HSP051-2W3Y STMICROELECTRONICS | Alldatasheet

Document overview

  • Manufacturer or author: STMICROELECTRONICS
  • PDF pages: 12

Technical content

Features

  • AEC-Q101 qualified
  • Flow-through routing to keep signal integrity
  • Ultra large bandwidth: 3 GHz
  • Ultra low capacitance: 0.7 pF
  • Extended operating junction temperature range: -40 °C to 150 °C
  • RoHS compliant
  • Complies with ISO 10605 - C = 150 pF, R = 330 Ω exceeds level 4 – ±12 kV (contact discharge) – ±15 kV (air discharge)
  • Complies with ISO 10605 - C = 330 pF, R = 330 Ω – ±8 kV (contact discharge) – ±12 kV (air discharge) Application The HSP051-2W3Y is designed to protect against electrostatic discharge on automotive circuits such as:
  • APIX
  • LVDS & digital video interface
  • Ethernet and BroadrReach
  • USB 2.0 and USB 3.0
  • High speed communication buses

Description

The HSP051-2W3Y is an ESD array designed for high-speed differential lines protection. The ultralow capacitance variation ensures negligible influence on signal-skew. Product status link HSP051-2W3Y Product summary Order code HSP051-2W3Y Marking H5Y Packing Tape and reel Automotive 2-line ESD protection for high speed lines HSP051-2W3Y Datasheet DS12686 - Rev 1 - July 2018 For further information contact your local STMicroelectronics sales office.

1 Characteristics

Table 1. Absolute maximum ratings (Tamb = 25 °C) Figure 1. Electrical characteristics - parameter definitions Table 2. Electrical characteristics (values) (Tamb = 25° C)

1.1 Characteristics (curves)

Figure 2. Leakage current versus junction temperature Figure 3. Junction capacitance versus reverse applied Figure 4. ESD response to ISO 10605 - C = 150 pF, R = Figure 5. ESD response to ISO 10605 - C = 150 pF, R = Figure 6. TLP Figure 7. S21 attenuation

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

2.1 SOT323-3L package information

  • Epoxy meets UL 94,V0
  • Lead-free package

Figure 12. SOT323-3L package outline

Package information

Table 4. Tape dimension values

3 Recommendation on PCB assembly

3.1 Reflow profile

Figure 20. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement.

4 Ordering information

Figure 21. Ordering information scheme Table 5. Ordering information

  1. The marking can be rotated by multiples of 90° to differentiate assembly location

Ordering information

DS12686 - Rev 1 page 10/12

Revision history

Table 6. Document revision history 10-Jul-2018 1 Initial release.