HSF TTELEC | Alldatasheet
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Surface Mount Metal GlazeTM HSF Series 150°C maximum operating temperature RoHS - compatible components available Up to triple the surge rating of the rugged CHP1 Replaces costly surface-mount wirewound resistors General Note IRC reserves the right to make changes in product specifi cation without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc• 4222 South Staples Street • Corpus Christi Texas 78411 USAWire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Metal GlazeTM thick fi lm element fi red at 1000°C to solid ceramic Solder over nickel barrier High temperature dielectric coating Electrical Data
- 1 Watt and 1/2 Watt power rating
- 150°C maximum operating temperature
- RoHS - Compatible Components Available
- Up to triple the surge rating of the rugged CHP1
- Replaces costly surface-mount wirewound resistors Industry Footprint Type Maximum Power Rating Working Voltage Resistance Range (Ω) Tolerance (±%) TCR (ppm/°C) Product Category
2512 HSF-1 1W @ 70°C 350
3612 HSF-2 2W @ 25°C 500 8R2, 22R, 300R
5R9, 6R8, 11R, 27R, 12R, 68R, 270R Note 1 – Standard TCR is ±200ppm/°C. TCR of ±100ppm/°C is available at selected values on request. High Surge±20010 High Surge±20010 Environmental Data dohteM tseTegnahC mumixaMscitsiretcarahC Temperature Coeffi cient As specifi ed MIL-R-55342H Par 4.7.9 (-55°C +125°C) Thermal Shock ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.3 (-65°C +150°C, 5 cycles) Low Temperature Operation ±0.25% +0.01 ohm MIL-R-55342H Par 4.7.4 (-65°C @ working voltage) Short Time Overload ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.5 2.5 x P x R for 5 seconds High Temperature Exposure ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.6 (+150°C for 100 hours) Resistance to Bonding Exposure ±0.25% +0.01 ohm MIL-R-55342H Par 4.7.7 (refl ow soldered to board at 260°C for 10 seconds) Solderability 95% min. coverage MIL-STD-202, Method 208 (245°C for 5 seconds) Moisture Resistance ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours) Life Test ±0.5% +0.01 ohm MIL-R-55342H Par 4.7.10 (2000 hours at 70°C intermittent) Terminal Adhesion Strength ±1% +0.01 ohm no mechanical damage 1200 gram push from underside of mounted chip for 60 seconds Resistance to Board bending ±1% +0.01 ohm no mechanical damage Chip mounted in center of 90mm long board, defl ected 5mm so as to exert pull on chip contacts for 10 seconds HSF High Surge Film Surface Mount Metal GlazeTM HSF-1 Series Issue October 2010 Sheet 1 of 4 Resistors Metal GlazeTM lm element red at 1000˚C to solid ceramic Solder over nickel barrier High temperature dielectric coating 06.18 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronics.com/resistors BI Technologies IRC Welwyn All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
Surface Mount Metal Glaze™ HSF Series
- 4222 South Staples Street • Corpus Christi Texas 78411 USAWire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Dimensions (Inches and (mm)) Industry Footprint Type L (Length) W (Width/Diameter) C (Termination Width) 2512 HSF-1 0.251 ± 0.010 (6.38 ± 0.25) 0.079 ± 0.006 (2.01 ± 0.15) 0.040 ± 0.010 (1.02 ± 0.25) 3612 HSF-2 0.367 ± 0.010 (9.32 ± 0.25) 0.105 ± 0.006 (2.67 ± 0.15) 0.050 ± 0.010 (1.27 ± 0.25) Physical Data Recommended Solder Pad Dimensions (Refl ow): Industry Footprint Dimensions (Inches and mm)) ABCD E F HSF 1 2512 0.121 (3.07) 0.126 (3.20) 0.127 (3.23) 0.183 (4.65) 0.040 (1.02) 0.369 (9.37) HSF 2 3610 0.17 (4.32) 0.16 (4.06) 0.213 (5.41) 0.273 (6.93) 0.044 (1.12) 0.553 (14.05) F EB D A C A L C W HSF High Surge Film Surface Mount Metal GlazeTM HSF-1 Series Issue October 2010 Sheet 2 of 4 06.18 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronics.com/resistors BI Technologies IRC Welwyn
Surface Mount Metal Glaze™ HSF Series 4222 South Staples Street Corpus Christi T exas 78411 USAWire and Film Technologies Division T elephone: 361 992 7900 Facsimile: 361 992 3377 Website: www.irctt.com Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Note 2: The maximum component temperature reached during re ow depends on package thickness and volume. The use of convection re ow processess reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD pack- ages may still exist. Note 3: Components intended for use in “lead- free” assembly process shall be evaluated using the “lead-free” peak temperature and pro les de ned in Table 1, 2 and re ow pro le whether or not lead-free. Tabel 1: SnPb Eutectic Process - Package Peak Refl ow Temperatures Package Thickness Volume mm3 < 350 Volume mm 3 ≥ 350 Tabel 2: Pb-free Process - Package Peak Refl ow Temperatures Package Thickness Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000 < 1.6 mm 260°C * 260°C * 260°C * 1.6 mm - 2.5 mm 260°C * 250°C * 245°C * ≥ 2.5 mm 250°C * 245°C * 245°C * * Tolerance: The device manufacturer/supplier shall assure process compat- ibility up to and including the stated classi cation temperature at the rated MSL level. Note 1: All temperatures refer to topside of the package, measured on the package body surface. Note 2: Time within 5 °C of actual peak temperature (tp) speci ed for the re ow pro les is a “supplier” minimum and a “user” maximum. Profi le Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average Ramp-up rate (Tsmax to Tp) 3°C / second max. 3°C / second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100°C 150°C 60 -120 seconds 150°C 200°C 60 -180 seconds Time maintained above - Temperature (TL) - Time (tL) 183°C 60 - 150 seconds 217°C 60 - 150 seconds Peak Temperature (TP) See Table 1 See Table 2 Time within 5°C of actual Peak Temperature (tp)2 10 - 30 seconds 20 - 40 seconds Ramp-down Rate 6°C / second max. 6°C / second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Sn-Pb Eutectic and Pb-Free Reflow Profiles Time Temperature Critical Zone TL to TP Ramp-down Ramp-up t 25°C to Peak TP TL Tsmax Tsmin ts Preheat tL tP * Based on Industry Standards and IPC recommendations IRC Solder Refl ow Recommendations HSF High Surge Film Surface Mount Metal GlazeTM HSF-1 Series Issue October 2010 Sheet 3 of 4 06.18 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronics.com/resistors BI Technologies IRC Welwyn
- 4222 South Staples Street • Corpus Christi Texas 78411 USAWire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com Surge Capability Data Power Derating Curve Ambient Temperature (C) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 100 Percent of Rated Power Note: Use for low repetitive pulses where the average power dissipation is not to exceed the component rating at 70°C. Surge handling capacity for low-repetitive surges may be signifi cantly greater than shown above. Contact factory Ordering Data Sample Part No. Type HSF-1 or HSF-2 Temperature Coeffi cient 200 = ±200ppm/°C (standard) Note – Standard TCR is ±200ppm/°C. TCR of ±100ppm/°C is available at selected values on request. Resistance Value Standard 4-digit resistance code. Tolerance K = 10% Lead-Free Construction Packaging Code BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel HSF-1 200 11R0 K LF 13 HSF High Surge Film Surface Mount Metal GlazeTM HSF-1 Series Issue October 2010 Sheet 4 of 4 Omit for SnPb. 100 1000 10000 100000 1000000 Peak Power (Watts) Surge or Pulse Duration (Seconds)
2512 CHP, HSF SURGE CAPABILITY
for Non-repetitive or Low Repetition Rate Surges 100 1,000 10,000 100,000 1,000,000 Peak Power (watts) Surge or Pulse Duration (seconds) For Non-repetitive or Low Repetitive Rate Surges on HSF-1 High Surge Film Surface Mount Metal Glaze™ HSF Series 06.18 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronics.com/resistors BI Technologies IRC Welwyn