HSMS-2700 HP | Alldatasheet

Document overview

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Technical content

Features

  • Ultra-low Series Resistance for Higher Current Handling
  • Picosecond Switching
  • Low Capacitance
  • Lead-free Option Available

Applications

RF and computer designs that require circuit protection, high- speed switching, and voltage clamping. Package Lead Code Identification (Top View)

Description

The HSMS-2700 series of Schottky diodes, commonly referred to as clipping /clamping diodes, are optimal for circuit and waveshape preservation applications with high speed switching. Ultra-low series resistance, R S, makes them ideal for protecting sensitive circuit elements against higher current transients carried on data lines. With picosecond switching, the HSMS-270x can respond to noise spikes with rise times as fast as 1 ns. Low capacitance mini- mizes waveshape loss that causes signal degradation. HSMS-2700/-2702 -270B/-270C SERIES 2, C SINGLE 0, B12 HSMS-270x DC Electrical Specifications, TA = +25°C[1] Maximum Minimum Typical Maximum Part Package Forward Breakdown Typical Series Eff. Carrier Number Marking Lead Voltage Voltage Capacitance Resistance Lifetime HSMS- Code [2] Code Configuration Package V F (mV) V BR (V) C T (pF) R S (Ω) τ (ps) -2700 Single SOT-23 -270B B SOT-323 (3-lead SC-70) -2702 2 SOT-23 -270C C Series SOT-323 (3-lead SC-70) Notes: 1. T A = +25°C, where TA is defined to be the temperature at the package pins where contact is made to the circuit board. 2. Package marking code is laser marked. 3. I F = 100 mA; 100% tested 4. I F = 100 µA; 100% tested 5. V F = 0; f =1 MHz 6. Measured with Karkauer method at 20 mA; guaranteed by design.

Absolute Maximum Ratings, TA= 25ºC Symbol Parameter Unit Absolute Maximum [1] HSMS-2700/-2702 HSMS-270B/-270C IF DC Forward Current mA 350 750 IF-peak Peak Surge Current (1µs pulse) A 1.0 1.0 PT Total Power Dissipation mW 250 825 PINV Peak Inverse Voltage V 15 15 TJ Junction Temperature °C 150 150 TSTG Storage Temperature °C -65 to 150 -65 to 150 θJC Thermal Resistance, junction to lead °C/W 500 150 Note: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. RS 0.08 pF SPICE model 2 nH Linear and Non-linear SPICE Model SPICE Parameters Parameter Unit Value BV V 25 CJO pF 6.7 EG eV 0.55 IBV A 10E-4 IS A 1.4E-7 N 1.04 RS Ω 0.65 PB V 0.6 PT 2 M 0.5

Tape Dimensions and Product Orientation For Outline SOT-23 1 2 SIDE VIEW TOP VIEW END VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) 1.02 (0.040) 0.89 (0.035) 0.60 (0.024) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 3.06 (0.120) 2.80 (0.110) 2.04 (0.080) 1.78 (0.070) 1.02 (0.041) 0.85 (0.033) 0.152 (0.006) 0.066 (0.003) 0.10 (0.004) 0.013 (0.0005) 0.69 (0.027) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) X X X PACKAGE MARKING CODE (XX) DATE CODE (X) Device Orientation For Outlines SOT-23/323 Note: "AB" represents package marking code. "C" represents date code. END VIEW 8 mm 4 mm TOP VIEW ABC ABC ABC ABC USER FEED DIRECTION COVER TAPE CARRIER TAPE REEL 9° MAX P D P2 E F W Ko 8° MAX 13.5° MAX DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER P 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 CAVITY DIAMETER PITCH POSITION D P E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W 8.00 + 0.30 – 0.10 0.229 ± 0.013 0.315 + 0.012 – 0.004 0.009 ± 0.0005 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE BETWEEN CENTERLINE

Outline SOT-323 (SC-70 3 Lead) Tape Dimensions and Product Orientation For Outline SOT-323 (SC-70 3 Lead) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) REF. 0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 REF. 10° 0.425 (0.017) TYP. DIMENSIONS ARE IN MILLIMETERS (INCHES) PACKAGE MARKING CODE (XX) X X X DATE CODE (X) P F W C D E 8° MAX. t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) 8° MAX. DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A P 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.157 ± 0.004 0.039 + 0.010 CAVITY DIAMETER PITCH POSITION D P E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W 8.00 ± 0.30 0.254 ± 0.02 0.315 ± 0.012 0.0100 ± 0.0008 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE WIDTH TAPE THICKNESS C Tt 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 COVER TAPE

The key factors in these equations are: RS, the series resistance of the diode where heat is generated under high current conditions; θ chip, the chip thermal resistance of the Schottky die; and θpackage, or the package thermal resistance. RS for the HSMS-270x family of diodes is typically 0.7 Ω and is the lowest of any Schottky diode available from Agilent. Chip thermal resistance is typically 40°C/W; the thermal resistance of the iron-alloy-leadframe, SOT-23 package is typically 460°C/W; and the thermal resistance of the copper-leadframe, SOT-323 package is typically 110°C/W. The impact of package thermal Part Number Ordering Information Part Number No. of Devices Container HSMS-2700-BLK 100 Antistatic Bag HSMS-2700-TR1 3,000 7" Reel HSMS-2700-TR2 10,000 13" Reel HSMS-2702-BLK 100 Antistatic Bag HSMS-2702-TR1 3,000 7" Reel HSMS-2702-TR2 10,000 13" Reel HSMS-270B-BLK 100 Antistatic Bag HSMS-270B-TR1 3,000 7" Reel HSMS-270B-TR2 10,000 13" Reel HSMS-270C-BLK 100 Antistatic Bag HSMS-270C-TR1 3,000 7" Reel HSMS-270C-TR2 10,000 13" Reel resistance on the current handling capability of these diodes can be seen in Figures 3 and 4. Here the computed values of junction temperature vs. forward current are shown for three values of ambient temperature. The SOT- 323 products, with their copper leadframes, can safely handle almost twice the current of the larger SOT-23 diodes. Note that the term “ambient temperature” refers to the temperature of the diode’s leads, not the air around the circuit board. It can be seen that the HSMS-270B and HSMS-270C products in the SOT-323 package will safely withstand a steady-state forward current of 550 mA when the diode’s terminals are maintained at 75°C. For pulsed currents and transient current spikes of less than one microsecond in duration, the junction does not have time to reach thermal steady state. Moreover, the diode junction may be taken to temperatures higher than 150°C for short time-periods without impacting device MTTF. Because of these factors, higher currents can be safely handled. The HSMS-270x family has the highest current handling capabil- ity of any Agilent diode. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5968-2351E March 24, 2004 5989-0473EN Note: For lead-free option, the part number will have the character "G" at the end, eg. HSMS-270x-TR2G for a 10,000 lead-free reel.