HSME-C110 HP | Alldatasheet

Document overview

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Technical content

Features

  • Small size
  • Industry standard footprint
  • Operating temperature range of –30˚C to +85˚C
  • Compatible with IR soldering
  • Available in 8 mm tape on 7" diameter reel
  • Reel sealed in zip-locked moisture barrier bags

Applications

  • Membrane switch indicator
  • LCD backlighting
  • Pushbutton backlighting
  • Front panel indicator
  • Symbol backlighting
  • Keypad backlighting

Description

This chip-type LED utilizes Alumi- num Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output. These chipLEDs come in top mounting, top emitting packages top mounting, side emitting pack- ages (HSMx-C110/120) or reverse mounting, top emitting package (HSMx-C265). All packages are binned by both color and intensity. In order to facilitate pick and place operation, these chipLEDs are shipped in Tape & Reel, with 4000 units per reel for HSMx- C120/170/ 177/190/191/197 and 3000 units per reel for HSMx- C110/C150/265. These packages are compatible with reflow soldering process.

1.6 (0.063 ) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.8 (0.031) 0.3 ± 0.15 (0.012 ± 0.006) 1.0 (0.039) 0.4 (0.016) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) CATHODE LINE 0.7 (0.028) MIN. HSMx-C190 HSMx-C191 1.6 (0.063 ) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.6 (0.023) 0.3 ± 0.15 (0.012 ± 0.006) 1.0 (0.039) 0.4 (0.016) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) CATHODE LINE 0.7 (0.028) MIN. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2.00 (0.079 ) 0.30 (0.012) 0.40 ± 0.15 (0.016 ± 0.006) 0.30 (0.012) POLARITY 0.80 (0.031) 0.40 ± 0.15 (0.016 ± 0.006) 1.40 (0.055) 0.62 (0.024) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.25 (0.049) CATHODE LINE HSMx-C170 CATHODE MARK 3.2 (0.126 ) 0.5 (0.020) 0.8 (0.031) POLARITY CATHODE LINE 1.5 (0.059) LED DIE CLEAR EPOXY PC BOARD SOLDERING TERMINAL 1.0 (0.039) 1.0 (0.039) 2.6 (0.102 ) 1.6 (0.063 ) CATHODE LINE HSMx-C110 3.2 (0.126 )

3.2 (0.126 ) 0.5 (0.020) 0.5 ± 0.2 (0.020 ± 0.008) 0.6 (0.024) POLARITY CATHODE MARK 1.1 (0.043) 0.5 ± 0.2 (0.020 ± 0.008) 2.0 (0.079) 0.8 (0.031) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.6 (0.063) CATHODE LINE HSMx-C150 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 3.40 (0.134) 0.30 (0.012) 2– 1.10 (0.043) POLARITY CATHODE MARK (ETCHED) 1.10 (0.043) 2– 0.50 ± 0.15 (0.020 ± 0.006) 1.20 (0.047) LED DIE UNDIFFUSED EPOXY PC BOARD 1.25 (0.049) CATHODE LINE HSMx-C265 0.80 (0.031) 1.60 (0.063) DIFFUSED EPOXY PC BOARD 0.40 (0.016) 0.16 (0.006) 0.70 (0.028) MIN. 0.30 ± 0.15 (0.012 ± 0.006)CATHODE LINE 0.40 (0.016) CATHODE MARK LED DIE HSMx-C197 POLARITY SOLDERING TERMINAL HSMx-C120 1.6 (0.063) 0.5 (0.020) POLARITY CATHODE MARK 1.0 (0.039) 3 – 0.3 (0.012) 1.2 (0.047) 0.3 (0.012) LED DIE CLEAR EPOXY PC BOARD SOLDERING TERMINAL 0.6 (0.024) CATHODE LINE

Package Dimensions, continued NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). CATHODE MARK LED DIE 1.25 (0.049) 0.62 (0.025) 2.00 (0.079) DIFFUSED EPOXY PC BOARD 0.40 (0.016) 0.16 (0.006) 0.40 ± 0.15 (0.016 ± 0.006) SOLDERING TERMINAL HSMx-C177 1.10 (0.043) POLARITY CATHODE LINE

Package Dimension (mm)[1,2] AlInGaP Green Package Description 1.6 (L) x 0.8 (W) x 0.6 (H) HSME-C191 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.4 (H) HSME-C197 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.8 (H) HSME-C190 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.8 (H) HSME-C170 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.4 (H) HSME-C177 Untinted, Diffused 1.6 (L) x 0.6 (W) x 1.0 (H) HSME-C120 Untinted, Non-diffused 3.2 (L) x 1.0 (W) x 1.5 (H) HSME-C110 Untinted, Non-diffused 3.2 (L) x 1.6 (W) x 1.1 (H) HSME-C150 Untinted, Diffused 3.4 (L) x 1.25 (W) x 1.1 (H) HSME-C265 Untinted, Non-diffused Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted. Absolute Maximum Ratings at TA = 25°C HSME-C110/120/170/177/ Parameter 190/191/197/150/265 Units DC Forward Current [1,2] 20 mA Power Dissipation 52 mW Reverse Voltage (I R = 100 µA) 5 V LED Junction Temperature 95 °C Operating Temperature Range –30 to +85 °C Storage Temperature Range –40 to +85 °C Soldering Temperature See reflow soldering profile (Figures 6 & 7) Electrical Characteristics at TA = 25°C Forward Voltage Reverse Breakdown Capacitance C Thermal VF (Volts) V R (Volts) (pF), V F = 0, Resistance @ IF = 20 mA @ I R = 100 µA f = 1 MHz R θJ–PIN (°C/W) HSME-C110/120 2.1 2.6 5 18 550 HSME-C150/170/177/190/191/197 2.1 2.6 5 15 450 HSME-C265 2.1 2.6 5 16 450 Notes: 1. Derate linearly as shown in Figure 4. 2. Drive current above 5 mA is recommended for best long term performance.

Optical Characteristics at TA = 25°C Color, Dominant Luminous Intensity Peak Wavelength Wavelength Viewing Angle Luminous Efficacy I V (mcd) @ 20 mA[1] λpeak (nm) λd[2] (nm) 2 θ1/2 Degrees[3] ηV (lm/w) HSME-C110 18 52 570 572 130 570 HSME-C120 18 52 570 572 155 570 HSME-150/170/ 18 50 570 572 170 570 HSME-C177/197 18 50 570 572 130 570 HSME-C265 18 50 570 572 170 570 Notes: 1. The luminous intensity, I V, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Light Intensity (IV) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 U 450.00 715.00 Green Color Bin Limits[1] Dom. Wavelength (nm) Bin ID Min. Max. A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance: ± 0.5 nm Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins.

Figure 16. Tape dimensions.

  1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

Figure 17. Tape leader and trailer dimensions. distributors, please go to our web site. Copyright © 2004 Agilent Technologies, Inc.