HSM2694 KEXIN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 1
Technical content
Features
Low forward resistance. (rf = 0.9 max) Low capacitance. (C = 1.2pFmax) MPAK package is suitable for high density surface mounting and high speed assembly. Absol ut e Maxi mum Rat i ngs Ta = 25 Parameter Symbol Value Unit Reverse Voltage V R 35 V Power dissipation P d 150 mW Junction temperature T j 125 Storage temperature T stg - 4 5t o+ 1 2 5 Operation temperature T opr - 2 0t o+ 6 0 Electrical Characteristics Ta = 25 Parameter Symbol Conditions Min Typ Max Unit Reverse voltage V R IR =1 0 A 35 V Reverse current I R VR = 25 V 50 nA Forward voltage V F IF =1 0m A 1 . 0 V Capacitance C V R =6V ,f=1M H z 1 . 2 p F Forward resistance rf I F = 2 mA, f = 100 MHz 0.9 Marking Marking B3