HSDL9000 HP | Alldatasheet

Document overview

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Technical content

Features

  • Excellent responsivity which peaks in the human luminosity curve at 550 nm Close responsivity to the human eye
  • Miniature PLCC surface-mount package Height – 1.1 mm Width – 4.0 mm Depth – 3.2 mm
  • Ease of design with digital output Integrated photodiode and analog to digital output circuitry
  • Enable fine control of the backlight intensity with adjustable sensitivity control 3 digital levels An Analog Gain Control
  • Minimum power consumption 30 µA typical idle (standby) current <10 nA typical shutdown current
  • Guaranteed temperature performance –25°C to 85°C
  • 2.7 ≤ V CC ≤ 3.6 V
  • Lead-free package
  • Low cost

Applications

  • Detection of ambient light to control display backlighting Mobile devices – mobile phones, PDAs Automotive – dashboard Consumer appliances – audio sets
  • Daylight and artificial light exposed devices With the options of three digital levels and an analog Gain Control pin to fine tune the three threshold levels to achieve better sensitivity control, the HSDL- 9000 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as mobile phones and PDAs that draw heavy current from the display back- lighting will benefit from incorporating the HSDL-9000 in their designs to reduce the power consumption significantly.

Ordering Information

Part Number Packaging Type Package Quantity HSDL-9000 Tape and Reel 6-lead PLCC with Top Transparent Epoxy Surface 1500 Application Circuit For HSDL-9000 Ambient Light Photo Sensor Figure 1. Functional block diagram of HSDL-9000. 2 A0 I Digital Gain Level Control_0 This pin needs to be driven high or low and not left floating. 3 A1 I Digital Gain Level Control_1 This pin needs to be driven high or low and not left floating.

4 GND I Ground Connect to System Ground

5 AGain I Analog Gain Constant Control If not used, leave this pin unconnected.

  1. The HSDL-9000 is in tri-state when it is in shut down mode.
  2. AGain pin is left floating.
  3. Measurements are carried out using incandescent light source.

Figure 2. Relative spectral responsivity vs. wavelength.

  1. Measurements are carried out using incandescent light source.

For implementations where case to ambient thermal resistance is ≤ 50°C/W Parameter Symbol Min. Max. Units Conditions Storage Temperature T S –25 +85 °C Operating Temperature T A –25 +85 °C Supply Voltage V CC 06V Output Voltage: RxD V O –0.5 6 V Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Operating Temperature T A –25 +85 °C Supply Voltage V CC 2.7 3.6 V Logic Input Logic High V IH VCC – 0.2 V CC V Logic Low V IL 0 0.2 V Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25 °C with V CC at 3.0 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Conditions Peak Sensitivity Wavelength λP 550 nm Viewing Angle 120 ° Logic Input Logic High V IH VCC –0.2 V CC V Logic Low V IL 0 0.2 V Output Voltage Logic High V OH VCC –0.2 V CC VI OH = –200 µA Logic Low V OL 0 0.2 V I OL = 200 µA Supply Current I CC 33 100 µA Shutdown Current I CC (SD) 10 100 nA

Figure 3. Package outline dimensions.

Figure 4. Tape and reel dimensions.

Baking should only be done once. recommended storage conditions. Figure 5. Baking conditions chart.

Figure 6. Reflow graph. vective reflow solder process. rates detailed in the above table. minimal stresses on the ALPS.

1.0 Solder Pad, Mask and Metal

Figure 7. Stencil and PCBA.

1.1 Recommended Land Pattern

Figure 8. Stencil and PCBA.

1.2 Recommended Metal Solder

1.3 Adjacent Land Keepout and

Figure 10. Adjacent land keepout and solder mask areas. Figure 9. Solder stencil aperture.

  1. The ground plane should be
  2. The shield trace is a wide, low

left out if the VCC is clean. Figure 11. PCB layout suggestions.

Figure 13. Recommended window dimensions. Table 4. Recommended Dimension for Optical Window

Table 5. Recommended Plastic Material Figure 14. Placement of the window. Polymers Co., Ltd. (Thailand). distributors, please go to our web site. Copyright © 2003 Agilent Technologies, Inc.