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Technical content

Features

 High brightness AlInGaP material  Small size with low profile  0603 industry standard footprint with 0.37 mm height  Diffused optics  Operating range of -40°C to 85°C  Available in four colors  Compatible with IR soldering  Available in 8-mm conductive tape on 7-in. diameter reel  Reel sealed in zip-locked moisture barrier bags

Applications

 Membrane switch indicator  LCD backlighting  Push button backlighting  Front panel indicator  Symbol backlighting  Keypad backlighting CAUTION! HSMx-C130 LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. HSMx-C130 Surface Mount ChipLEDs

HSMx-C130 Data Sheet Surface Mount ChipLEDs Package Dimensions NOTE: 1. All dimensions are in millimeters (inches). Device Selection Guide Part Number Color Die Technology Parts per Reel Package Description HSMA-C130 Amber AlInGaP 4000 Untinted, Diffused HSMC-C130 Red AlInGaP 4000 Untinted, Diffused HSME-C130 Yellow Green AlInGaP 4000 Untinted, Diffused HSML-C130 Orange AlInGaP 4000 Untinted, Diffused

HSMx-C130 Data Sheet Surface Mount ChipLEDs Absolute Maximum Ratings at TA = 25°C Electrical Characteristics at TA = 25°C Optical Characteristics at TA = 25°C Parameter AlInGaP Units DC Forward Currenta a. Derate linearly as shown in Figure 4. 20 mA Power Dissipation 48 mW Reverse Voltage (IR = 100 µA) 5 V LED Junction Temperature 95 °C Operating Temperature Range –40°C to +85 °C Storage Temperature Range –40°C to +85 °C Soldering Temperature See reflow soldering profile (Figure 5 and 6) Part Number Forward Voltage VF (Volts) @ IF = 20 mA Reverse Breakdown VR (Volts) @ IR = 100 µAa a. Indicate product final test condition only, Long-term reverse bias is not recommended. Thermal Resistance RθJP (°C/W) TypicalTyp. Max. Min. HSMA-C130 2.05 2.40 5 500 HSMC-C130 1.94 2.40 5 500 HSME-C130 1.94 2.40 5 500 HSML-C130 1.94 2.40 5 500 Part Number Luminous Intensity IV a (mcd) @ 20 mA a. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. Peak Wavelength peak (nm) Typical Color, Dominant Wavelength d b (nm) Typical b. The dominant wavelength, d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. Viewing Angle 2θ1/2 c (Degrees) Typical c. θ 1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. Min. Typ. HSMA-C130 28.5 87.0 591 589 110 HSMC-C130 28.5 131.0 635 626 110 HSME-C130 18.0 54.0 575 573 110 HSML-C130 28.5 139.0 612 606 110

HSMx-C130 Data Sheet Surface Mount ChipLEDs Broadcom AV02-0484EN Light Intensity (IV) Bin Limits Tolerance : ±15% NOTE: Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Broadcom repre- sentative for information on current available bins. Forward Voltage Limits AlInGaP Amber Color Bin Limits Tolerance : ±1 nm AlInGaP Red Color Bin Limits Tolerance : ±1 nm AlInGaP Yellow Green Color Bin Limits Tolerance : ±1 nm AlInGaP Orange Color Bin Limits Tolerance : ±1 nm NOTE: Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Broadcom representative for information on current available bins. Bin ID Intensity (mcd) Minimum Maximum M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.0 285.0 T 285.0 450.0 U 450.0 715.0 V 715.0 1125.0 W 1125.0 1800.0 X 1800.0 2850.0 Y 2850.0 4500.0 Bin ID Forward Voltage (V) Minimum Maximum 1 1.60 1.80 2 1.80 2.00 3 2.00 2.20 4 2.20 2.40 Bin ID Dominant Wavelength (nm) Minimum Maximum A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 Bin ID Dominant Wavelength (nm) Minimum Maximum — 620.0 635.0 Bin ID Dominant Wavelength (nm) Minimum Maximum A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5Bin ID Dominant Wavelength (nm) Minimum Maximum A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 F 612.0 615.0

HSMx-C130 Data Sheet Surface Mount ChipLEDs Broadcom AV02-0484EN  Before use: – An unopened moisture barrier bag (MBB) can be stored at < 40°C/90% RH for 12 months. If the actual indicator card (HIC) indicates that baking is not required, it is safe to reflow the LEDs per the original MSL rating. – Do not open the MBB pr ior to assembly (for example, for IQC). If unavoidable, MBB must be properly resealed with fresh desiccant and HIC. The exposed duration must be taken in as floor life.  Control after opening the MBB: – Read the HIC immediat ely upon opening of MBB. – Keep the LEDs at <30°/60% RH at all times, and complete all high temperature-related processes, including soldering, curing or rework within 672 hours.  Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or a desiccator at <5% RH.  Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at <5% RH to ensure that all LEDs have not exceeded their floor life of 672 hours.  Baking is required if: – The HIC indicator indicates a change in color for 10% and 5%, as stated on the HIC. – The LEDs are exposed to conditions of >30°C/60% RH at any time. – The LED's floor life exceeded 672 hours. The recommended baking condition is: 60°C ± 5ºC for 20 hours. Baking can only be done once. Application Precautions  The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance.  Circuit design must cater to the whole range of forward voltage (VF) of the LEDs to ensure the intended drive current can always be achieved.  The LED exhibits slightly different characteristics at different drive currents, which may result in a larger variation of performance (meaning: intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations.  If the LED is intended to be used along with an LED of another color to achieve color mixing, Broadcom does not guarantee the consistency of the resultant color. Contact your Broadcom sales representative for such applications.  The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED.  Avoid rapid change in ambient temperature, especially in high-humidity environments, because they cause condensation on the LED.  If the LED is intended to be used in harsh or outdoor environments, protect the LED against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stresses, and so on. Eye Safety Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs because it might be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment

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