HSMA-TX25 HP | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

Features

  • Outstanding LED Material Efficiency
  • Exceptional Light Output Over a Wide Range of Drive Currents
  • Colors: 590 nm Amber, 603 nm Orange, and 615 nm Reddish-Orange
  • Compatible with Automatic Placement Equipment
  • Compatible with Convective IR, Vapor Phase Reflow, and TTW Solder Processes
  • Packaged in 12 mm or 8 mm Tape on 7" or 13" Diameter Reels
  • EIA Standard Package
  • Low Package Profile
  • Non-diffused Package Excellent for Backlighting and Coupling to Light Pipes

Description

The LED material used in these devices is the very efficient absorbing Substrate aluminum indium gallium phosphide (AS AlInGaP), capable of producing high light output over a wide range of drive currents. These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equip- ment. A glue pad is provided for adhesive mounting processes. They are compatible with convective IR and vapor phase reflow soldering, through the wave (TTW) soldering, and conductive epoxy attachment processes. The package size and configura- tion conform to the EIA-535 Device Selection Guide Amber Orange Reddish-Orange λd = 590 nm λd = 603 nm λd = 615 nm Description HSMA-T425 HSMD-T425 HSMJ-T425 12 mm Tape, 7" Reel, 2000 Devices HSMA-T525 HSMD-T525 HSMJ-T525 12 mm Tape, 13" Reel, 8000 Devices HSMA-T625 HSMD-T625 HSMJ-T625 8 mm Tape, 7" Reel, 2000 Devices HSMA-T725 HSMD-T725 HSMJ-T725 8 mm Tape, 13" Reel, 8000 Devices SunPower Series HSMA-TX25 HSMD-TX25 HSMJ-TX25 BAAC standard specification for case size 3528 tantalum capacitors. The folded leads permit dense placement and provide an external solder joint for ease of inspection. These devices are non-diffused, providing high intensity for applications such as backlighting, light pipe illumination, and front panel indication. 5964-9352E

Hewlett Packard surface mount LEDs are packaged tape and reel in accordance with EIA-481A, Taping of Surface Mount Components for Automatic Placement. This packaging system is compatible with tape- fed automatic pick and place systems. Each reel is sealed in a vapor barrier bag for added protection. Bulk packaging in vapor barrier bags is available upon special request. hp HEWLETT PACKARD CATHODE PITCH: 4 mm (0.157 IN.) USER FEED DIRECTION CARRIER TAPE WIDTH: 12 mm (0.472 IN.) OR 8 mm (0.315 IN.) REEL DIAMETER: 178 mm (7 IN.) OR 330 mm (13 IN.) NOM.2.2 (0.087) 3.5 – 0.2 (0.138 – 0.008) NOM.3.1 (0.122) NOM.2.7 (0.106) 2.8 – 0.2 (0.110 – 0.008) 2.2 – 0.1 (0.087 – 0.004) MIN.0.7 (0.028) 1.9 – 0.2 (0.075 – 0.008) 0.8 – 0.3 (0.031 – 0.012) (2 PLACES) 1.3 (0.050) MIN. 0.1 (0.004) NOM. CATHODE NOTCH NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. THE LEADS ARE COPPER ALLOY, 85% Sn/15% Pb PLATING.

Absolute Maximum Ratings at TA = 25°C (at I PEAK = 200 mA, f ≥ 1 KHz)[2] Reflow Soldering Temperatures Notes: 1. Derate linerally as shown in Figure 4. 2. Refer to Figure 5 to establish pulsed operating conditions. 3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. 4. Drive currents between 5 mA and 30 mA are recommended for best long term performance. 5. Operation at currents below 5 mA is not recommended, please contact your Hewlett- Packard sales representative. Electrical Characteristics at TA = 25°C Speed of Forward Reverse Capacitance Response Voltage Breakdown C (pF) τs (ns) VF (Volts) V R (Volts) V F = 0, Thermal Time Constant Part @ I F = 10 mA @ I R = 100 µA f = 1 MHz Resistance e -t/τ HSMA-TX25 1.9 2.4 5 25 40 180 13 HSMD-TX25 1.9 2.4 5 25 40 180 13 HSMJ-TX25 1.9 2.4 5 25 40 180 13 s Optical Characteristics at TA = 25°C Luminous Color, Viewing Intensity Peak Dominant Angle Luminous IV (mcd) Wavelength Wavelength 2 θ1/2 Efficacy Part @ 10 mA λPEAK (nm) λd[1] (nm) Degrees [2] ηv HSMA-TX25 10 25 592 590 120 480 HSMD-TX25 10 25 607 603 120 370 HSMJ-TX25 10 25 621 615 120 263 Notes: 1. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.

4.45 (0.175) 1.65 (0.065) 2.41 (0.095) INFRARED/VAPOR PHASE REFLOW SOLDERING COMPONENT LOCATION ON PAD COMPONENT LOCATION ON PAD 4.45 (0.175) 1.65 (0.065) 2.41 (0.095) CONDUCTIVE ATTACHMENT 0.64 (0.025) SQ. CENTERED HOLE NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). Convective IR Reflow Soldering For information on convective IR reflow soldering, refer to the Supplement to Application Note 1060, Surface Mounting SMT LED Components. Recommended Printed Circuit Board Attachment Pad Geometries