HSM2692 KEXIN | Alldatasheet
Document overview
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Technical content
Features
Low forward resistance. (rf = 0.9 max) Low capacitance. (C = 1.2pFmax) MPAK package is suitable for high density surface mounting and high speed assembly. 0.4+0.1 -0.1 2.9+0.1 -0.1 0.95+0.1 -0.1 1.9+0.1 -0.1 2.4+0.1 -0.1 1.3+0.1 -0.1 0-0.1 0.38+0.1 -0.1 0.97+0.1 -0.1 0.55 0.4 1.Base 2.Emitter 3.collector Unit: mmSOT-23 0.1+0.05 -0.01 Absolute Maximum Ratings Ta = 25 Parameter Symbol Value Unit Reverse Voltage V R 35 V Power dissipation P d 150 mW Junction temperature T j 125 Storage temperature T stg - 4 5t o+ 1 2 5 Operation temperature T opr - 2 0t o+ 6 0 Electrical Characteristics Ta = 25 Parameter Symbol Conditions Min Typ Max Unit Reverse voltage V R IR =1 0 A 35 V Reverse current I R VR = 25 V 50 nA Forward voltage V F IF =1 0m A 1 . 0 V Capacitance C V R =6V ,f=1M H z 1 . 2 p F Forward resistance rf I F =2m A ,f=1 0 0M H z 0 . 9 Marking Marking B1