HSMC-C370 ABRACON | Alldatasheet
Document overview
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Technical content
Features
LED with AlInGaP Red Compatible with reflow soldering Available in 8mm tape and 7” diameter reel
Applications
Indicator Backlighting
HSMC-C370 Data Sheet Mono Color Top Mount ChipLED Broadcom HSMC-C370-DS Figure 1: Package Dimensions NOTE: 1. All dimensions in millimeters. 2. Tolerance is ±0.10mm unless otherwise specified. Absolute Maximum Ratings Parameters Rating Unit DC Forward Current a, 2 5 m A Power Dissipation 60 mW LED Junction Temperature 95 °C Operating/Storage Temperature Range -40 to +85 °C a. Derate as shown in Figure 6.
HSMC-C370 Data Sheet Mono Color Top Mount ChipLED Broadcom HSMC-C370-DS Optical Characteristics (TJ = 25°C, IF = 20mA) Color Luminous Intensity, IV (mcd) a Dominant Wavelength, d (nm) b Peak Wavelength, p (nm) Viewing Angle 2θ1/2 (Degrees) c Min. Typ. Typ. Typ. Red 450 625 635 15 a. The luminous intensity, I V is measured at the mechanical axis of the package and it is tested with a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. The dominant wavelength, d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. c. Θ 1/2 is the off axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics (TJ = 25°C, IF = 20mA) Color Forward Voltage, VF (V) a Reverse Current, IR (µA) at VR = 5V b Thermal Resistance RθJ-S (°C/W) c Min. Max. Max. Typ. Red 1.6 2.4 10 320 a. Forward voltage tolerance is ±0.1V. b. Indicates product final test c ondition. Long term reverse bias is not recommended. c. Thermal resistance from LED junction to solder point.
HSMC-C370 Data Sheet Mono Color Top Mount ChipLED Broadcom HSMC-C370-DS Bin Information Intensity Bin Limits (CAT) Bin ID Luminous Intensity (mcd) Min. Max. U 450.00 715.00 V 715.00 1125.00 W 1125.00 1800.00 X 1800.00 2850.00 Y 2850.00 4500.00 Z 4500.00 7150.00 Tolerance = ±15% Color Bin Limits (BIN) Bin ID Dominant Wavelength (nm) Min. Max. - 620.0 635.0 Tolerance = ±1.0nm
HSMC-C370 Data Sheet Mono Color Top Mount ChipLED Broadcom HSMC-C370-DS Precautionary Notes Soldering Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture- sensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: ─ Soldering iron tip temperature = 310°C max. ─ Soldering duration = 2sec max. ─ Number of cycles = 1 only ─ Power of soldering iron = 50W max. Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. Figure 10: Recommended Lead-Free Reflow Soldering Profile Handling Precautions This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures. Before use: ─ An unopened moisture bar rier bag (MBB) can be stored at <40°C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the Humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. ─ Do not open the MBB prior to assembly (for example, for IQC). If unavoidable, MBB must be properly resealed with fresh desiccant and HIC. The exposed duration must be taken in as floor life. Control after opening the MBB: ─ Read the HIC immediately upon opening of MBB. ─ Keep the LEDs at <30°/60%RH at all times, and complete all high temperature-related processes, including soldering, curing or rework within 672 hours. Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or a desiccator at <5%RH. Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at <5% RH to ensure that all LEDs have not exceeded their floor life of 672 hours. Baking is required if: ─ The HIC indicator indica tes a change in color for 10% and 5%, as stated on the HIC. ─ The LEDs are exposed to conditions of >30°C/60% RH at any time. ─ The LED’s floor lif e exceeded 672 hours. The recommended baking condition is: 60±5ºC for 20 hours. Baking can only be done once. 10 SEC. MAX. 6°C/SEC. MAX. 255 – 260°C 3°C/SEC. MAX. 217°C 200°C 150°C 3°C/SEC. MAX. 60 – 120 SEC. 60 SEC. MAX. TIME TEMPERATURE
HSMC-C370 Data Sheet Mono Color Top Mount ChipLED Broadcom HSMC-C370-DS Application Precautions The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. Circuit design must cater to the whole range of forward voltage (VF) of the LEDs to ensure the intended drive current can always be achieved. The LED exhibits slightly different characteristics at different drive currents, which may result in a larger variation of performance (meaning: intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations. Driving the LED at low current (< 2mA) will not cause functional failures to the LED (i.e. open/short). However, the variation in intensity will be larger than existing intensity bin ratio of 1:1.6. If the LED is intended to be used along with LED of other color to achieve color mixing, Broadcom does not guarantee the consistency of the resultant color. Do contact Broadcom Sale Representative for such application. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED. Avoid rapid change in ambient temperature, especially in high-humidity environments, because they cause condensation on the LED. If the LED is intended to be used in harsh or outdoor environment, protect the LED against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stresses, and so on. Eye Safety Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs because it might be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment.
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