HSDL-3603 HP | Alldatasheet
Document overview
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Technical content
Features
- Fully compliant to IrDA 1.4 Fast Infrared (FIR) from 9.6 kbit/s to
4 Mbit/s
- Typical link distance > 1.5 m
- Miniature package – Height: 3.90 mm – Width: 9.80 mm – Depth: 4.65 mm
- Guaranteed temperature performance, -25 to 70°C – Critical parameters are guaranteed over temperature and supply voltage
- Low power consumption – Low shutdown current (10 nA typical) – Complete shutdown of TXD, RXD, and PIN diode
- Withstands >100 mV p-p power supply ripple typically
- V CC supply 2.7 to 5.25 volts
- Integrated EMI shield
- LED stuck-high protection
- Designed to accommodate light loss with cosmetic windows
- IEC 825-Class 1 eye safe
- Interface to various super I/O and controller devices
Description
The HSDL-3603 is a low profile infrared transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data-link. The module is fully compliant to IrDA Date Physical Layer Specifications v1.4 Fct Infrared (FIR) and IEC825- Class I Eye Safe. The HSDL-3603 can be shut down completely to achieve very low power consumption. In the shutdown mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. Such features are ideal for mobile devices that require low power consumption.
I/O Pins Configuration Table Pin Symbol Description I/O Type Function 1 LED A LED Anode Input This pin can be connected directly to V CC (i.e., without series resistor) at less than 3 V. Please refer to Table 1 for VCC versus Series Resistor, R1. 2 LED C LED Cathode Output Leave this pin unconnected. 3 TXD Transmit Data Input, This pin is used to transmit serial data when SD/Mode pin is low. If this Active High pin is held high longer than ~100 µs, the LED would be turned off when used in conjunction with the SD/Mode pin. TXD is low at initialization. 4 RXD Receive Data Output, This pin is capable of driving a standard CMOS or TTL load. No external Active Low pull-up or pull-down resistor is required. It is in tri-state mode when the transceiver is in shutdown mode and during digital serial programming operations. RXD is high at initialization.
5 SD/Mode Shutdown/ Input, The transceiver is in shutdown mode if this pin is high for more than
Mode Select Active High 400 µs. On the falling edge of this signal, the state of the TXD pin sampled and used to set receiver low bandwidth (TXD=low) or high bandwidth (TXD=high) mode. See Figure 2 for bandwidth selection timings. SD is low at initialization. 6V CC Supply Supply Regulated, 2.7 to 5.25 Volts. Voltage Voltage
7 NC No Connect No Connect
8 GND Ground Ground Connect to system ground. – Shield EMI Shield EMI Shield Connect to system ground via a low inductance trace. For best performance, do not connect directly to the transceiver pin GND. Recommended Application Circuit Components Component Recommended Value Notes R1 0 Ω ± 5%, 0.5 Watt, for 2.7 V 1.8 Ω ± 5%, 0.5 Watt, for 3.0 V 4.7 Ω ± 5%, 0.5 Watt, for 3.3 V 6.8 Ω ± 5%, 0.5 Watt, for 3.5 V CX1 0.47 µF ± 20%, X7R Ceramic 1 CX2 6.8 µF ± 20%, Tantalum 2 Notes: 1. CX1 must be placed within 0.7 cm of the HSDL-3603 to obtain optimum noise immunity. 2. In environments with noisy power supplies, supply rejection performance can be enhanced by including CX2, as shown in Figure 1: ”HSDL-3603 Functional Block Diagram“ on Page 2.
Figure 3. Bandwidth selection timing at SIR/MIR mode. Figure 4. Bandwidth selection timing at FIR mode.
- Set SD/Mode input to logic
- TXD input should remain at
- Ensure that TXD input remains
- SD input pulse width for mode
selection should be > 50 ns.
- Set SD/Mode input to logic
- After SD/Mode input remains
- Then set SD/Mode to logic
- SD input pulse width mode
Transceiver I/O Truth Table Inputs Outputs TXD Light Input to Receiver SD LED RXD Notes High Don’t Care Low On Not Valid Low High Low Off Low 1, 2 Low Low Low Off High Don’t Care Don’t Care High Off High Notes: 1. In-band IrDA signals and data rates ≤ 4Mbit/s. 2. RXD logic low is a pulsed response. The condition is maintained for a duration dependent on pattern and strength of the incident intensity. Caution: The BiCMOS inherent to the design of this component increases the component’s suscepti- bility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Units Conditions Operating Temperature T A –25 70 °C Supply Voltage V CC 2.7 5.25 V Logic Input Voltage Logic High V IH 2/3 VCC VCC V for TXD, SD/Mode Logic Low V IL 0 1/3 V CC V Receiver Input Logic High EI H 0.0036 500 mW/cm 2 For in-band signals ≤ 115.2 kbit/s[4] Irradiance 0.0090 500 mW/cm 2 0.576 Mbit/s ≤ in-band signals ≤ 4 Mbit/s[4] Logic Low EI L 0.3 µW/cm2 For in-band signals ≤ 115.2 kbit/s[4] LED (Logic High) Current I LEDA 400 600 mA Pulse Amplitude Receiver Data Rate 0.0096 4.0 Mbit/s Note: 4. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 ≤ λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification v1.4. Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50°C/W. Parameter Symbol Min. Max. Units Notes Storage Temperature T S –40 100 °C Operating Temperature T A –25 70 °C LED Anode Voltage V LEDA 0 6.5 V Supply Voltage V CC 0 6.5 V Input Voltage: TXD, SD/Mode V I 0 6.5 V Output Voltage: RXD V O 0 6.5 V DC LED Transmit Current I LED (DC) 150 mA Average Transmit Current I LED (PK) 650 mA 3 Note: 3. ≤ 25% duty cycle, ≤ 90 µs pulse width.
Electrical and Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with V CC set to 3.0 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Conditions Receiver Viewing Angle 2 θ 30 ° Peak Sensitivity Wavelength λp 880 nm RXD Output Voltage Logic High V OH VCC – 0.2 V CC VI OH = –200 µA, EI ≤ 0.3 µW/cm2 Logic Low V OL 0 0.4 V I OL = 200 µA, EI ≥ 3.6 µW/cm2 RXD Pulse Width (SIR) t PW (SIR) 1 4.0 µs θ ≤ 15°, CL = 12 pF[5] RXD Pulse Width (MIR) t PW(MIR) 100 500 ns θ ≤ 15°, CL = 12 pF 6] RXD Pulse Width (FIR) t PW(FIR) 80 165 ns θ ≤ 15°, CL = 12 pF[7] RXD Rise and Fall Times t r, tf 25 ns C L =12 pF Receiver Latency Time t L 10 150 µs Receiver Wake Up Time t rw 10 150 µs Transmitter Radiant Intensity IE H 100 180 mW/Sr I LEDA = 400 mA, θ ≤ 15°, VTXD ≥ VIH T = 25 °C Viewing Angle 2 θ 30 60 ° Peak Wavelength λP 875 nm Spectral Line Half Width Δλ 35 nm TXD Logic Levels High V IH 2/3 VCC VCC V Low V IL 0 1/3 V CC V TXD Input Current High I H 0.02 10 µAV I ≥ VIH Low I L –10 –0.02 10 µA0 ≤ VI ≤ VIL LED Current On I VLED 400 600 mA V I(TXD) ≥ VIH Shutdown I VLED 20 1000 nA V I(SD) ≥ VIH, TA = 25°C TXD Pulse Width (MIR) t PW(MIR) 148 217 260 ns t PW (TXD) = 217 ns at 1.152 Mbit/s TXD Pulse Width (FIR) t PW(FIR) 115 125 135 ns t PW (TXD) = 125 ns at 4.0 Mbit/s Maximum Optical PW t PW(max.) 60 100 µs TXD Rise and Fall Time (Optical) t r, tf 40 ns t PW (TXD) = 125 ns at 4.0 Mbit/s Transceiver Supply Current Shutdown I CC1 10 1000 nA V SD ≥ 2/3 VCC, TA = 25°C Idle I CC2 1.8 3.0 mA V I(TXD) ≤ VIL, EI = 0 Active I CC3 2.5 mA EI = 10 mW/cm 2 Notes: 5. For in-band signals ≤ 115.2 kbit/s where 3.6 µW/cm2 ≤ EI ≤ 500 mW/cm2. 6. For in-band signals at 1.152 Mbit/s where 9.0 µW/cm2 ≤ EI ≤ 500 mW/cm2. 7. For in-band signals of 125 ns pulse width, 4 Mbit/s, 4 PPM at recommended 400 mA drive current.
Figure 12. Package outline dimensions.
1 LEDA 5 SD/MODE
2 LEDC 6 Vcc
3 TXD 7 NC
4 RXD 8 GND
Figure 13. Tape and reel dimensions.
reflow to prevent damage to the parts. Baking should only be done once. Figure 14. Baking conditions. recommended storage conditions.
printed circuit board connections. HSDL-3603 castellation I/O pins. seconds) to dry the solder paste. Figure 15. Reflow graph.
- Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area.
- “ h” is the minimum solder resist strip width required to avoid solder bridging adjacent pads.
- It is recommended that 2 fiducial cross be placed at mid-length of the pads for unit alignment. Note: Wet/Liquid photo- imagineable solder resist/mask is recommended. 1.2. Adjacent Land Keep-out and Solder Mask Areas
Figure 18. PCBA – Adjacent land keep-out and solder mask.
Figure 19. Solder paste stencil aperture. Aperture opening for shield pad is 2.50 mm x 1.51 mm as per land dimension.
connected to the ground plane.
- C1 and C2 are optional supply
- VLED can be connected to either
which carries a high current.
- Preferably, a multi-layered board
ground connected board layers. an example of a 4-layer board. GROUND PIN TO BOTTOM GROUND LAYER. Figure 20. PCB layout suggestion.
Appendix C: General Application Guide for the HSDL-3603 Infrared IrDA ® Compliant 4 Mb/s Transceiver The HSDL-3603 wide voltage operating range infrared trans- ceiver is a low-cost and small form factor that is designed to address the mobile computing market such as notebooks, print- ers, and LAN access as well as small embedded mobile products such as digital cameras, cellular phones, and PDAs. It is fully com- pliant to IrDA 1.4 specification up to 4 Mb/s. The design of the HSDL-3603 also includes the following unique features:
- Low passive component count.
- Shutdown mode for low power consumption requirement.
- Single-receive output for all data rates. Selection of Resistor R1 Resistor R1 should be selected to provide the appropriate peak pulse LED current over different ranges of V CC. The recommended selection of R1 is tabulated in the table on page 3. The HSDL-3603 typically provides 180 mW/Sr of intensity at the recommended minimum peak pulse LED current of 400 mA. Interface to Recommended I/O chips The HSDL-3603’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb/s up to 4 Mb/s is available at the RXD pin. Following shows the interface of HSDL-3603 with National Semiconductor’s Super I/Os, and the SMC I/O chips.
- Connect IRTX of the National Super I/O or IR Controller to TXD (pin 3) of the HSDL-3603.
- Connect IRRX1 of the National Super I/O or IR Controller to RXD (pin 4) of the HSDL-3603.
- Connect IRSL0 of the National Super I/O or IR Controller to SD/Mode (pin 5) of the HSDL- 3603. Please refer to the table below for the IR pin assignments for the National Super I/O and IR Con- trollers that support IrDA 1.4 up to 4 Mb/s:
Figure 21. NS Super I/O configuration circuit.
Figure 22. SMC Super I/O configuration circuit.
- Connect IRTX of the SMC Super or Ultra I/O Controller to TXD (pin 3) of the HSDL-3603.
- Connect IRRX of the SMC Super or Ultra I/O Controller to RXD (pin 4) of the HSDL-3603.
- Connect IRMODE of the Super or Ultra I/O Controller to SD/Mode (pin 5) of the HSDL- 3603. Please refer to the table below for the IR pin assignments for the SMC Super or Ultra I/O Control- lers that support IrDA 1.4 up to
4 Mb/s:
and width of the window exist. sponds to a cone angle of 60 º . index of the window material. side the HSDL-3603, D, is 8 mm. Figure 25. Window design diagram.
Module Depth, (z) mm max. min. max. min.
Polycarbonate is recommended. Note: 920A and 940A are more flame retardant than 141L. Recommended Dye: Violet #21051 (IR transmissant above 625 nm). significantly reduce the effects. the back surface to the transceiver. Figure 28. Window design choices.
www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/Interna- tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. December 3, 2002 5988-7926EN