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Document overview
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Technical content
Features
LED with AlInGaP / InGaN die Small form factor with individually addressable pin-out for all three colors Compatible with reflow soldering Available in 8-mm carrier tape on 7-in. diameter reels
Applications
Backlighting Indicator CAUTION! This LED is Class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. HSMF-C125 Tri-Color Surface-Mount ChipLED
HSMF-C125 Data Sheet Tri-Color Surface-Mount ChipLED Figure 1: Package Dimensions NOTE: 1. All dimensions are in millimeters. 2. Tolerance ±0.1 mm unless otherwise specified. Absolute Maximum Value at TJ = 25°C Optical Characteristics (TJ = 25°C, IF = 10 mA) Parameter AlInGaP Red InGaN Green InGaN Blue Units DC Forward Currenta, b a. Applies when one color is lit up. b. Derate as shown in Figure 10 20 20 10 mA Power Dissipationa 48 78 39 mW Forward Currentc, d c. Applies when all three colo rs are lit up simultaneously. d. Derate as shown in Figure 11. 15 15 10 mA Power Dissipationc 40 58 39 mW Junction Temperature 95 °C Operating Temperature –40 to +85 °C Storage Temperature –40 to +85 °C Color Luminous Intensity IV (mcd)a a. The luminous intensity, lv, is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with the axis. Dominant Wavelength b (nm) b. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. Peak Wavelength p (nm) Viewing Angle 2θ1/2 c (Degrees) c. θ 1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. Red 45.0 180.0 623 630 130 Green 112.5 360.0 522 515 150 Blue 28.5 112.5 467 461 150
HSMF-C125 Data Sheet Tri-Color Surface-Mount ChipLED Electrical Characteristics at TJ = 25°C, IF = 10 mA) Color Forward Voltage VF (Volts)a a. Forward voltage tolerance: ±0.1V. Reverse Current IR b (µA) at VR = 5V b. Reverse voltage indicates product final test. Long-term reverse bias is not recommended. Thermal Resistance RJ-S (°C/W) Min. Max. Max. Typ. Red 1.90 2.40 100 400 Green 2.93 3.90 100 400 Blue 2.95 3.90 100 400 Bin Information Intensity Bin (CAT) Tolerance ±15%. Color Bin (BIN) – Red Tolerance ±1 nm. Color Bin (BIN) – Green Tolerance ±1 nm. Color Bin (BIN) – Blue Tolerance ±1 nm. CAUTION! The above optical performance specifications are valid in the case when a single color is illuminated. The above product specifications do not provide any guarantee on color mixing, color consistency over time or uniformity in luminous intensity when more than one color is illuminated. Bin ID Luminous Intensity (mcd) Min. Max. N 28.5 45.0 P 45.0 71.5 Q 71.5 112.5 R 112.5 180.0 S 180.0 285.0 T 285.0 360.0 Bin ID Dominant Wavelength (nm) Min. Max. AC 615 630 Bin ID Dominant Wavelength (nm) Min. Max. B5 2 0 5 2 5 C5 2 5 5 3 0 D5 3 0 5 3 5 E5 3 5 5 4 0 Bin ID Dominant Wavelength (nm) Min. Max. AA 460 465 AB 465 470 AC 470 475 AD 475 480
HSMF-C125 Data Sheet Tri-Color Surface-Mount ChipLED Broadcom HSMF-C125-DS100 Precautionary Notes Soldering Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture sensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. If unavoidable (such as rework), use hand soldering strictly controlled to the following conditions: – Soldering iron tip temp erature = 310°C maximum – Soldering duration = 2 seconds maximum – Number of cycles = 1 only – Power of soldering iron = 50W maximum Do not touch the LED package body with the soldering iron except for the soldering terminals because it might cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. Figure 16: Recommended Lead-Free Reflow Soldering Profile Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. Before use: – An unopened moisture barrier bag (MBB) can be stored at < 40°C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, it is safe to reflow the LEDs per the original MSL rating. – Do not open the MBB pr ior to assembly (for example, for IQC). If unavoidable, properly reseal the MBB with fresh desiccant and HIC. The exposed duration must be taken in as floor life. Control after opening the MBB: – Read the HIC immediat ely upon opening the MBB. – Keep the LEDs at < 30°C/60% RH at all times, and complete all high-temperature-related processes, including soldering, curing, or rework, within 672 hours. Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or desiccator at < 5% RH. Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at < 5% RH to ensure that all LEDs have not exceeded their floor life of 672 hours. Baking is required if the following conditions exist: – The HIC indicator indicates a change in color for 10% and 5% as stated on the HIC. – The LEDs are exposed to c onditions of > 30°C/60% RH at any time. – The LEDs’ floor lif e exceeded 672 hours. The recommended baking condition is: 60°C ±5ºC for 20 hours. Baking should only be done once. Application Precautions The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. Circuit design must cater to the whole range of forward voltage (VF) of the LEDs to ensure the intended drive current can always be achieved.
HSMF-C125 Data Sheet Tri-Color Surface-Mount ChipLED Broadcom HSMF-C125-DS100 LEDs exhibit slightly different characteristics at different drive currents that might result in larger performance variations (that is, intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED. Avoid rapid change in ambient temperature, especially in high-humidity environments, because this will cause condensation on the LED. If the LED is intended to be used in harsh or outdoor environments, protect the LED against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stress, and so on. Eye Safety and Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs as it may be harmful to the eyes. For safety reasons, use appropriate shielding or personal protection equipment.
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