HSMP-3830

HSMP-38XX HP | Alldatasheet

Document overview

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• PDF pages: 12

Technical content

Features

• Diodes Optimized for: Low Current Switching Low Distortion Attenuating Ultra-Low Distortion Switching Microwave Frequency Operation
• Surface Mount SOT-23 and SOT-143 Packages Single and Dual Versions Tape and Reel Options Available
• Low Failure in Time (FIT) Rate [1] Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. HSMP-38XX and HSMP-48XX Series Package Lead Code Identification COMMON CATHODE UNCONNECTED PAIR COMMON ANODE SERIES SINGLE DUAL ANODE DUAL CATHODE required. The HSMP-48XX series are special products featuring ultra low parasitic inductance in the SOT-23 package, specifically designed for use at frequencies which are much higher than the upper limit for conventional SOT-23 PIN diodes. The HSMP-4810 diode is a low distor- tion attenuating PIN designed for operation to 3 GHz. The HSMP-4820 diode is ideal for limiting and low inductance switching applications up to 1.5 GHz. The HSMP-4890 is optimized for low current switch- ing applications up to 3 GHz. The HSMP-386X series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low cost is the driving issue for the designer. The HSMP-386X series Total Capacitance (C T) and Total Resistance (RT) are typical specifications. For applications that require guaranteed perfor- mance, the general purpose HSMP-383X series is recom- mended. For low distortion Description/Applications The HSMP-380X and HSMP-381X series are specifically designed for low distortion attenuator applica- tions. The HSMP-382X series is optimized for switching applica- tions where ultra-low resistance is required. The HSMP-3880 switch- ing diode is an ultra low distortion device optimized for higher power applications from 50 MHz to 1.5 GHz. The HSMP-389X series is optimized for switching applica- tions where low resistance at low current and low capacitance are attenuators, the HSMP-380X or -381X series are recommended. For high performance switching applications, the HSMP-389X series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime.

Absolute Maximum Ratings[1] TA = 25°C Symbol Parameter Units Absolute Maximum If Forward Current (1 ms Pulse) Amp 1 Pt Total Device Dissipation mW [2] 250 Piv Peak Inverse Voltage — Same as V BR Tj Junction Temperature °C 150 TSTG Storage Temperature °C -65 to 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to this device. 2. CW Power Dissipation at T LEAD = 25°C. Derate to zero at maximum rated temperature. PIN Switching Diodes Electrical Specifications TA = 25°C Nearest Maximum Equivalent Minimum Maximum Maximum Shunt Mode Part Package Axial Lead Breakdown Series Total Harmonic Number Marking Lead Part No. Voltage Resistance Capacitance Distortion HSMP- Code [1] Code Configuration 5082- V BR (V) R S (Ω )C T (pF) Hmd (dBc) 3820 F0 0 Single 3188 50 0.6* 0.8* —

3822 F2 2 Series

3823 F3 3 Common Anode

3824 F4 4 Common Cathode

3880 S0 0 Single — 100 6.5 0.40 –55 3890 G0 0 Single — 100 2.5 0.30** —

3892 G2 2 Series

3893 G3 3 Common Anode

3894 G4 4 Common Cathode

3895 G5 5 Unconnected Pair

Test Conditions V R = VBR IF = 5 mA V R = 50 V 2 f o, Zo = 50 W Measure f = 100 MHz f = 1 MHz f o = 400 MHz IR ≤ 10 µAI F = 10 mA* V R = 20 V* P in = +30 dBm VR = 5 V** 0 V bias Note: 1. Package marking code is white. PIN Attenuator Diodes Electrical Specifications T A = 25°C (Each Diode) Nearest Equivalent Minimum Maximum Maximum Minimum Maximum Part Package Axial Lead Breakdown Series Total High Low Number Marking Lead Part No. Voltage Resistance Capacitance Resistance Resistance HSMP- Code [1] Code Configuration 5082- V BR (V) R S (Ω )C T (pF) R H (Ω )R L (Ω ) 3800 D0 0 Single 3080 100 2.0 0.37 1000 8

3802 D2 2 Series

3804 D4 4 Common Cathode

3810 E0 0 Single 3081 100 3.0 0.35 1500 10

3812 E2 2 Series

3813 E3 3 Common Anode

3814 E4 4 Common Cathode

Test Conditions V R = VBR IF = 100 mA V R = 50 V I F = 0.01 mA I F = 20 mA Measure f = 100 MHz f = 1 MHz f = 100 MHz f= 100 MHz IR ≤ 10 µA

PIN General Purpose Diodes, Electrical Specifications T A = 25°C Nearest Equivalent Minimum Maximum Maximum Part Package Axial Lead Breakdown Series Total Number Marking Lead Part No. Voltage Resistance Capacitance HSMP- Code [1] Code Configuration 5082- V BR (V) R S (Ω )C T (pF) 3830 K0 0 Single 3077 200 1.5 0.3

3832 K2 2 Series

3833 K3 3 Common Anode

3834 K4 4 Common Cathode

R = VBR IF = 100 mA V R = 50 V Measure f = 100 MHz f = 1 MHz IR ≤ 10 mA High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes, Electrical Specifications T A = 25°C Minimum Maximum Typical Maximum Typical Break- Series Total Total Total Part Package down Resis- Capaci- Capaci- Induc- Number Marking Lead Config- Voltage tance tance tance tance Appli- HSMP- Code Code uration V BR (V) R S (Ω )C T (pF) C T (pF) L T (nH) cation 4810 EB B Dual 100 3.0 0.35 0.4 1.0 Attenu- Cathode ator 4820 FA A Dual Anode 50 0.6* 0.75* 1.0 1.0* Limiter 4890 GA A Dual Anode 100 2.5** 0.33 0.375 1.0 Switch VR = VBR IF = 100 mA V R = 50 V V R = 50 V f = 500 MHz – Measure I F = 10 mA* f = 1 MHz f = 1 MHz 3 GHz IR ≤ 10 µAI F = 5 mA** V R = 20 V* V R = 0 V V R = 20 V* PIN General Purpose Diodes, Typical Specifications T A = 25°C Code Minimum Typical Series Typical Total Part Number Marking Lead Breakdown Resistance Capacitance HSMP- Code [1] Code Configuration Voltage V BR (V) R S (Ω )C T (pF) 3860 L0 0 Single 50 3.0/1.5* 0.20

3862 L2 2 Series

3863 L3 3 Common Anode

3864 L4 4 Common Cathode

R = VBR IF = 10 mA V R = 50 V Measure f = 100 MHz f = 1 MHz IR ≤ 10 µA *IF = 100 mA Typical Parameters at TA = 25°C Part Number Series Resistance Carrier Lifetime Reverse Recovery Time Total Capacitance HSMP- R S (Ω ) τ (ns) T rr (ns) C T (pF) 380X 55 1800 500 0.32 @ 50 V 381X 75 1500 300 0.27 @ 50 V 382X 1.5 70* 7 0.60 @ 20 V 383X 20 500 80 0.20 @ 50 V 388X 3.8 2500 550 0.30 @ 50 V 389X 3.8 200* – 0.20 @ 5 V Test Conditions I F = 1 mA I F = 50 mA V R = 10 V f = 100 MHz I R = 250 mA I F = 20 mA IF = 10 mA* I F = 10 mA* 90% Recovery IR = 6 mA* Note: 1. Package marking code is white.

Figure 2. RF Capacitance vs. Reverse Figure 1. RF Capacitance vs. Reverse Figure 3. Resistance at 25°C vs.

1 MHz

30 MHz

1 GHz

100 MHz

Figure 5. RF Resistance vs. Forward Figure 6. Capacitance vs. Reverse Figure 4. RF Resistance vs. Forward Figure 7. 2nd Harmonic Input Figure 8. 2nd Harmonic Input

50 Ohm Microstrip and

Figure 9. Reverse Recovery Time vs.

placed across the resulting gap. compared to a microstrip circuit.

50 OHM MICROSTRIP LINES

Figure 34. Equivalent Circuit.Figure 33. Circuit Layout. Figure 36. Equivalent Circuit.Figure 35. Circuit Layout.

Outline 23 (SOT-23) PC Board Footprints SOT-23 0.037 0.95 0.037 0.95 0.079 2.0 0.031 0.8 DIMENSIONS IN inches mm 0.035 0.9 Package Characteristics SOT-143 DIMENSIONS IN inches mm 0.075 1.9 0.071 1.8 0.112 2.85 0.079 0.033 0.85 0.041 1.05 0.108 2.75 0.033 0.85 0.047 1.2 0.031 0.8 0.033 0.85 Outline 143 (SOT-143) 1 2 SIDE VIEW TOP VIEW END VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) 1.02 (0.040) 0.89 (0.035) 0.50 (0.024) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 3.06 (0.120) 2.80 (0.110) 2.04 (0.080) 1.78 (0.070) 1.02 (0.041) 0.85 (0.033) 0.152 (0.006) 0.066 (0.003) 0.10 (0.004) 0.013 (0.0005) 0.69 (0.027) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) X X X PACKAGE MARKING CODE (XX) DATE CODE (X) 0.69 (0.027) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 0.60 (0.024) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) 0.10 (0.004) 0.013 (0.0005) 1.04 (0.041) 0.85 (0.033) 0.92 (0.036) 0.78 (0.031) 2.04 (0.080) 1.78 (0.070) DIMENSIONS ARE IN MILLIMETERS (INCHES) 0.15 (0.006) 0.09 (0.003) 3.06 (0.120) 2.80 (0.110) PACKAGE MARKING CODE (XX) BE CE X X X DATE CODE (X)