HSMN-A400-S8PM2

HSMC-A400-S30M1 BOARDCOM | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 15

Technical content

Features

 Industry standard PLCC-4  High reliability LED package  High brightness using AlInGaP and InGaN dice technologies  High optical efficiency  Higher ambient temperature at the same current possible compared to PLCC-2  Available in full selection of colors  Super wide viewing angle at 120°  Available in 8-mm carrier tape on 7-inch reel  Compatible with both IR and TTW soldering process  JEDEC MSL 2a  High reliability LED package due to enhanced silicone resin material for InGaN family

Applications

 Interior automotive – Instrument panel backlighting – Central console backlighting – Cabin backlighting – Navigation and audio system – Dome lighting – Push button backlighting  Exterior automotive – Turn signals –C H M S L – Rear combination lamp – Puddle light  Electronic signs and signals – Interior full color sign – Variable message sign HSMx-A4xx-xxxxx SMT LED Surface-Mount LED Indicator

HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator  Office automation, home appliances, industrial equipment – Front panel backlighting – Push button backlighting – Display backlighting Figure 1: Package Dimensions NOTE: All dimensions in millimeters. Electrical connection between all cathodes is recommended. Device Selection Guide Color Part Number Min. IV (mcd)a a. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. IV tolerance = ±12%. Max. IV (mcd) Test Current (mA) Dice Technology Red HSMC-A400-S30M1 180.00 355.00 50 AlInGaP HSMC-A401-U80M1 560.00 1400.00 50 AlInGaP Red Orange HSMJ-A401-T40M1 285.00 715.00 50 AlInGaP HSMJ-A401-U40M1 450.00 1125.00 50 AlInGaP Orange HSML-A401-U40M1 450.00 1125.00 50 AlInGaP Amber HSMA-A401-U45M1 450.00 1125.00 50 AlInGaP Emerald Green HSME-A401-P4PM1 45.00 112.50 50 AlInGaP Blue HSMN-A400-S8QM2 224.00 560.00 30 InGaN HSMN-A400-S8PM2 224.00 560.00 30 InGaN HSMN-A400-S4QM2 180.00 450.00 30 InGaN Green HSMM-A400-W8QM2 1400.00 3550.00 30 InGaN HSMM-A400-W8YM2 1400.00 3550.00 30 InGaN 0.8 ± 0.3 3.5 ± 0.2 2.8 ± 0.2 0.5 ± 0.1 3.2 ± 0.2 2.2 ± 0.2 1.9 ± 0.2 0.1 TYP. 0.8 ± 0.1 CATHODE MARKING AC CC 0.7 ± 0.1 SOURCE 1 AC CC CATHODE MARKING SOURCE 2

HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Part Numbering System Absolute Maximum Ratings (TA = 25°C) Parameters HSMC/J/L/A/E HSMZ/V/U HSMM/N DC Forward Currenta a. Derate linearly as shown in Figure 6. 70 mAb, c b. Drive current between 10 mA and 70 mA is recommended for best long-term performance. c. Operation at currents bel ow 5 mA is not recommended. 70 mAb, c 30 mA Peak Forward Currentd d. Duty factor = 10%, Frequency = 1 kHz. 200 mA 200 mA 90 mA Power Dissipation 180 mW 240 mW 114 mW Reverse Voltage 5V Junction Temperature 110°C Operating Temperature –40°C to +100°C Storage Temperature –40°C to +100°C HSM x1 – A x2 x3x4 – x5x6 x7 x8x9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color

HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Optical Characteristics (TA = 25°C) Electrical Characteristics (TA = 25°C) Color Part Number Peak Wavelength λPEAK (nm) Typ. Dominant Wavelength λD a (nm) Typ. a. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device. Viewing Angle 2Θ1/2 b (Degrees) Typ. b. Θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Luminous Efficacy ηV c (Im/ Typ. c. Radiant intensity, I e in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. Luminous Intensity/Total Flux IV (mcd)/ΦV (mIm) Typ. Red HSMC 635 626 120 150 0.45 HSMZ 639 630 120 155 0.45 Red Orange HSMJ 621 615 120 240 0.45 HSMV 623 617 120 263 0.45 Orange HSML 609 605 120 320 0.45 Amber HSMA 592 590 120 480 0.45 HSMU 594 592 120 500 0.45 Yellow Green HSME 576 575 120 560 0.45 Emerald Green HSME 568 567 120 610 0.45 Green HSMM 518 525 120 500 0.45 Blue HSMN 468 470 120 75 0.45 Part Number Forward Voltage VF (Volts) at IF = 50 mA Reverse Voltage VR at 100 µA Typ. Max. Min. HSMC/J/L/A/E 2.2 2.5 5 HSMZ/V/U 2.8 3.4 5 Part Number Forward Voltage VF (Volts) at IF = 30 mA Reverse Voltage VR at 10 µA Typ. Max. Min. HSMM/N 3.8 4.6 5

HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Broadcom AV02-0479EN Bin Information Intensity Bin Select (X5X6) Individual reel will contain parts from one half bin only. Intensity Bin Limits X5 Min. IV Bin

0 Full Distribution

2 2 half bins starting from X 51 3 3 half bins starting from X 51 4 4 half bins starting from X 51 5 5 half bins starting from X 51 6 2 half bins starting from X 52 7 3 half bins starting from X 52 8 4 half bins starting from X 52 9 5 half bins starting from X 52 Bin ID Min. (mcd) Max. (mcd) N1 28.50 35.50 N2 35.50 45.00 P1 45.00 56.00 P2 56.00 71.50 Q1 71.50 90.00 Q2 90.00 112.50 R1 112.50 140.00 R2 140.00 180.00 S1 180.00 224.00 S2 224.00 285.00 T1 285.00 355.00 T2 355.00 450.00 U1 450.00 560.00 U2 560.00 715.00 V1 715.00 900.00 V2 900.00 1125.00 W1 1125.00 1400.00 W2 1400.00 1800.00 X1 1800.00 2240.00 X2 2240.00 2850.00 Y1 2850.00 3550.00 Y2 3550.00 4500.00 Z1 4500.00 5600.00 Z2 5600.00 7150.00 11 7150.00 9000.00 12 9000.00 11250.00

HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Broadcom AV02-0479EN Color Bin Select (X7) Individual reel will contain parts from one half bin only. Color Bin Limits NOTE: Tolerance of each bin limit = ±1 nm. Q A, B, and C only P B, C, and D only N C, D, and E only M D, E, and F only L E, F, and G only K F, G, and H, only

1 A, B, C, and D only

2 E, F, G, and H only

3 B, C, D, and E only

4 C, D, E, and F only

5 A, B, C, D, and E only

6 B, C, D, E, and F only

Blue Min. (nm) Max. (nm) A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 Green Min. (nm) Max. (nm) A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 D 530.0 535.0 Emerald Green Min. (nm) Max. (nm) A 552.5 555.5 B 555.5 558.5 C 558.5 561.5 D 561.5 564.5 Yellow Green Min. (nm) Max. (nm) A 564.5 567.5 B 567.5 570.5 C 570.5 573.5 D 573.5 576.5 Amber/Yellow Min. (nm) Max. (nm) A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 Orange Min. (nm) Max. (nm) A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 Red Orange Min. (nm) Max. (nm) A 611.0 616.0 B 616.0 620.0 Red Min. (nm) Max. (nm) Full Distribution Emerald Green (Continued) Min. (nm) Max. (nm)

HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Broadcom AV02-0479EN Forward Voltage Bin Table For HSMZ/V/U – A4xx-xxxxx only. Precautionary Notes Handling Precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Special handling precautions need to be observed during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions for additional information.  Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond.  Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body.  Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs.  The surface of the silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting much pressure on the silicone. Ultrasonic cleaning is not recommended.  For automated pick and place, Broadcom has tested the following nozzle size to work well with this LED. However, due to the possibility of variations in other parameters, such as pick and place machine maker/ model and other settings of the machine, verify that the nozzle selected will not cause damage to the LED. Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 2arating per JEDEC J-STD-020. Refer to Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures.  Before use: – An unopened moisture barrier bag (MBB) can be stored at < 40°C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, it is safe to reflow the LEDs per the original MSL rating. – Do not open the MBB d prio r to assembly (IQC for example).  Control after opening the MBB: – Read the HIC immediat ely upon opening the MBB. – Keep the LEDs at <30°C/60% RH at all times and all high temperature-related processes, including soldering, curing, or rework, must be completed within 672 hours.  Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or desiccator at <5% RH.  Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at <5% RH to ensure that all LEDs have not exceeded their floor life of 672 hours.  Baking is required if the following conditions exist: – The HIC indicator is not BROWN at 10% and is AZURE at 5%. – The LEDs are exposed to c onditions of > 30°C/60% RH at any time. – The LED floor life exceeded 168 hours. Bin Min. Max. VA 1.9 2.2 VB 2.2 2.5 VC 2.5 2.8 VD 2.8 3.1 VE 3.1 3.4 ID OD ID = 1.7 mm OD = 3.5 mm

HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Broadcom AV02-0479EN The recommended baking condition is: 60°C ± 5ºC for 20 hours. Baking should only be done once.  Storage: The soldering terminals of these Broadcom LEDs are silver plated. If the LEDs are being exposed in an ambient environment for too long, the silver plating might be oxidized, thus affecting its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in desiccator at <5% RH. Application Precautions  The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance.  LEDs exhibit slightly different characteristics at different drive currents, which might result in larger variation their performance (meaning intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations.  The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED.  Do not use the LED in the vicinity of material with sulfur content, in environments of high gaseous sulfur compounds and corrosive elements. Examples of material that may contain sulfur are rubber gaskets, RTV (room temperature vulcanizing) silicone rubber, rubber gloves, and so on. Prolonged exposure to such environments may affect the optical characteristics and product life.  Avoid rapid change in ambient temperatures, especially in high-humidity environments, because this will cause condensation on the LED.  Although the LED is rated as IPx6 according toIEC60529: Degree of protection provided by enclosure, the test condition may not represent actual exposure during application. If the LED is intended to be used in outdoor or harsh environments, the LED must be protected against damages caused by rain water, dust, oil, corrosive gases, external mechanical stress, and so on. Thermal Management Optical, electrical and reliability characteristics of LED are affected by temperature. The junction temperature (TJ) of the LED must be kept below allowable limit at all times. TJ can be calculated as below: TJ = TA + RθJ-A × IF × VFmax where; TA = Ambient temperature (°C) RθJ-A = Thermal resistance from LED junction to ambient (°C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V) The complication of using this formula lies in TA and RθJ-A. Actual TA is sometimes subjective and hard to determine. RθJ-A varies from system to system depending on design and is usually not known. Another way of calculating TJ is by using solder point temperature TS as follows: TJ = TS + RθJ-S × IF × VFmax where; TS = LED solder point temperature as shown in the following figure (°C) RθJ-S = Thermal resistance from junction to solder point (°C/W) Ts point (Cathode) Source 1 Ts point (Cathode) Source 2

HSMx-A4xx-xxxxx Data Sheet SMT LED Surface-Mount LED Indicator Broadcom AV02-0479EN TS can be measured easily by mounting a thermocouple on the soldering joint as shown in the preceding figure, while RθJ-S is provided in the data sheet. User is advised to verify the TS of the LED in the final product to ensure that the LEDs are operated within all maximum ratings stated in the data sheet. Eye Safety Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs bercause it may be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment.

Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright © 2013–2018 Broadcom. All Rights Reserved. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. Disclaimer Broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use.