HSDL-44XX HP | Alldatasheet

Document overview

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Technical content

Features

  • Subminiature Flat Top and Dome Package Size – 2x2 mm
  • IR Emitter 875 nm TS AlGaAs Intensity – 17 mW/sr Speed – 40 ns
  • Wide Range of Drive Currents 500 µA to 500 mA
  • IR Detector PIN Photodiode High Sensitivity Speed – 7.5 ns
  • Flexible Lead Configurations Surface Mount or Through Hole

Applications

  • Short Distance IR Links
  • IrDA Compatible
  • Small Handheld Devices Pagers Industrial Handhelds
  • Diffuse LANs
  • Wireless Audio

Description

The HSDL-4400 Series of flat top IR emitters use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is useful for short distance communication where alignment of the emitter and detector is not critical. The HSDL-5400 Series of flat top IR detectors uses the same truncated lens design as the HSDL-4400 Series of IR emitters with the added feature of a black tint that acts as an optical filter to reduce the effects of ambient light, such as sun, incandescent and fluorescent light from interfering with the IR signal. Dome Package The HSDL-4420 Series of dome IR emitters uses an untinted, nondiffused lens to provide a 24 degree viewing angle with high on-axis intensity. The HSDL-5420 Series of IR detectors uses the same lens design as the HSDL-

4420 IR emitter and optical filter

detector. Lead Configuration All of these devices are made by encapsulating LED and PIN photodiode chips on axial lead frames to form molded epoxy subminiature packages. A variety of lead configurations is available and includes: surface mount gull wing, yoke lead, or Z-bend and through hole lead bends at 2.54 mm (0.100 inch) center spacing. Technology The subminiature solid state emitters utilize a highly optimized LED material, transparent sub- strate aluminum gallium arsenide, TS AlGaAs. This material has a very high radiant efficiency, capable of producing high light output over a wide range of drive currents and temperature. HSDL-44xx IR Emitter Series HSDL-54xx IR Detector Series

Package Configuration Options Package Outline Option Code Package Configuration Description Drawing

011 Gull Wing Lead, Tape and Reel [2] E, J, M

021 Yoke Lead, Tape and Reel [2] F, K, M

031 Z-Bend, Tape and Reel [2] G, L, M

1L1 2.54 mm (0.100 in) Long Leads; Thru Hole H Center Lead Spacing 10.4 mm (0.410 in) Lead 1S1 Short Leads; I 3.7 mm (0.145 in) No Option Straight Leads [3] Prototyping A, B, C, D Notes: 1. IR Emitters have untinted, nondiffused lenses and IR Detectors have black tinted, nondiffused lenses. 2. Emitters and detectors are supplied in 12 mm embossed tape on 178 mm (7 inch) diameter reels, with 1500 units per reel. Minimum order quantity and order increment are in quantity of reels only. 3. Emitters and detectors are supplied in bulk form in bags of 50 units. 4. The HSDL-44xx and HSDL-54xx families are not designed to be used in medical devices with life support functions or in safety equipment (or similar applications where components failures would result in loss of life or physical harm), eg. in automotive, medical or airline industries. IR Detectors Part Number Device Description [1] Device Outline Drawing HSDL-5400 PIN Photodiode, Flat Top, 110 deg C HSDL-5420 PIN Photodiode, Dome, 28 deg D Device Selection Guide IR Emitters Part Number Device Description [1] Device Outline Drawing HSDL-4400 LED, Flat Top, 110 deg A HSDL-4420 LED, Dome, 24 deg B Surface Mount Lead

NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES). 2. PROTRUDING SUPPORT TAB IS CONNECTED TO ANODE LEAD. 3. LEAD POLARITY FOR THESE TS AlGaAs SUBMINIATURE LAMPS IS OPPOSITE TO THE LEAD POLARITY OF SUBMINIATURE LAMPS USING OTHER LED TECHNOLOGIES. 4. CATHODE STRIPE MARKING IS DARK BLUE. Package Dimensions (A) Flat Top Emitters (B) Dome Emitters 1.14 1.40 (0.045) (0.055) 0.58 0.43 (0.023) (0.017) 1.91 2.16 (0.075) (0.085) 0.18 0.23 (0.007) (0.009) 0.76 (0.030) MAX. 1.91 2.41 (0.075) (0.095) 2.08 2.34 (0.082) (0.092) CATHODE STRIPE NOTE 4 0.46 0.56 (0.018) (0.022) 1.40 1.65 (0.055) (0.065) 0.25 (0.010) MAX.* 0.20 (0.008) MAX. 0.50 (0.020) REF. NOTE 3 ANODE 1.65 1.91 (0.065) (0.075) DIA. CATHODE 11.68 10.67 (0.460) (0.420) BOTH SIDES NOTE 2 0.25 (0.010) MAX.* 0.20 (0.008) MAX. 0.50 (0.020) REF. NOTE 3 ANODE 1.65 1.91 (0.065) (0.075) DIA. CATHODE 0.46 0.56 (0.018) (0.022) NOTE 2 11.68 10.67 (0.460) (0.420) BOTH SIDES 0.94 1.24 (0.037) (0.049) 2.08 2.34 (0.082) (0.092) CATHODE STRIPE NOTE 4 2.92 (0.115) MAX. 0.76 0.89 (0.030) (0.035) 0.63 0.38 (0.025) (0.015) 0.18 0.23 (0.007) (0.009) 1.91 2.16 (0.075) (0.085) 2.03 (0.080) 1.78 (0.070) 0.79 (0.031) 0.53 (0.021)

(D) Dome Detectors (C) Flat Top Detectors NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES). 2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD. 3. CATHODE STRIPE MARKING IS DARK BLUE. 1.14 1.40 (0.045) (0.055) 0.58 0.43 (0.023) (0.017) 1.91 2.16 (0.075) (0.085) 0.18 0.23 (0.007) (0.009) 0.76 (0.030) MAX. 1.91 2.41 (0.075) (0.095) 2.08 2.34 (0.082) (0.092) CATHODE STRIPE NOTE 3 0.46 0.56 (0.018) (0.022) 1.40 1.65 (0.055) (0.065) 0.25 (0.010) MAX.* 0.20 (0.008) MAX. 0.50 (0.020) REF. CATHODE 1.65 1.91 (0.065) (0.075)DIA. ANODE 11.68 10.67 (0.460) (0.420) BOTH SIDES NOTE 2 0.25 (0.010) MAX.* 0.20 (0.008) MAX. 0.50 (0.020) REF. CATHODE 1.65 1.91 (0.065) (0.075)DIA. ANODE 0.46 0.56 (0.018) (0.022) NOTE 2 11.68 10.67 (0.460) (0.420) BOTH SIDES 0.94 1.24 (0.037) (0.049) 2.08 2.34 (0.082) (0.092) CATHODE STRIPE NOTE 3 2.92 (0.115) MAX. 0.76 0.89 (0.030) (0.035) 0.63 0.38 (0.025) (0.015) 0.18 0.23 (0.007) (0.009) 1.91 2.16 (0.075) (0.085) 2.03 (0.080) 1.78 (0.070) 0.79 (0.031) 0.53 (0.021)

0.76 (0.030) MAX. (F) “Yoke” Lead, Options 021 0.76 (0.030) MAX. Package Dimensions The following notes affect the package outline drawings E through I. 1. The pinout represents the HSDL-54xx IR detectors where the protruding support tab is closest to the anode lead. While the pinout is reversed for the HSDL-44xx IR emitters where the protruding support tab is closest to the cathode lead. 2. The protruding support tab of the HSDL-54xx is connected to the cathode lead. While the protruding support tab of the HSDL-44xx is connected to the anode lead. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES) (E) Gull Wing Lead, Option 011

(G) Z-Bend Lead, Options 031 0.76 (0.030) MAX. (H) Thru Hole Lead Option 1L1 (I) Thru Hole Lead Option 1S1

Package Dimensions: Surface Mount Tape and Reel Options (J) 12 mm Tape and Reel, Gull Wing Lead, Option 011 GULL WING LEAD SUBMINIATURE PACKAGE NOTES: 1. EMPTY COMPONENT POCKETS SEALED WITH TOP COVER TAPE. 2. 7 INCH REEL – 1500 PIECES PER REEL. 3. MINIMUM LEADER LENGTH AT EITHER END OF THE TAPE IS 500 mm. 4. THE MAXIMUM NUMBER OF CONSECUTIVE MISSING DEVICES IS TWO. 5. IN ACCORDANCE WITH ANSI/EIA RS-481 SPECIFICATIONS, THE CATHODE IS ORIENTED TOWARDS THE TAPE SPROCKETS HOLE.

(K) 12 mm Tape and Reel, “Yoke” Lead, Option 021 “YOKE” LEAD SUBMINIATURE PACKAGE

(L) 12 mm Tape and Reel, Z-Bend Lead, Option 031 Z-BEND LEAD SUBMINIATURE PACKAGE

(M) 12 mm Tape and Reel

HSDL-44xx Absolute Maximum Ratings Parameter Symbol Min. Max. Unit Ref. Peak Forward Current (Duty Factor = 20%, I FPK 500 mA Fig. 7, 8 Pulse Width = 100 µs) DC Forward Current I FDC 100 mA Fig. 6 Power Dissipation P DISS 100 mW Reverse Voltage (IR = 100 µA) V R 5V Transient Forward Current (10 µs Pulse) I FTR 1.0 A [1] Operating Temperature T O -40 85 °C Storage Temperature T S -55 100 °C Junction Temperature T J 110 °C Lead Solder Temperature 260/5 s °C [1.6 mm (0.063 in.) from body] Reflow Soldering Temperatures Convection IR 235/90 s °C Fig. 20 Vapor Phase 215/180 s °C Note: 1. The transient peak current in the maximum nonrecurring peak current the device can withstand without damaging the LED die and the wire bonds. HSDL-44xx Electrical Characteristics at TA = 25°C Parameter Symbol Min. Typ. Max. Unit Condition Ref. Forward Voltage V F 1.30 1.50 1.70 V I FDC = 50 mA Fig. 2

2.15 I FPK = 250 mA

Forward Voltage Δ VF/Δ T -2.1 mV/ °CI FDC = 50 mA Fig. 3 Temperature Coefficient -2.1 I FDC = 100 mA Series Resistance R S 2 Ω IFDC = 100 mA Diode Capacitance C O 50 pF 0 V, 1 MHz Reverse Voltage V R 52 0 V I R = 100 µA Thermal Resistance, R θjp 170 °C/W Junction to Pin

HSDL-44XX Optical Characteristics at TA = 25°C Parameter Symbol Min. Typ. Max. Unit Condition Ref. Radiant On-Axis Intensity HSDL-4400 I E 1 3 8 mW/sr I FDC = 50 mA Fig. 4, 5 6I FDC = 100 mA

15 I FPK = 250 mA

HSDL-4420 I E 9 17 30 mW/sr I FDC = 50 mA Fig. 4, 5

32 I FDC = 100 mA

85 I FPK = 250 mA

Radiant On-Axis Intensity Δ IE/Δ T -0.35 %/ °CI FDC = 50 mA Temperature Coefficient -0.35 I FDC = 100 mA Viewing Angle HSDL-4400 2 θ1/2 110 deg I FDC = 50 mA Fig. 9 HSDL-4420 2 θ1/2 24 deg I FDC = 50 mA Fig. 10 Peak Wavelength λPK 850 875 900 nm I FDC = 50 mA Fig. 1 Peak Wavelength Δλ /Δ T 0.25 nm/ °CI FDC = 50 mA Temperature Coefficient Spectral Width at FWHM Δλ 37 nm I FDC = 50 mA Fig. 1 Optical Rise and Fall t r/tf 40 ns I FPK = 50 mA Times, 10%-90% Bandwidth f c 9 MHz I FDC = 50 mA Fig. 11 ± 10 mA

HSDL-54xx Absolute Maximum Ratings Parameter Symbol Min. Max. Unit Power Dissipation P DISS 150 mW Reverse Voltage (IR = 100 µA) V R 40 V Operating Temperature T O -40 85 °C Storage Temperature T S -55 100 °C Junction Temperature T J 110 °C Lead Solder Temperature [1.6 mm (0.063 in.) from body] 260/5 s °C Reflow Soldering Temperatures Convection IR 235/90 s °C Vapor Phase 215/180 s °C HSDL-54xx Electrical Characteristics at TA = 25°C Parameter Symbol Min. Typ. Max. Unit Condition Ref. Forward Voltage V F 0.8 V I FDC = 1 mA Breakdown Voltage V BR 40 V I R = 100 µA, Ee = 0 mW/cm2 Reverse Dark Current I D 15 n A V R = 5 V, Fig. 12 Ee = 0 mW/cm2 Series Resistance R S 2000 Ω VR = 5 V, Ee = 0 mW/cm2 Diode Capacitance C O 5p F V R = 0 V, Fig. 16 Ee = 0 mW/cm2 f = 1 MHz Open Circuit Voltage V OC 375 mV E e = 1 mW/cm2 λPK = 875 nm Temperature Coefficient of VOC Δ VOC/Δ T -2.2 mV/K E e = 1 mW/cm2 λPK = 875 nm Short Circuit Current I SC Ee = 1 mW/cm2 HSDL-5400 1.6 µA HSDL-5420 4.3 µA Temperature Coefficient of I SC Δ ISC/Δ T 0.16 %/K E e = 1 mW/cm2 λPK = 875 nm Thermal Resistance, R θjp 170 °C/W Junction to Pin λPK = 875 nm

Fig. 14, Ee = 1 mW/cm2 λPK = 875 nm VR = 5 V HSDL-54xx Optical Characteristics at TA = 25°C Parameter Symbol Min. Typ. Max. Unit Condition Ref. Photocurrent HSDL-5400 I PH 0.8 1.6 µA HSDL-5420 3.0 6.0 Temperature Coefficient Δ IPH/Δ T 0.1 %/K E e = 1 mW/cm2 Fig. 13 of IPH λPK = 875 nm VR = 5 V Radiant Sensitive Area A 0.15 mm 2 Absolute Spectral Sensitivity S 0.5 A/W E e = 1 mW/cm2 λPK = 875 nm VR = 5 V Viewing Angle HSDL-5400 2 θ1/2 110 deg Fig. 18 HSDL-5420 28 Fig. 19 Wavelength of Peak λPK 875 nm E e = 1 mW/cm2 Fig. 17 Sensitivity V R = 5 V Spectral Bandwidth Δλ 770- nm E e = 1 mW/cm2 Fig. 17

1000 V R = 5 V

Quantum Efficiency η 70 % E e = 1 mW/cm2 λPK = 875 nm, VR = 5 V Noise Equivalent Power NEP 6.2 x W/Hz 1/2 VR = 5 V 10-15 λPK = 875 nm Detectivity D 6.3 x cm* V R = 5 V

1012 Hz1/2/W λPK = 875 nm

Optical Rise and Fall Times, t r/tf 7.5 ns V R = 5 V 10%-90% R L = 1 kΩ λPK = 875 nm Bandwidth f c 50 MHz V R = 5 V RL = 1 kΩ λPK = 875 nm

Figure 12. Reverse Dark Current vs. Figure 13. Relative Reverse Light Current vs. Ambient Temperature. Figure 10. Relative Radiant Intensity vs. Angular Displacement

0.9 IF = 50 mA

Figure 9. Relative Radiant Intensity vs. Angular Displacement Figure 11. Relative Radiant Intensity

9 MHz

www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 271 2451 India, Australia, New Zealand: (+65) 271 2394 Japan: (+81 3) 3335-8152(Domestic/Interna- tional), or 0120-61-1280(Domestic Only) Korea: (+65) 271 2194 Malaysia, Singapore: (+65) 271 2054 Taiwan: (+65) 271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. Obsoletes 5988-2425EN January 17, 2002 5988-5284EN