102SC-40Z (Note) HSP45102SC-40Z 0 to 70 28 Ld SOIC (Pb-free) M28.3 HSP45102SI-3396 28 Ld SOIC Tape and Reel M28.3 PHASE ACCUMULATOR FREQUENCY CONTROL SECTION PHASE OFFSET ADDER SINE ROM CLK PO-1 OUT0-11 MSB/LSB SFTEN SD SCLK LOAD TXFR SEL_L/M ENPHAC 13 12 Data Sheet September 6, 2005 FN2810.8 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 1999, 2004, 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners.

28 LEAD PDIP, 28 LEAD SOIC

VCC +5V power supply pin. GND Ground P0-1 I Phase modulation inputs (become active after a pipel ine delay of four clocks). A phase shift of 0, 90, 180, or 270 degrees can be selected as shown in Table 1. CLK I NCO clock. (CMOS level) SCLK I This pin clocks the frequency control shift register. SEL_L/M I A high on this input selects the least significant 32 bits of the 64-bit frequency register as the input to the phase accumulator; a low selects the most significant 32 bits. SFTEN I The active low input enables the shifting of the frequency register. MSB/LSB I This input selects the shift direction of the frequency register. A low on this input shifts in the data LSB first; a high shifts in the data MSB first. ENPHAC I This pin, when low, enables the clocking of the Phase Accumulator. This input has a pipeline delay of four clocks. SD I Data on this pin is shifted into the frequency r egister by the rising edge of SCLK when SFTEN is low. TXFR I This active low input is clocked onto the chip by CLK and becomes active after a pipeline delay of four clocks. When low, the frequency control word selected by SEL_L/M is transferred from the frequency register to the phase accumulator’s input register. LOAD I This input becomes active after a pipeline delay of five clocks. When low, the feedback in the phase accumulator is zeroed. OUT0-11 O Output data. OUT0 is LSB. Unsigned. All inputs are TTL level, with the exception of CLK. Overline designates active low signals. OUT6 OUT7 OUT8 OUT9 OUT10 OUT11 GND VCC SEL_L/M SFTEN MSB/LSB ENPHAC SD SCLK OUT5 OUT3 OUT2 OUT1 OUT0 GND LOAD TXFR CLK GND OUT4 VCC HSP45102

Absolute Maximum Ratings TA =2 5 ° C Thermal Information Operating Conditions Operating Voltage Range (Commercial, Industrial) . . +4.75V to +5.25V Thermal Resistance (Typical, Note 1) θ JA (°C/W) (SOIC - Lead Tips Only) Die Characteristics CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. PARAMETER SYMBOL TEST CONDITIONS MIN MAX UNITS Logical One Input Voltage V IH VCC = 5.25V 2.0 - V Logical Zero Input Voltage V IL VCC = 4.75V - 0.8 V High Level Clock Input V IHC VCC = 5.25V 3.0 - V Low Level Clock Input V ILC VCC = 4.75V - 0.8 V Output HIGH Voltage V OH IOH = -400µA, VCC = 4.75V 2.6 - V Output LOW Voltage V OL IOL = +2.0mA, VCC = 4.75V - 0.4 V Input Leakage Current I I VIN = VCC or GND, VCC = 5.25V -10 10 µA Standby Power Supply Current I CCSB VIN = VCC or GND, VCC = 5.25V, Note 4 - 500 µA Operating Power Supply Current I CCOP f = 33MHz, VIN = VCC or GND VCC = 5.25V, Notes 2 and 4 -9 9 m A Capacitance TA = 25°C, Note 3 PARAMETER SYMBOL TEST CONDITIONS MIN MAX UNITS Input Capacitance C IN FREQ = 1MHz, VCC = Open. All measure- ments are referenced to device ground -1 0 p F Output Capacitance C O -1 0 p F NOTES: 2. Power supply current is proportional to operating frequency. Typical rating for ICCOP is 3mA/MHz. 3. Not tested, but characterized at initial design and at major process/design changes. 4. Output load per test load circuit with switch open and CL = 40pF. HSP45102

-33 (33MHz) -40 (40MHz) UNITSMIN MAX MIN MAX Clock Period t CP 30 - 25 - ns Clock High t CH 12 - 10 - ns Clock Low t CL 12 - 10 - ns SCLK High/Low t SW 12 - 10 - ns Setup Time SD to SCLK Going High t DS 12 - 12 - ns Hold Time SD from SCLK Going High t DH 0-0- n s Setup Time SFTEN, MSB/LSB to SCLK Going High t MS 15 - 12 - ns Hold Time SFTEN, MSB/LSB from SCLK Going High t MH 0-0- n s Setup Time SCLK High to CLK Going High t SS Note 6 16 - 15 - ns Setup Time P0-1 to CLK Going High t PS 15 - 12 - ns Hold Time P0-1 from CLK Going High t PH 1-1- n s Setup Time LOAD, TXFR, ENPHAC , SEL_L/M to CLK Going High tES 15 - 13 - ns Hold Time LOAD, TXFR, ENPHAC , SEL_L/M from CLK Going High tEH 1-1- n s CLK to Output Delay t OH 21 521 3 n s Output Rise, Fall Time t RF Note 7 8 - 8 - ns NOTES: 5. AC testing is performed as follows: Input levels (CLK Input) 4.0V and 0V; Input levels (all other inputs) 0V and 3.0V; Timing reference levels and VOL < 1.5V. 6. If TXFR is active, care must be taken to not violate setup and hold times as data from the shift registers may not have settled before CLK occurs. 7. Controlled via design or process parameters and not directly tested. Characterized upon initial design and after major process and/or design changes. EQUIVALENT CIRCUIT C L (NOTE) IOH 1.5V I OL DUT SWITCH S1 OPEN FOR I CCSB AND ICCOP NOTE: Test head capacitance. HSP45102

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnishe d by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com Waveforms FIGURE 4. tCP tCLtCH tPS tPH tES tEH tOH tRF tSW tSS tDS tDH tMHtMS tSW CLK SCLK SD MSB/LSB , P0-1 OUT0-11 ENPHAC , SEL_L/M LOAD , TXFR, SFTEN HSP45102