HSP181-2W3Y STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: STMICROELECTRONICS
- PDF pages: 14
Technical content
Features
- AEC-Q101 qualified
- Flow-through routing to keep signal integrity
- Large bandwidth: 1.7 GHz
- Ultra low capacitance: 2.1 pF
- Operating junction temperature range: -55 °C to 150 °C
- RoHS compliant and halogen free
- Complies with ISO ISO 10605 / IEC 61000-4-2 - C = 150 pF, R = 330 Ω exceeds level 4 – ±12 kV (contact discharge) – ±30 kV (air discharge)
- Complies with ISO 10605 - C = 330 pF, R = 330 Ω – ±10 kV (contact discharge) – ±30 kV (air discharge)
- Complies with ISO 10605 - C = 330 pF, R = 2 kΩ – ±30 kV (contact discharge) – ±30 kV (air discharge) Application
- USB 1.1 and USB2.0
- NFC
- Other high speed signals
Description
The HSP181-2W3Y is an ESD array designed for high-speed differential lines. The VRM at 18 V makes it compatible with a short-to-battery hazard in vehicles. The HSP181-2W3Y is also compatible with the maximum signal voltage (18 V) on the antenna of NFC readers and can thus efficiently protect NFC antenna I/O of NFC ICs. The 2.1 pF low parasitic capacitance and the 1.7 GHz bandwidth provides enough room to preserve the signal integrity of USB 2.0 or NFC signals. The HSP181-2W3Y is housed in SOT323-3L. SOT323-3L (Jedec TO-236) Functional diagram Product status link HSP181-2W3Y Product summary Order code HSP181-2W3Y Marking H8Y Packing Tape and reel Automotive grade 18 V dual-line high speed port protection HSP181-2W3Y Datasheet DS13792 - Rev 3 - June 2022 For further information contact your local STMicroelectronics sales office.
1 Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C) Figure 1. Electrical characteristics - parameter definitions
Table 2. Electrical characteristics (values) (Tamb = 25° C)
1.1 Characteristics (curves)
Figure 2. Leakage current versus junction temperature Figure 3. Junction capacitance versus reverse applied Figure 4. ESD response to ISO 10605 - C = 150 pF, Figure 5. ESD response to ISO 10605 - C = 150 pF, Figure 6. TLP Figure 7. S21 attenuation
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 SOT323-3L package information
- Epoxy meets UL 94,V0
- Lead-free package
Figure 14. SOT323-3L package outline
Package information
Table 3. SOT323-3L package mechanical data
- Values in inches are converted from mm and rounded to 3 or 4 decimal digits.
2.2 Packing and marking information
Figure 15. Marking layout (refer to ordering information Figure 16. Package orientation in reel Figure 17. Tape leader and trailer dimensions Figure 18. Tape and reel orientation Figure 19. Reel dimensions (mm) Figure 20. Inner box dimensions (mm)
Figure 21. Tape outline Table 4. Tape and reel mechanical data
3 Recommendation on PCB assembly
3.1 Recommended footprint
Figure 22. Recommended footprint in mm
3.2 Stencil opening design
Figure 23. Stencil opening recommendations
3.3 Solder paste
- Halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
- “No clean” solder paste recommended.
- Tack force high enough to resist component displacement during PCB movement.
- Particles size 20-38 µm per IPCJ STD-005.
3.4 Placement
- It is recommended to use leads recognition instead of package outline for accurate placement on footprint
with adequate resolution tool.
- Tolerance of ±50 µm is recommended.
- 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste
and solder paste that could cause open solder joints or badly centered packages.
- For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder
paste printing, pick and place and reflow soldering by using optimized tools.
3.5 PCB design preference
- Any via around or inside the footprint area must be closed to avoid solderpaste migration in the via.
- Position and dimensions of the tracks should be well balanced. A symmetrical layout is recommended to
3.6 Reflow profile
Figure 24. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement.
4 Ordering information
Table 5. Ordering information
- The marking can be rotated by multiples of 90° to differentiate assembly location
Ordering information
DS13792 - Rev 3 page 12/14
Revision history
Table 6. Document revision history 29-Sep-2021 1 Initial release. 27-Jun-2022 3 Added Figure 12 and Figure 13.
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