HSMP-3860

HSMP-386X HP | Alldatasheet

Document overview

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• PDF pages: 9

Technical content

Features

• Unique Configurations in Surface Mount Packages – Add Flexibility – Save Board Space – Reduce Cost
• Switching – Low Distortion Switching – Low Capacitance
• Attenuating – Low Current Attenuating for Less Power Consumption
• Matched Diodes for Consistent Performance
• Better Thermal Conductivity for Higher Power Dissipation
• Low Failure in Time (FIT) Rate [1]
• Lead-free Option Available Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. HSMP-386x Series Description/Applications The HSMP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. The HSMP-386x series Total Capacitance (C T) and Total Resistance (RT) are typical specifi- cations. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime. Notes: 1. Package marking provides orientation, identification, and date code. 2. See “Electrical Specifications” for appropriate package marking. Pin Connections and Package Marking, SOT-363 LUx1

Identification, SOT-23 (Top View) Package Lead Code Identification, SOT-323 (Top View) COMMON CATHODE COMMON ANODE SERIES SINGLE COMMON CATHODE F COMMON ANODE E SERIES C SINGLE B Package Lead Code Identification, SOT-363 (Top View) UNCONNECTED TRIO L 123 654 Electrical Specifications TC = 25°C, each diode PIN General Purpose Diodes, Typical Specifications T A = 25°C Package Minimum Typical Typical Part Number Marking Lead Breakdown Series Resistance Total Capacitance HSMP- Code Code Configuration Voltage V BR (V) R S (Ω)C T (pF) 3860 L0 [1] 0 Single 50 3.0/1.5* 0.20

3862 L2 [1] 2 Series

3863 L3 [1] 3 Common Anode

3864 L4 [1] 4 Common Cathode

386B L0 [2] B Single 386C L2 [2] C Series 386E L3 [2] E Common Anode 386F L4 [2] F Common Cathode 386L LL [2] L Unconnected Trio Test Conditions V R = VBR IF = 10 mA VR = 50 V Measure f = 100 MHz f = 1 MHz IR ≤ 10 µA IF = 100 mA* Notes: 1. Package marking code is laser marked. Absolute Maximum Ratings[1] TC = +25°C Symbol Parameter Unit SOT-23 SOT-323 If Forward Current (1 µs Pulse) Amp 1 1 PIV Peak Inverse Voltage V 50 50 Tj Junction Temperature °C 150 150 Tstg Storage Temperature °C -65 to 150 -65 to 150 θjc Thermal Resistance [2] °C/W 500 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. T C = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.

Figure 1. RF Capacitance vs. Reverse

1 GHz

100 MHz

1 MHz

Figure 3. 2nd Harmonic Input Figure 4. Reverse Recovery Time vs. Figure 2. Typical RF Resistance vs. Figure 5. Forward Current vs.

Outline SOT-323 (SC-70, 3 Lead) Package Characteristics Outline 23 (SOT-23) Outline 363 (SC-70, 6 Lead) 1 2 SIDE VIEW TOP VIEW END VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) 1.02 (0.040) 0.89 (0.035) 0.60 (0.024) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 3.06 (0.120) 2.80 (0.110) 2.04 (0.080) 1.78 (0.070) 1.02 (0.041) 0.85 (0.033) 0.152 (0.006) 0.066 (0.003) 0.10 (0.004) 0.013 (0.0005) 0.69 (0.027) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) X X X PACKAGE MARKING CODE (XX) DATE CODE (X) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) REF. 0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 REF. 10° 0.425 (0.017) TYP. DIMENSIONS ARE IN MILLIMETERS (INCHES) PACKAGE MARKING CODE (XX) X X X DATE CODE (X) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) REF. 0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 REF. 10° 0.425 (0.017) TYP. DIMENSIONS ARE IN MILLIMETERS (INCHES) PACKAGE MARKING CODE (XX) X X X DATE CODE (X)

Tape Dimensions and Product Orientation For Outline SOT-23 For Outlines SOT-23, -323 Note: "AB" represents package marking code. "C" represents date code. END VIEW 8 mm 4 mm TOP VIEW ABC ABC ABC ABC END VIEW 8 mm 4 mm TOP VIEW Note: "AB" represents package marking code. "C" represents date code. ABC ABC ABC ABC For Outline SOT-363 9° MAX P D P2 E F W Ko 8° MAX 13.5° MAX DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER P 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 CAVITY DIAMETER PITCH POSITION D P E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W 8.00 + 0.30 – 0.10 0.229 ± 0.013 0.315 + 0.012 – 0.004 0.009 ± 0.0005 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE BETWEEN CENTERLINE

Tape Dimensions and Product Orientation For Outlines SOT-323, -363 P F W C D E An t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) An DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A P D 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.157 ± 0.004 0.039 + 0.010 CAVITY DIAMETER PITCH POSITION D P E 1.55 ± 0.05 4.00 ± 0.10 1.75 ± 0.10 0.061 ± 0.002 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W t 8.00 ± 0.30 0.254 ± 0.02 0.315 ± 0.012 0.0100 ± 0.0008 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE FOR SOT-323 (SC70-3 LEAD) An 8 °C MAX FOR SOT-363 (SC70-6 LEAD) 10 °C MAX ANGLE WIDTH TAPE THICKNESS C T t 5.4 ± 0.10 0.062 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 COVER TAPE www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5988-7917EN March 24, 2004 5989-0485EN