HSM101 RECTRON | Alldatasheet

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MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 o C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. HSM108 THRU HSM101 MAXIMUM RATINGS (@ TA=25 OC unless otherwise noted) ELECTRICAL CHARACTERISTICS (@TA=25 OC unless otherwise noted) RATINGS Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current at TA = 50OC Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) Typical Junction Capacitance (Note 2) SYMBOL VRRM VDC IFSM CJ TSTG VRMS UNITS Volts Volts Volts Amps1.0 15 12 Amps 0 C Storage Temperature Range IO pF Operating Temperature Range TJ HSM101 -55 to + 150 150 0 C HSM102 HSM103 HSM104 HSM105 HSM106 100 200 300 400 35 70 140 210 280 50 100 200 300 400 HSM107 HSM108 HSM101 HSM102 HSM103 HSM104 HSM105 HSM106 HSM107 HSM108 600 800 1000 600 800 1000 420 490 700 2007-5 CHARACTERISTICS Maximum Average Reverse Current Maximum Full Load Reverse Current, Full cycle Average TA =55OC Maximum Reverse Recovery Time (Note 4) at Rated DC Blocking Voltage VF SYMBOL I trr R mA mA mA Maximum Instantaneous Forward Voltage at 1.0A DC Volts 100 50 75 nSec @TA = 25 o C @TA = 125 o C 1.0 UNITS 1.3 1.7 NOTES : 1. Measured at 1 MHz and applied reverse voltage of 4.0 volts. 2. “Fully ROHS compliant”, “100% Sn plating (Pb-free)”. MELF Dimensions in inches and (millimeters) .205 ( 5.2 ) .190 ( 4.8 ) .024 ( 0.6 ) .016 ( 0.4 ) .106 ( 2.7 ) .095 ( 2.4 ) SOLDERABLE ENDS

FEATURES

  • Glass passivated device * Ideal for surface mounted applications * Low leakage current * Metallurgically bonded construction * Mounting position: Any * Weight: 0.015 gram * Epoxy : Device has UL flammability classification 94V-0 MECHANICA DISCONTINUED- L DATA "This series is replaced by the HFM10X series that meets to the same fit and function parameters and share the same solder pad layout. The HFM10X series is preferred for error-free vacuum pick-up and PCB assembly." SURFACE MOUNT GLASS PASSIVATED HIGH EFFICIENCY SILICON RECTIFIER VOLTAGE RANGE 50 to 1000 Volts CURRENT 1.0 Ampere Discontinued

AMBIENT TEMPERATURE, ( O INSTANTANEOUS REVERSE CURRENT, (uA) 0.8 1.0 0.6 0.4 0.2 7550 175100 125 150 RATING AND CHARACTERISTICS CURVES ( HSM101 THRU HSM108 ) FIG.2 TYPICAL FORWARD CURRENT DERATING CURVE FIG.1 TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTIC PERCENT OF RATED PEAK REVERSE VOLTAGE, (%) AVERAGE FORWARD CURRENT, (A) 0.1 1.0 1000 100 6020 40 80 100 120 140 FIG.3 TYPICAL REVERSE CHARACTERISTICS trr +0.5A50 W NONINDUCTIVE 10 W NONINDUCTIVE -0.25A -1.0A 1cm SET TIME BASE FOR 50/100 ns/cm NOTES: 1 Rise Time = 7ns max. Input Impedance = 1 megohm. 22pF. 2. Rise Time = 10ns max. Source Impedance = 50 ohms. D.U.T

25 Vdc

(approx) ( - ) ( - ) ( + ) ( + ) NON- INDUCTIVE OSCILLOSCOPE (NOTE 1) PULSE GENERATOR (NOTE 2) Single Phase Half Wave 60Hz Resistive or Inductive Load TA = 25 O C TA = 75 O C TA = 125 O C

PEAK FORWARD SURGE CURRENT, (A) INSTANTANEOUS FORWARD VOLTAGE, (V) 110 100 125 150 200 INSTANTANEOUS FORWARD CURRENT, (A) 1.0 0.3 0.1 0.03 0.01 3.0 RATING AND CHARACTERISTICS CURVES ( HSM101 THRU HSM108 ) FIG.4 TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS FIG.5 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT REVERSE VOLTAGE, (V) JUNCTION CAPACITANCE, (pF) 200 100 0.20.1 1 0.4 21.0 4 10 20 40 100 FIG.6 TYPICAL JUNCTION CAPACITANCE 8.3ms Single Half Sine-Wave (JEDED Method) Pulse Width=300uS 1% Duty Cycle TJ = 25 O C TJ = 25 O C HSM101~HSM103 HSM104~HSM105 HSM106~HSM108 HSM106~HSM108 HSM101~HSM105

Dimensions in inches and (millimeters) .100 (2.54) .200 (5.08) .300 (7.62) .100 (2.54) .100 (2.54) F-SLOT WIDTH OPTIMUM PAD SIZE

Rectron Inc reserves the right to make changes without notice to any product specification herein, to make corrections, modifications, enhancements or other changes. Rectron Inc or anyone on its behalf assumes no responsibility or liabi- lity for any errors or inaccuracies. Data sheet specifications and its information contained are intended to provide a product description only. "Typical" paramet- ers which may be included on RECTRON data sheets and/ or specifications ca- n and do vary in different applications and actual performance may vary over ti- me. Rectron Inc does not assume any liability arising out of the application or use of any product or circuit. Rectron products are not designed, intended or authorized for use in medical, life-saving implant or other applications intended for life-sustaining or other rela- ted applications where a failure or malfunction of component or circuitry may di- rectly or indirectly cause injury or threaten a life without expressed written appr- oval of Rectron Inc. Customers using or selling Rectron components for use in such applications do so at their own risk and shall agree to fully indemnify Rect- ron Inc and its subsidiaries harmless against all claims, damages and expendit- ures. DISCLAIMER NOTICE