HSDL3208 HP | Alldatasheet
Document overview
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Technical content
Features
- Fully compliant to IrDA 1.4 low power specification from 9.6 kbit/s to 115.2 kbit/s
- Miniature package – Height: 1.60 mm – Width: 7.00 mm – Depth: 2.8 mm
- Guaranteed temperature performance, -25 to +85°C – Critical parameters are guaranteed over temperature and supply voltage
- Low power consumption – Low shutdown current (1 nA typical) – Complete shutdown of TXD, RXD, and PIN diode
- Withstands >100 mVp-p power supply ripple typically
- Excellent EMI performance without shield CC supply 2.7 to 3.6 volts
- LED stuck-high protection
- Designed to accommodate light loss with cosmetic windows
- IEC 825-class 1 eye safe
Applications
- IRFM
- Mobile telecom – Cellular phones – Pagers – Smart phones
- Data communication – PDAs – Portable printers
- Digital imaging – Digital cameras – Photo-imaging printers The HSDL-3208 can be shut down completely to achieve very low power consumption. In the shutdown mode, the PIN diode will be inactive and thus produc- ing very little photocurrent even under very bright ambient light. Such features are ideal for bat- tery operated handheld products.
Figure 1. Functional block diagram of HSDL-3208. Figure 2. Rear view diagram with pinout.
Application Support Information The Application Engineering group in Agilent Technologies is available to assist you with the technical understanding Order Information Part Number Packaging Type Package Quantity HSDL-3208-021 Tape and Reel Front View 2500 Recommended Application Circuit Components Component Recommended Value Notes R1 2.7 Ω ± 5%, 0.25 Watt for 2.7 <= V CC <= 3.6 V CX1 0.47 µF ± 20%, X7R Ceramic 8 CX2 6.8 µF ± 20%, Tantalum 9 Notes: 8. CX1 must be placed within 0.7 cm of the HSDL-3208 to obtain optimum noise immunity. 9. In environments with noisy power supplies, supply rejection performance can be enhanced by including CX2, as shown in “Figure 1: HSDL-3208 Functional Block Diagram” in Page 1. associated with HSDL-3208 infrared transceiver module. You can contact them through your local Agilent sales representatives for additional details. I/O Pins Configuration Table Pin Symbol Description I/O Type Notes
1 LED A LED Anode Input 1
2 LED C LED Cathode Input 2
3 TXD Transmit Data Input, Active High 3
4 RXD Receive Data Output, Active Low 4
5 SD/Mode Shutdown Input, Active High 5
6V CC Supply Voltage Supply Voltage 6
7 GND Ground Ground 7
Notes: 1. This pin can be connected directly to V CC (i.e. without series resistor) at less than 3 V. 2. Internally connected to the LED driver. 3. This pin is used to transmit serial data when SD pin is low. Do not float the pin. 4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull down resistor is required. It is in tri-state mode when the transceiver is in shutdown mode. 5. The transceiver is in shutdown mode if this pin is high. Do not float the pin. 6. Regulated, 2.7 to 3.6 volts. 7. Connect to system ground.
For implementations where case to ambient thermal resistance is ≤ _50°C/W. Parameter Symbol Min. Max. Units Notes Storage Temperature T S -40 +100 °C Operating Temperature T A -25 +85 °C LED Anode Voltage V LEDA 0 6.5 V Supply Voltage V CC 0 6.5 V Input Voltage: TXD, SD/Mode V I 0 6.5 V Output Voltage: RXD V O 0 6.5 V DC LED Transmit Current I LED (DC) 50 mA Peak LED Transmit Current I LED (PK) 250 mA 10 Note: 10. ≤ 20% duty cycle, ≤ 90 µs pulse width. Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Units Conditions Operating Temperature T A -25 +85 °C Supply Voltage V CC 2.7 3.6 V Logic Input Voltage Logic High V IH 2/3 VCC VCC V Logic Low V IL 0 1/3 V CC V Receiver Input Logic High EI H 0.0081 500 mW/cm 2 For in-band signals ≤ 115.2kbit/s[11] Logic Low EI L 1 µW/cm2 For in-band signals[11] LED (Logic High) Current I LEDA 50 mA Pulse Amplitude Receiver Data Rate 9.6 115.2 kbit/s Note: 11. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 ≤ λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification v1.4. CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from the electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. for TXD, SD/Mode Irradiance
Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25 °C with VCC set to 3.0 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Conditions Receiver Viewing Angle 2 θ 30 ° Peak Sensitivity Wavelength λp 880 nm RXD Output Logic High V OH VCC-0.2 V CC VI OH = -200 µA, EI ≤ 1 µW/cm2 Logic Low V OL 0 0.4 V I OL = 200 µA, EI ≥ 8.1 µW/cm2 RXD Pulse Width (SIR) t PW (SIR) 1 4.0 µs θ ≤ 15°, CL =12 pF RXD Rise and Fall Times t r, tf 50 ns C L =12 pF Receiver Latency Time t L 70 µs Receiver Wake Up Time t W 90 µs Transmitter Radiant Intensity IE H 4 8 mW/sr I LEDA = 50 mA, θ ≤ 15°, VTXD ≥ VIH T = 25°C Viewing Angle 2 θ 30 60 ° Peak Wavelength λp 875 nm Spectral Line Half Width Δλ 35 nm TXD Input Current High I H 0.02 10 µAV I ≥ VIH Low I L -10 -0.02 10 µA0 ≤ VI _≤ VIL LED Current On I VLED 50 mA V I (TXD) ≥ VIH, VI (SD) ≤ VIL Shutdown I VLED 20 100 nA V I (SD) ≥ VIH Maximum Optical PW t PW(max.) 25 100 µs TXD Rise and Fall Time (Optical) t r, tf 600 ns tpw (TXD) = 1.6 µs LED Anode on State Voltage V ON(LEDA) 1.5 V I LEDA = 50 mA, VI(TXD) ≥ VIH Transceiver Supply Current Shutdown I CC1 0.001 1 µAV SD ≥ 2/3 IO VCC, TA = 25°C Idle I CC2 100 200 µAV I (TXD) ≤ VIL, EI = 0 Voltage
Figure 10. Package outline dimensions.
Figure 11. Tape and reel dimensions.
Baking should only be done once. Figure 12. Baking conditions chart.
convective reflow solder process. printed circuit board connections. Figure 13. Reflow graph. seconds) to dry the solder paste.
1.0 Solder Pad, Mask and Metal
Figure 14. Stencil and PCBA.
1.1 Recommended Land Pattern
Figure 15. Stencil and PCBA.
1.3 Adjacent Land Keepout and
Figure 17. Adjacent land keepout and solder mask areas.
1.2 Recommended Metal Solder
thickness that should be used. Figure 16. Solder stencil aperture.
Figure 18. PCB layout suggestion. trace, unlike the other transceivers. connected to the ground plane.
- C1 and C2 are optional supply
- VLED can be connected to either
which carries a high current.
- Preferably a multi-layered board
ground connected board layers. an example of a 4-layer board. GROUND PIN TO BOTTOM GROUND LAYER.
Appendix C : General Application Guide for the HSDL-3208 Infrared IrDA ® Compliant 115.2 kb/s Transceiver
Description
The HSDL-3208 is an ultra-small low-cost infrared transceiver module that provides the interface between logic and infrared (IR) signals for through air, serial, half-duplex IR data link. The device is designed to address the mobile computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones. It is fully compliant to IrDA 1.4 low Minimum Peak Pulse Recommended R1 V CC Intensity LED Current 2.7 Ω 3.3 V 9 mW/Sr 50 mA Figure 19: IR layout in mobile phone platform. power specification from 9.6 kb/s to 115.2 kb/s, and supports HP- SIR and TV Remote modes. The design of the HSDL-3208 also includes the following unique features:
- Low passive component count
- Shutdown mode for low power consumption requirement Selection of Resistor R1 Resistor R1 should be selected to provide the appropriate peak pulse LED current over different ranges of V CC as shown in the table below. TRANSCEIVER MOD/ DE-MODULATOR SPEAKER RF INTERFACE AUDIO INTERFACE USER INTERFACE MICROCONTROLLER DSP CORE ASIC CONTROLLER IR MICROPHONE HSDL-3208 Interface to Recommended I/O Chips The HSDL-3208’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb/s up to 115.2 kb/s is available at the RXD pin. The diagram below shows how the IR port fits into the mobile phone platform and PDA platform.
Figure 20: IR layout in PDA platform. The link distance testing is done using typical HSDL-3208 units with National Semiconductor’s PC87109 3V Super I/O Controller and SMC’s FDC37C669 and FDC37N769 Super I/O controllers. An 115.2 kb/s datarate IR link distance of up to 40 cm has been demonstrated. PCMCIA CONTROLLER CPU FOR EMBEDDED APPLICATION IR HSDL-3208 RAM ROM TOUCH PANEL LCD PANEL RS232C DRIVER COM PORT
index of the window material. Figure 21. Window design diagram.
Polycarbonate is recommended. Note: 920A and 940A are more flame retardant than 141L. Recommended Dye: Violet #21051 (IR transmissant above 625 nm). significantly reduce the effects. the back surface to the transceiver. Figure 24. Shape of windows.
www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/Interna- tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. October 9, 2002 5988-7857EN