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Technical content

Features

 LED with AlInGaP Red, InGaN Green and Blue  Compatible with reflow soldering  Available in 8-mm tape on 7-in. diameter reels

Applications

 Backlighting  Indicator CAUTION! This LED is Class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. HSMF-C112 Tri-Color Top-Mount ChipLED

HSMF-C112 Data Sheet Tri-Color Top-Mount ChipLED Figure 1: Package Dimensions NOTE: 1. All dimensions are in millimeters. 2. Dimensions in brackets a re for reference only. 3. Tolerance ±0.10 mm unless otherwise specified. Absolute Maximum Value at TJ = 25°C Optical Characteristics (TJ = 25°C, Red = 10 mA, Green/Blue = 5 mA) Parameter Red Green Blue Units DC Forward Currenta a. Derate as shown in Figure 6. 10 10 5 mA Power Dissipation 24 34 17 mW LED Junction Temperature 95 °C Operating Temperature Range –40 to +85 °C Storage Temperature Range –40 to +85 °C Color Luminous Intensity IV a (mcd) a. The luminous intensity, lv, is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with the axis. Dominant Wavelength b (nm) b. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. Peak Wavelength peak (nm) Viewing Angle 2θ1/2 c (Degrees) c. θ 1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. Red 36.0 79.0 622 629 130 Green 71.0 155.0 527 519 150 Blue 14.0 31.5 468 464 150

HSMF-C112 Data Sheet Tri-Color Top-Mount ChipLED Broadcom HSMF-C112-DS100 Electrical Characteristics at TJ = 25°C, Red = 10 mA, Green/Blue = 5 mA) Bin Information Intensity Bin Limits (CAT) Tolerance ±15%. Color Bin Limits (BIN) Tolerance ±1.0 nm. Indication of bin information on reel and packaging label: CAUTION! 1. The above optical specificatio ns are valid in the case where a single LED is illuminated. 2. The above product specifications do not provide any guarantee on color mixing, color consistency over time, or uniformity in luminous intensity when more than one LED is illuminated. Color Forward Voltage VF (Volts)a Reverse Current IR (µA) at VR = 5Vb Min. Max. Max. Red 1.6 2.4 100 Green 2.4 3.4 100 Blue 2.4 3.4 100 a. VF tolerance: ±0.1V. b. Indicates product final test condition only. Long-term reverse bias is not recommended. Bin ID Luminous Intensity, lv (mcd) Min. Max. Red N7 36.0 56.0 N9 40.0 63.0 P 45.0 71.0 P5 50.0 79.0 Green Q 71.0 112.0 Q5 80.0 125.0 Q7 90.0 140.0 Q9 95.0 155.0 Blue L7 14.0 22.0 L9 16.0 25.0 M 18.0 28.5 M5 20.0 31.5 Bin ID Dominant Wavelength, d (nm) Min. Max. Red 16 1 5 6 2 7 Green 25 2 3 5 2 9 35 2 5 5 3 1 45 2 8 5 3 4 55 3 0 5 3 6 65 3 3 5 3 9 Blue 54 6 4 4 6 9 64 6 6 4 7 1 74 6 8 4 7 3 84 7 0 4 7 5 CAT: xxx —> Red/Green/Blue Intensity bin BIN: xxx —> Red/Green/Blue Color bin

HSMF-C112 Data Sheet Tri-Color Top-Mount ChipLED Broadcom HSMF-C112-DS100 Precautionary Notes Soldering Figure 10: Recommended Lead-Free Reflow Soldering Profile  Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture sensitive device as stated in the following section.  Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot.  Use reflow soldering to solder the LED. If unavoidable (such as rework), use hand soldering strictly controlled to the following conditions: – Soldering iron tip temp erature = 310°C maximum – Soldering duration = 2 seconds maximum – Number of cycles = 1 only – Power of soldering iron = 50W maximum  Do not touch the LED package body with the soldering iron except for the soldering terminals because it might cause damage to the LED.  Confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures.  Before use: – An unopened moisture barrier bag (MBB) can be stored at < 40°C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, it is safe to reflow the LEDs per the original MSL rating. – Do not open the MBB pr ior to assembly (for example, for IQC). If unavoidable, properly reseal the MBB with fresh desiccant and HIC. The exposed duration must be taken in as floor life.  Control after opening the MBB: – Read the HIC immediat ely upon opening the MBB. – Keep the LEDs at < 30°C/60% RH at all times, and complete all high-temperature-related processes, including soldering, curing, or rework, within 672 hours.  Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or desiccator at < 5% RH.  Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at < 5% RH to ensure that all LEDs have not exceeded their floor life of 672 hours.  Baking is required if the following conditions exist: – The HIC indicator indicates a change in color for 10% and 5% as stated on the HIC. – The LEDs are exposed to c onditions of > 30°C/60% RH at any time. – The LEDs’ floor lif e exceeded 672 hours. The recommended baking condition is: 60°C ±5ºC for 20 hours. Baking should only be done once. Application Precautions  The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance.  Circuit design must cater to the whole range of forward voltage (VF) of the LEDs to ensure the intended drive current can always be achieved. 10 SEC. MAX. 6°C/SEC. MAX. 255 – 260°C 3°C/SEC. MAX. 217°C 200°C 150°C 3°C/SEC. MAX. 60 – 120 SEC. 60 SEC. MAX. TIME TEMPERATURE

HSMF-C112 Data Sheet Tri-Color Top-Mount ChipLED Broadcom HSMF-C112-DS100  LEDs exhibit slightly different characteristics at different drive currents that might result in larger performance variations (that is, intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations.  The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED.  Avoid rapid change in ambient temperature, especially in high-humidity environments, because this will cause condensation on the LED.  If the LED is intended to be used in harsh or outdoor environments, protect the LED against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stress, and so on. Eye Safety and Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs as it may be harmful to the eyes. For safety reasons, use appropriate shielding or personal protection equipment.

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