HSMS-2812-TR2

HSMS-281X HP | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 10

Technical content

Features

• Surface Mount Packages
• Low Flicker Noise
• Low FIT (Failure in Time) Rate*
• Six-sigma Quality Level
• Single, Dual and Quad Versions
• Tape and Reel Options Available
• Lead-free Option Available * For more information see the Surface Mount Schottky Reliability Data Sheet. Description/Applications These Schottky diodes are specifically designed for both analog and digital applications. This series offers a wide range of specifications and package configurations to give the designer wide flexibility. The HSMS-281x series of diodes features very low flicker (1/f) noise. Note that Agilent’s manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match. Package Lead Code Identification, SOT-23/SOT-143 (Top View) COMMON CATHODE UNCONNECTED PAIR COMMON ANODE SERIES SINGLE RING QUAD #712 BRIDGE QUAD #812 Package Lead Code Identification, SOT-323 (Top View) Package Lead Code Identification, SOT-363 (Top View) COMMON CATHODE F COMMON ANODE E SERIES C SINGLE B UNCONNECTED TRIO L 123 654 HIGH ISOLATION UNCONNECTED PAIR K 123 654 Notes: 1. Package marking provides orientation and identification. 2. See “Electrical Specifications” for appropriate package marking. Pin Connections and Package Marking GUx1

Electrical Specifications TC = 25°C, Single Diode[4] Maximum Maximum Minimum Maximum Forward Reverse Typical Part Package Breakdown Forward Voltage Leakage Maximum Dynamic Number Marking Lead Voltage Voltage V F (V) @ I R (nA) @ Capacitance Resistance HSMS[5] Code Code Configuration V BR (V) V F (mV) I F (mA) V R (V) C T (pF) R D (ΩΩΩΩΩ)[6] 2810 B0 [3] 0 Single 20 400 1.0 35 200 15 1.2 15

2812 B2 [3] 2 Series

2813 B3 [3] 3 Common Anode

2814 B4 [3] 4 Common Cathode

2815 B5 [3] 5 Unconnected Pair

2817 B7 [3] 7 Ring Quad [5]

2818 B8 [3] 8 Bridge Quad [5]

281B B0 [7] B Single 281C B2 [7] C Series 281E B3 [7] E Common Anode 281F B4 [7] F Common Cathode 281K BK [7] K High Isolation Unconnected Pair 281L BL [7] L Unconnected Trio Test Conditions I R = 10 µAI F = 1 mA V F = 0 V I F = 5 mA f = 1 MHz Notes: 1. ∆VF for diodes in pairs and quads in 15 mV maximum at 1 mA. 2. ∆CTO for diodes in pairs and quads is 0.2 pF maximum. 3. Package marking code is in white. 4. Effective Carrier Lifetime (τ) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA. 5. See section titled “Quad Capacitance.” 6. RD = RS + 5.2 Ω at 25°C and If = 5 mA. 7. Package marking code is laser marked. Absolute Maximum Ratings[1] TC = 25°C Symbol Parameter Unit SOT-23/SOT-143 SOT-323/SOT-363 If Forward Current (1 µs Pulse) Amp 1 1 PIV Peak Inverse Voltage V Same as V BR Same as VBR Tj Junction Temperature °C 150 150 Tstg Storage Temperature °C -65 to 150 -65 to 150 θjc Thermal Resistance[2] °C/W 500 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. T C = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.

Capacitance of Schottky diode quads is measured using an HP4271 LCR meter. This instrument effectively isolates individual diode branches from the others, allowing accurate capacitance measurement of each branch or each diode. The conditions are: 20 mV R.M.S. voltage at 1 MHz. Agilent defines this measurement as “CM”, and it is equivalent to the capacitance of the diode by itself. The equivalent diagonal and adjacent capacitances can then be calculated by the formulas given below. In a quad, the diagonal capaci- tance is the capacitance between points A and B as shown in the figure below. The diagonal capacitance is calculated using the following formula C C1 + C2 C3 + C4 C2 C4 A B C The equivalent adjacent capacitance is the capacitance between points A and C in the figure below. This capacitance is calculated using the following formula C2 C3 C4 SPICE Parameters Parameter Units HSMS-281x BV V2 5 CJ0 pF 1.1 EG eV 0.69 IBV AE - 5 IS A 4.8E -9 N 1.08 RS Ω 10 PB V 0.65 PT 2 M 0.5 Cj Rj RS Rj = 8.33 X 10-5 nT Ib + Is where Ib = externally applied bias current in amps Is = saturation current (see table of SPICE parameters) T = temperature, °K n = ideality factor (see table of SPICE parameters) Note: To effectively model the packaged HSMS-281x product, please refer to Application Note AN1124. RS = series resistance (see Table of SPICE parameters) Cj = junction capacitance (see Table of SPICE parameters) Linear Equivalent Circuit, Diode Chip

Figure 8. Surface Mount Assembly Profile. ing solvents from the solder paste. produce a reflow of the solder.

Part Number Ordering Information No. of Part Number Devices Container HSMS-281x-TR2* 10000 13" Reel HSMS-281x-TR1* 3000 7" Reel HSMS-281x-BLK * 100 antistatic bag For lead-free option, the part number will have the character "G" at the end, eg. HSMS-281x-TR2G for a 10,000 lead-free reel. Package Dimensions Outline 23 (SOT-23) Outline 143 (SOT-143) 1 2 SIDE VIEW TOP VIEW END VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) 1.02 (0.040) 0.89 (0.035) 0.60 (0.024) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 3.06 (0.120) 2.80 (0.110) 2.04 (0.080) 1.78 (0.070) 1.02 (0.041) 0.85 (0.033) 0.152 (0.006) 0.066 (0.003) 0.10 (0.004) 0.013 (0.0005) 0.69 (0.027) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) X X X PACKAGE MARKING CODE (XX) DATE CODE (X) 0.69 (0.027) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) 0.10 (0.004) 0.013 (0.0005) 1.04 (0.041) 0.85 (0.033) 0.92 (0.036) 0.78 (0.031) 2.04 (0.080) 1.78 (0.070) DIMENSIONS ARE IN MILLIMETERS (INCHES) 0.15 (0.006) 0.09 (0.003) 3.06 (0.120) 2.80 (0.110) PACKAGE MARKING CODE (XX) X X X DATE CODE (X) Outline SOT-363 (SC-70 6 Lead) Outline SOT-323 (SC-70 3 Lead) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) REF. 0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 REF. 10° 0.425 (0.017) TYP. DIMENSIONS ARE IN MILLIMETERS (INCHES) PACKAGE MARKING CODE (XX) X X X DATE CODE (X) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) REF. 0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 REF. 10° 0.425 (0.017) TYP. DIMENSIONS ARE IN MILLIMETERS (INCHES) PACKAGE MARKING CODE (XX) X X X DATE CODE (X)

Note: "AB" represents package marking code. "C" represents date code. END VIEW 8 mm 4 mm TOP VIEW ABC ABC ABC ABC For Outlines SOT-23, -323 Note: "AB" represents package marking code. "C" represents date code. END VIEW 8 mm 4 mm TOP VIEW ABC ABC ABC ABC END VIEW 8 mm 4 mm TOP VIEW Note: "AB" represents package marking code. "C" represents date code. ABC ABC ABC ABC For Outline SOT-363

Tape Dimensions and Product Orientation For Outline SOT-23 9° MAX P D P2 E F W Ko 8° MAX 13.5° MAX DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER P 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 CAVITY DIAMETER PITCH POSITION D P E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W 8.00 + 0.30 – 0.10 0.229 ± 0.013 0.315 + 0.012 – 0.004 0.009 ± 0.0005 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE BETWEEN CENTERLINE For Outline SOT-143 WF E P2P0 DP DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER P 3.19 ± 0.10 2.80 ± 0.10 1.31 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.126 ± 0.004 0.110 ± 0.004 0.052 ± 0.004 0.157 ± 0.004 0.039 + 0.010 CAVITY DIAMETER PITCH POSITION D P E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W 8.00 + 0.30 – 0.10 0.254 ± 0.013 0.315+ 0.012 – 0.004 0.0100 ± 0.0005 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE 9° MAX 9 ° MAX

www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5968-7649E March 24, 2004 5989-0475EN Tape Dimensions and Product Orientation For Outlines SOT-323, -363 P F W C D E An t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) An DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A P D 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.157 ± 0.004 0.039 + 0.010 CAVITY DIAMETER PITCH POSITION D P E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W t 8.00 ± 0.30 0.254 ± 0.02 0.315 ± 0.012 0.0100 ± 0.0008 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE FOR SOT-323 (SC70-3 LEAD) An 8 °C MAX FOR SOT-363 (SC70-6 LEAD) 10 °C MAX ANGLE WIDTH TAPE THICKNESS C T t 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 COVER TAPE