HSMP-381C

HSMP-381B HP | Alldatasheet

Document overview

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Technical content

Features

• Diodes Optimized for: Low Current Switching Low Distortion Attenuating Ultra-Low Distortion Switching Microwave Frequency Operation
• Surface Mount SOT-323 (SC-70)Package Single and Pair Versions Tape and Reel Options Available
• Low Failure in Time (FIT) Rate* * For more information see the Surface Mount PIN Reliability Data Sheet. Package Lead Code Identification (Top View) Description/Applications The HSMP-381B/C/E/F series is specifically designed for low distortion attenuator applications. The HSMP-386B/C/E/F series is a general purpose PIN diode designed for low current attenua- tors and low cost switches. The HSMP-389B/C/E/F series is optimized for switching applica- tions where low resistance at low current, and low capacitance are required. The HSMP-48XB series is special products featuring ultra low parasitic inductance in the SOT- 323 package, specifically designed for use at frequencies which are much higher than the upper limit for conventional SOT-323 PIN diodes. The HSMP-481B diode is a low distortion attenuating PIN designed for operation to 3 GHz. The HSMP-482B diode is ideal for limiting and low inductance switching applications up to 1.5 GHz. The HSMP-489B is optimized for low current switch- ing applications up to 3 GHz. COMMON CATHODE F COMMON ANODE E SERIES C SINGLE B DUAL ANODE 482B/489B DUAL CATHODE 481B HSMP-381B/C/E/F HSMP-386B/C/E/F HSMP-389B/C/E/F HSMP-481B, -482B, -489B Absolute Maximum Ratings[1], TC = + 25°C Symbol Parameter Unit Absolute Maximum If Forward Current (1 µs Pulse) Amp 1 Piv Peak Inverse Voltage V Same as V BR TJ Junction Temperature °C 150 TSTG Storage Temperature °C -65 to 150 θjc Thermal Resistance[2] °C/W 300 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. T C = 25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.

Electrical Specifications, TC = +25°C, each diode PIN Attenuator Diodes Minimum Maximum Maximum Minimum Maximum Part Package Breakdown Total Total High Low Number Marking Lead Voltage Resistance Capacitance Resistance Resistance HSMP- Code [1] Code Configuration V BR (V) R T (Ω )C T (pF) R H (Ω )R L (Ω ) 381B E0 B Single 100 3.0 0.35 1500 10 381C E2 C Series 381E E3 E Common Anode 381F E4 F Common Cathode Test Conditions VR = VBR IF = 100 mA V R = 50 V I R = 0.01 mA I F = 20 mA Measure f = 100 MHz f = 1 MHz f = 100 MHz f = 100 MHz IR ≤ 10 µA PIN General Purpose Diodes Minimum Typical Typical Part Package Breakdown Total Total Number Marking Lead Voltage Resistance Capacitance HSMP- Code [1] Code Configuration V BR (V) R T (Ω )C T (pF) 386B L0 B Single 50 3.0 1.5* 0.20 386C L2 C Series 386E L3 E Common Anode 386F L4 F Common Cathode Test Conditions V R = VBR IF = 10 mA V R = 50 V Measure f = 100 MHz f = 1 MHz IR ≤ 10 µAI F = 100 mA* PIN Switching Diodes Minimum Maximum Maximum Part Package Breakdown Total Total Number Marking Lead Voltage Resistance Capacitance HSMP- Code [1] Code Configuration V BR (V) R T (Ω )C T (pF) 389B G0 B Single 100 2.5 0.30 389C G2 C Series 389E G3 E Common Anode 389F G4 F Common Cathode Test Conditions V R = VBR IF = 5 mA V R = 5 V Measure f = 100 MHz f = 1 MHz IR ≤ 10 µA

Electrical Specifications, TC = +25°C, each diode, continued High Frequency (Low Inductance, 500 MHz–3 GHz PIN Diodes Minimum Maximum Typical Maximum Typical Part Package Breakdown Series Total Total Total Number Marking Voltage Resistance Capacitance Capacitance Inductance HSMP- Code Configuration V BR (V) R S (Ω )C T (pF) C T (pF) L T (nH) Application 481B EB Dual Cathode 100 3.0 0.35 0.4 1.0 Attenuator 482B FA Dual Anode 50 0.6* 0.75* 1.0 1.0* Limiter 489B GA Dual Anode 100 2.5 0.33 0.375* 1.0 Switch Test Conditions V R = VBR IF = 100 mA V R = 50V V R = 50 V f =500 MHz– Measure I F = 10 mA* f = 1 MHz f = 1 MHz 3 GHz IR ≤ 10 µAI F = 5 mA** V R = 20 V* V R = 5 V* V R = 20V* VR = 5 V** Typical Parameters Part Number Total Resistance Carrier Lifetime Reverse Recovery Time Total Capacitance HSMP- R T (Ω ) τ (ns) T rr (ns) (pF) 381A Series 75 1500 300 0.27 386A Series 22 500 80 0.20 389A Series 3.8 200* — — Test Conditions I F = 1 mA I F = 50 mA V R = 10 V 50 V f = 100 MHz T R = 250 mA I F = 20 mA IF = 10 mA* 90% Recovery IR = 6 mA* Note: 1. Package marking code is laser marked.

Figure 2. RF Capacitance vs. Reverse Bias, HSMP-386B/C/E/F Series. Figure 1. RF Capacitance vs. Reverse Bias, HSMP-381B/C/E/F Series.

1 MHz

30 MHz

1 GHz

100 MHz

Figure 3. Total RF Resistance at 25° C vs. Forward Bias Current. Figure 4. RF Resistance vs. Forward Figure 5. Capacitance vs. Reverse Figure 6. 2nd Harmonic Input Resistance for Attenuator Diodes. Figure 7. 2nd Harmonic Input Figure 9. Reverse Recovery Time vs. Voltages. HSMP-386B/C/E/F Series. Figure 8. Reverse Recovery Time vs.

Figure 21. Internal Connections. Figure 22. Circuit Layout. placed across the resulting gap. Figure 23. Circuit Layout.

50 OHM MICROSTRIP LINES

Figure 24. Equivalent Circuit.

Note: “##” represents Package Marking Code. Tape Dimensions For Outline SOT-323 (SC-70 3 Lead) P F W C D 1 D E A 0 8° MAX. t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) 5° MAX. B 0 K 0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A B 0 K 0 P D 1 2.24 – 0.10 2.34 – 0.10 1.22 – 0.10 4.00 – 0.10 1.00 + 0.25 0.088 – 0.004 0.092 – 0.004 0.048 – 0.004 0.157 – 0.004 0.039 + 0.010 CAVITY DIAMETER PITCH POSITION D P E 1.55 – 0.05 4.00 – 0.10 1.75 – 0.10 0.061 – 0.002 0.157 – 0.004 0.069 – 0.004 PERFORATION WIDTH THICKNESS W 8.00 – 0.30 0.255 – 0.013 0.315 – 0.012 0.010 – 0.0005 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 – 0.05 2.00 – 0.05 0.138 – 0.002 0.079 – 0.002 DISTANCE WIDTH TAPE THICKNESS C Tt 5.4 – 0.10 0.062 – 0.001 0.205 – 0.004 0.0025 – 0.00004 COVER TAPE

www.hp.com/go/rf For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 Europe: Call your local HP sales office. Data subject to change. Copyright © 1998 Hewlett-Packard Co. Obsoletes 5966-2323E Printed in U.S.A. 5967-6070E (5/98) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) REF. 0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 REF. 10° 0.425 (0.017) TYP. DIMENSIONS ARE IN MILLIMETERS (INCHES) Package Dimensions Outline SOT-323 (SC-70) Package Characteristics Option – BLK = Bulk, 100 pcs. per antistatic bag Option – TR1 = Tape and Reel, 3000 devices per 7" reel Conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” Standard Quantity is 3,000 Devices per Reel.

Ordering Information

Specify part number followed by option. For example: HSMP- 38XA – XXX Bulk or Tape and Reel Option Part Number Surface Mount PIN Hewlett-Packard