HSP061-8M16 STMICROELECTRONICS | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 10

Technical content

Features

■ ultralarge bandwidth: 6.3 GHz ■ ultralow capacitance: 0.6 pF ■ low time domain reflection ■ low leakage current: 100 nA at 25 °C ■ extended operating junction temperature range: -40 °C to 150 °C ■ package size in mm: 3.3 x 1.5 x 0.55 ■ RoHS compliant Benefits ■ high ESD robustness of the equipment ■ suitable for high density boards Complies with following standards ■ MIL-STD 883G Method 3015-7 Class 3B: –8 k V ■ IEC 61000-4-2 level 4: – 8 kV (contact discharge) – 15 kV (air discharge)

Applications

The HSP061-8M16 is designed to protect against electrostatic discharge on sub micron technology circuits driving: ■ HDMI 1.3 and 1.4 ■ Digital Video Interface ■ Display Port ■ Serial ATA Figure 1. Functional schematic (top view)

Description

The HSP061-8M16 is an 8-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The ultra-low variation of the capacitance ensures very low influence on signal-skew. The large bandwidth and the low reflection make it compatible with 3.4 Gbps. The device is packaged in µQFN-16L with a 400 µm pitch, which minimizes the PCB area. µQFN-16L In 1 In 2 In 3 In 4 In 5 In 6 In 7 In 8 Out 1 Out 2 Out 3 Out 4 Out 5 Out 6 Out 7 Out 8 GND on tab

1 Characteristics

Table 1. Absolute maximum ratings T amb = 25 °C Table 2. Electrical characteristics T amb = 25 °C

  1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office.

Figure 2. Leakage current versus junction Figure 3. S21 attenuation measurement Figure 4. Differential impedance (Z diff)(1) Figure 5. Eye diagram, HDMI mask, at

3.4 Gbps per channel(1)

  1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office.

Figure 6. ESD response to IEC 61000-4-2 Figure 7. ESD response to IEC 61000-4-2

50 V / div

20 GS / s

2 Ordering information scheme

Figure 8. Ordering information scheme

3 Package information

  • Epoxy meets UL94, V0
  • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

Table 3. µQFN-16L dimensions Figure 9. Footprint recommendations Figure 10. Marking

Figure 11. µQFN-16L tape and reel specification

4 Recommendation on PCB assembly

Figure 12. Recommended stencil window position

4.1 Solder paste

  1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
  2. “No clean” solder paste recommended.
  3. Offers a high tack force to resist component displacement during PCB movement.
  4. Use solder paste with fine particles: powder particle size 20-45 µm.

4.2 Placement

  1. Manual positioning is not recommended.
  2. It is recommended to use the lead recognition capabilities of the placement system, not
  3. Standard tolerance of ± 0.05 mm is recommended.
  4. 3.5 N placement force is recommended. Too much placement force can lead to

open solder joints or badly centered packages.

  1. To improve the package placement accuracy, a bottom side optical control should be

performed with a high resolution tool.

  1. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is

4.3 PCB design

  1. To control the solder paste amount, the closed via is recommended instead of open
  2. The position of tracks and open vias in the solder area should be well balanced. The

asymmetrical solder paste amount due to the solder flow away. Figure 13. Printed circuit board layout recommendations

4.4 Reflow profile

Figure 14. ST ECOPACK ® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement.

5 Ordering information

6 Revision history

Table 4. Ordering information Table 5. Document revision history 19-Nov-2010 1 Initial release.