HSMB-C190 HP | Alldatasheet

Document overview

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Technical content

Features

  • Small Size
  • Industry Standard Footprint
  • Compatible with IR Solder
  • Diffused Optics
  • Operating Temperature Range of -30 °C to +85°C
  • Right Angle Package Available
  • SiC Blue Color
  • Available in 8 mm tape on 7" (178 mm) Diameter Reels

Applications

  • Keypad Backlighting
  • Push-Button Backlighting
  • LCD Backlighting
  • Symbol Backlighting
  • Front Panel Indicator

Description

designed in an industry standard package for ease of handling and use. Blue color chip LED is a new product that offers color differentiation for backlighting applications. The HSMB-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMB-C170 has the widely used 2.0 x 1.25 mm footprint. The HSMB-C190 has the industry standard 1.6 x 0.8 mm footprint, its low 0.8 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The HSMB-C110 is a right-angle package with the universally accepted dimensions of 3.2 x 1.0 Footprint (mm) SiC Blue Parts Per Reel 2.00 x 1.25 HSMB-C170 4000 1.60 x 0.80 HSMB-C190 4000 3.20 x 1.00[1] HSMB-C110 3000 3.20 x 1.60 HSMB-C150 3000 Note: 1. Right-angle package. x 1.5 mm. This part is ideal for LCD backlighting and sidelighting applications. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium. Device Selection Guide

1.6 (0.063 ) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.8 (0.031) 0.3 ± 0.15 (0.012 ± 0.006) 1.0 (0.039) 0.4 (0.016) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) 2.0 (0.079 ) 0.3 (0.012) 0.4 ± 0.15 (0.016 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.8 (0.031) 0.4 ± 0.15 (0.016 ± 0.006) 1.4 (0.055) 0.62 (0.024) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.25 (0.049) 3.2 (0.126 ) 0.5 (0.020) 1.0 (0.039) POLARITY CATHODE MARK 1.5 (0.059) LED DIE CLEAR EPOXY PC BOARD SOLDERING TERMINAL 1.0 (0.039) 1.0 (0.039) 2.6 (0.102 ) 1.6 (0.063 ) CATHODE LINE NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 3.2 (0.126 ) 0.5 (0.020) 0.50 ± 0.2 (0.020 ± 0.008) 0.6 (0.024) POLARITY CATHODE MARK 1.1 (0.043) 0.50 ± 0.2 (0.020 ± 0.008) 2.0 (0.079) 0.8 (0.031) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.6 (0.063) HSMB-C150

Absolute Maximum Ratings at TA=25°C Parameter HSMB-C190/C170/C110/C150 Units DC Forward Current[1] 20 mA Peak Pulsing Current[2] 100 mA Power Dissipation 92 mW Reverse Voltage (IR = 100 µA) 5 V Maximum LED Junction Temperature 95 °C Operating Temperature Range -30 to +85 °C Storage Temperature Range -40 to +85 °C Soldering Temperature See IR soldering profile (Figure 7) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25 °C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. Optical Characteristics at TA=25°C Luminous Peak Dominant Viewing Intensity[1] Wavelength Wavelength Angle 2 θ1/2 Part No. Color I v (mcd) @ 20 mA λpeak (nm) λd (nm) (degrees) [2] HSMB- SiC Blue 1.60 6.0 428 466 170 C190/C170/C150 HSMB-C110 SiC Blue 1.60 6.5 428 466 130 Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA=25°C Reverse Forward Voltage Breakdown Thermal Capacitance C VF (Volts) V R (Volts) Resistance (pF) @ V F = 0 V, Part No. @ I F = 20 mA @ I R = 100 µAR θJ-P (°C/W) f = 1 MHz HSMB-C190/C170/C150 3.8 4.6 5 300 67 HSMB-C110 3.8 4.6 5 300 67

For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. www.semiconductor.agilent.com Data subject to change. Copyright © 2000 Agilent Technologies, Inc. Obsoletes 5980-1186E 5980-2427E (9/00) Storage Condition: 5 to 30˚ C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/– 5˚C for 20 hours.