HSP061-2M6 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Features

  • Flow-through routing to keep signal integrity
  • Ultralarge bandwidth: 6 GHz
  • Ultralow capacitance: 0.6 pF
  • Low leakage current: 100 nA at 25 °C
  • Extended operating junction temperature range: -40 °C to 150 °C
  • RoHS compliant Benefits
  • High ESD robustness of the equipment
  • Suitable for high density boards Complies with following standards
  • MIL-STD 883G Method 3015-7 Class 3B: –8 k V
  • IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge)

Applications

The HSP061-2 series is designed to protect against electrostatic discharge on sub micron technology circuits driving:

  • HDMI 1.3 and 1.4
  • Digital Video Interface
  • Display Port
  • USB 3.0
  • Serial ATA
  • Ethernet
  • HMI

Description

The HSP061-2 is a 2-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes it compatible with 5 Gbps. The HSP061-2P6 is housed in SOT-666. The HSP061-2M6 is packaged in µQFN-6L (1.45 x 1.0 mm) with a 500 µm pitch. The HSP061-2N4 is packaged in µQFN-4L (1.0 x 0.8 mm) with a 400 µm pitch. HSP061-2M6 µQFN-6L HSP061-2N4 µQFN-4L HSP061-2P6 SOT-666 1 6 2 5 3 4 I/O1 I/O1 GND VBUS I/O2 I/O2 116 2 5 3 4 I/O1 I/O1 GND V BUS I/O2 I/O2 µQFN 6 leads µQFN 4 leads SOT666 I/O1 NC GND I/O2 NC

1 Characteristics

Table 1. Absolute maximum ratings Tamb = 25 °C Table 2. Electrical characteristics Tamb = 25 °C

2 Ordering information scheme

Figure 10. Ordering information scheme Figure 8. ESD response to IEC 61000-4-2 Figure 9. ESD response to IEC 61000-4-2

3 Package information

  • Epoxy meets UL94, V0
  • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

Table 3. SOT-666 dimensions Figure 11. Footprint recommendations Figure 12. Marking for SOT-666

4 Recommendation on PCB assembly

4.1 Stencil opening design

  1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 17. Stencil opening dimensions b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 18. Recommended stencil window position for µQFN-6L

Figure 19. Recommended stencil window position for µQFN-4L

4.2 Solder paste

  1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
  2. “No clean” solder paste is recommended.
  3. Offers a high tack force to resist component movement during high speed.
  4. Solder paste with fine particles: powder particle size is 20-45 µm.

4.3 Placement

  1. Manual positioning is not recommended.
  2. It is recommended to use the lead recognition capabilities of the placement system, not
  3. Standard tolerance of ± 0.05 mm is recommended.
  4. 3.5 N placement force is recommended. Too much placement force can lead to

open solder joints or badly centered packages.

  1. To improve the package placement accuracy, a bottom side optical control should be

performed with a high resolution tool.

  1. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is

4.4 PCB design preference

  1. To control the solder paste amount, the closed via is recommended instead of open
  2. The position of tracks and open vias in the solder area should be well balanced. The

asymmetrical solder paste amount due to the solder flow away.

4.5 Reflow profile

Figure 20. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement.

5 Ordering information

6 Revision history

Table 6. Ordering information

  1. The marking can be rotated by multiple of 90° to differentiate assembly location

Table 7. Document revision history 07-Feb-2012 1 Initial release. 19-Mar-2014 2 Minor text changes.