HSDL-3203 HP | Alldatasheet
Document overview
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Technical content
Features
- Fully compliant to IrDA 1.4 low power specification from 9.6 kbit/s to 115.2 kbit/s
- Low power operation at extended link distance of 50 cm
- Miniature package — Height: 1.95 mm — Width: 8.00 mm — Depth: 3.10 mm
- Guaranteed temperature performance, –20 to +70˚C — Critical parameters are guaranteed over temperature and supply voltage
- Low power consumption — Low shutdown current (10 nA typical) — Complete shutdown of TXD, RXD, and PIN diode
- Withstands > 100 mV p-p power supply ripple typically
- V CC supply 2.7 to 3.6 volts
- Integrated EMI shield
- LED stuck-high protection
- Designed to accommodate light loss with cosmetic windows
- IEC 825-Class 1 Eye Safe
- Lead-free and RoHS Compliant
Description
The HSDL-3203 is a miniature low cost infrared transceiver module that provides the interface between logic and infrared (IR) signals for through air, serial, half-duplex IR data link. The module is compliant to IrDA Physical Layer Specifica- tions version 1.4 Low Power from 9.6 kbit/s to 115.2 kbit/s with extended link distance and it is IEC 825-Class 1 eye safe. The HSDL-3203 can be shutdown completely to achieve very low power consumption. In the shut- down mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. Such features are ideal for battery operated handheld products.
Applications
- Mobile telecom — Mobile phones — Pagers — Smart phone
- Data communication — PDAs — Portable printers
- Digital imaging — Digital cameras — Photo-imaging printers
- Electronic wallet, IrFM
I/O Pin Configuration Table Pin Symbol I / O Description Note
1 CX I Pin bypass capacitor
2 SD I Shutdown. Active high 1
3 AGND I Analog ground 2
4 GND I Ground 2
5 RXD O Receiver data output. Active low 3 6V CC I Supply voltage 4 7 TXD I Transmitter data input. Active high 5
8 LED A I LED anode 6
– Shield – EMI shield 7 Notes: 1. Complete shutdown TXD, RXD, and PIN diode. 2. Connect to system ground. 3. Output is active low pulse response when light pulse is seen. 4. Regulated, 2.7 to 3.6 volt. 5. Logic high turns on the LED. If held high longer than ∼50 µs, the LED is turned off automatically. TXD must be driven either high or low. DO NOT leave the pin floating. 6. Tied through external resistor, R1, to regulate V CC from 2.7 to 3.6 volt. 7. Connect to system ground via a low inductance trace. For best performance, do not connect to GND directly at the part. Recommended Application Circuit Components Component Recommended Value Note R1 30 Ω, ± 1%, 0.125 Watt 8 R1 5.6 Ω, ± 1%, 0.125 Watt 9 C1 6.8 µF, ± 20%, Tantalum 10 C2 100 nF, ± 20%, X7R Ceramic Notes: 8. To obtain I LED of 50 mA for V LED of 3 V. 9. To obtain I LED of 250 mA for V LED of 3 V. 10. C1 must be placed within 0.7 cm of the HSDL-3203 to obtain optimum noise immunity. Marking Information The unit is marked with the letters "A" and the datacode "YWW" on the shield for front options where Y is the last digit of the year, and WW is the workweek. Transceiver I/O Truth Table Inputs Outputs TXD Light Input to Receiver SD LED RXD Note High Don't Care Low On Not Valid Low High Low Off Low 11, 12 Low Low Low Off High Don't Care Don't Care High Off High Notes: 11. In-band IrDA signals and data rates ≤ 115.2 kbit/s. 12. RXD logic low is a pulsed response. The condition is maintained for a duration independent of pattern and strength of the in cident intensity. Caution: The BiCMOS inherent to the design of this component increases the component's susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Note Operating Temperature T A –25 85 ˚C Supply Voltage V CC 2.7 3.6 V Logic High Voltage TXD, SD V IH 2/3 VCC VCC V Logic Low Voltage TXD, SD V IL 0 1/3 V CC V Logic High Receiver Input Irradiance EI H 0.0081 500 mW/cm2 For in-band signals 13 Logic Low Receiver Input Irradiance EI L 0.3 µW/cm2 For in-band signals 13 LED Current Pulse Amplitude I LEDA 50 250 mA Guaranteed at 25˚C Receiver Signal Rate 9.6 115.2 kbit/s Note: 13. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. Absolute Maximum Ratings For implementation where case to ambient thermal resistance is ≤ 50˚C/W. Parameter Symbol Min. Max. Units Conditions Storage Temperature T S –40 100 ˚C Operating Temperature T A –25 85 ˚C DC LED Current I LED (DC) 20 mA Peak LED Current I LED (PK) 250 mA ≤ 90 µs Pulse Width ≤ 25% Duty Cycle LED Anode Voltage V LEDA –0.5 7 V Supply Voltage V CC 07V Input Voltage TXD, SD V I 0V CC + 0.5 V Output Voltage RXD V O –0.5 V CC + 0.5 V
Electrical and Optical Specifications Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25˚C and 3.0 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Conditions Note Receiver RXD Output Voltage Logic Low V OL 00 . 4 V I OL = 200 µA, for in-band EI 14 Logic High V OH VCC VCC VI OH = 200 µA, for in-band –0.2 EI ≤ 0.3 µW/cm2 Viewing Angle 2 φ1/2 30 ˚ Logic High Receiver Input EI H 0.0081 500 mW/cm2 For in-band signals ≤ 115.2 kbit/s 13 Irradiance Logic Low Receiver Input EI L 0.3 µW/cm2 For in-band signals 13 Irradiance Peak Sensitivity Wavelength λp 880 nm RXD Pulse Width tpw 1.5 2.5 4.0 µs1 4 RXD Rise and Fall Times t r, tf 25 100 ns tpw(EI) = 1.6 µs, CL = 10 pF Receiver Latency Time t L 25 50 µs1 4 Receiver Wake Up Time t W 50 100 µs1 5 Transmitter Radiant Intensity EI H 4 8 28.8 mW/sr I LEDA = 50 mA, TA = 25˚C, θ1/2 ≤ 15˚ 22.5 mW/sr I LEDA = 250 mA, TA = 25˚C, θ1/2 ≤ 15˚ Peak Wavelength λp 875 nm Spectral Line Half Width ∆λ1/2 35 nm Viewing Angle 2 θ1/2 30 60 ˚ Optical Pulse Width tpw 1.5 1.6 2 µs tpw(TXD) = 1.6 µs Optical Rise and Fall Times tr (EI) 600 ns tpw(TXD) = 1.6 µs tf (EI) Maximum Optical Pulse Width tpw 20 50 µs TXD pin stuck high (max) LED Anode ON State Voltage V ON 1.5 V I LEDA = 50 mA, (LEDA) V IH (TXD) = 2.7 V LED Anode OFF State Leakage I LK 0.01 1.0 µAV LEDA = VCC = 3.6 V, (LEDA) V I (TXD) ≤ 1/3 VCC Transceiver TXD and SD Input Logic Low I L –1 –0.01 1 µA0 ≤ VI ≤ 1/3 VCC Logic High I H 0.01 1 µAV I ≥ 2/3 VCC Supply Current Shutdown I CCI 10 200 nA V CC = 3.6 V, VSD ≥ VCC –0.5 Idle I CC2 2.5 4 mA V CC = 3.6 V, VI(TXD) ≤ 1/3 VCC, EI = 0 Active I CC3 2.6 5 mA V CC = 3.6 V, VI(TXD)≤ 1/3 VCC 16 Receiver Notes: 14. For in-band signals ≤ 115.2 kbit/s where 8.1 µW/cm 2 ≤ EI ≤ 500 mW/cm2. 15. Wake up time is measured from SD pin HIGH to LOW transition or V CC power ON to valid RXD output. 16. Typical value is at EI = 10 mW/cm 2, maximum value is at EI = 500 mW/cm 2. Currents
Figure 10. Package outline dimensions.
51 CX RXD
62 SD V CC
73 AGND TXD
84 GND LEDA
Figure 11. Tape and reel dimensions.
All HSDL-3203 options are shipped in moisture-proof packaging. Once opened, moisture absorption begins. Figure 12. Baking conditions chart. Baking should only be done once.
Figure 13. Reflow graph. printed circuit board connections. HSDL-3203 castellation I/O pins.
Figure 14. Stencil and PCBA.
1.1 Recommended Land Pattern
1.0 Solder Pad, Mask and Metal Solder Stencil Aperture
Figure 15. Land pattern.
Figure 17. Adjacent land keep-out and solder mask areas. Figure 16. Solder stencil aperture.
1.2 Recommended Metal Solder
1.3 Adjacent Land Keepout and
electrical and EMI performance.
- The ground plane should be
- The shield trace is a wide, low
- The AGND pin is connected to
- C1 and C3 are optional supply
Figure 18. PCB layout suggestions.
Appendix C: General Application Guide for the HSDL-3203 Infrared IrDA® Compliant 115.2 kb/s Transceiver The HSDL-3203, a wide voltage operating range infrared transceiver, is a low-cost and small form factor device that is designed to address the mobile computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones. It is fully compliant to IrDA 1.4 low power specification from 9.6 kb/s to 115.2 kb/s, and supports HP-SIR and TV Remote modes. The design of the HSDL-3203 also includes the following unique features:
- Low passive component count.
- Shutdown mode for low power consumption requirement. Interface to Recommended I/O Chips The HSDL-3203’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb/s up to 115.2 kb/s is available at the RXD pin. The block diagram below shows ow the IR port fits into a mobile phone and PDA platform. Recommended V CC Intensity Minimum peak R1 pulse LED current 30 Ω 3 V 8 mW/sr 50 mA 5.6 Ω 3 V 34 mW/sr 250 mA Selection of Resistor R1 Resistor R1 should be selected to provide the appropriate peak pulse LED current over different ranges of V CC as shown in the table below. TRANSCEIVER MOD/ DE-MODULATOR SPEAKER RF INTERFACE AUDIO INTERFACE USER INTERFACE MICROCONTROLLER DSP CORE ASIC CONTROLLER IR MICROPHONE MOBILE PHONE PLATFORM HSDL-3203
Figure 19. IR layout in mobile phone platform.
Figure 20. IR layout in PDA platform.
Appendix D: Optical port dimensions for HSDL-3203: To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 30˚ and the maximum size corre- sponds to a cone angle of 60˚. In the figure below, X is the width of the window, Y is the height of the window, and Z is the distance from the HSDL-3203 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens, K, is 5.1 mm. The equations for computing the window dimen- sions are as follows: X = K + 2*(Z + D)*tanA Y = 2*(Z + D)*tanA The above equations assume that the thickness of the window is negligible compared to the dis- tance of the module from the back of the window (Z). If they are comparable, Z' replaces Z in the above equation. Z' is defined as: Z' = Z + t/n where ‘t’ is the thickness of the window and ‘n’ is the refractive index of the window material. The depth of the LED image in- side the HSDL-3203, D, is 3.17 mm. ‘A’ is the required half angle for viewing. For IrDA com- pliance, the minimum is 15˚ and the maximum is 30˚. Assuming the thickness of the window to be negligible, the equations result in the following tables and graphs. /;/;/;/;/; D /;/;/;/;/;/;/;/; /;/;/;/;/;/;/;/; /;/;/;/;/;/; /;/;/;/;/;/; /;/; Z K A IR TRANSPARENT WINDOW OPAQUE MATERIAL OPAQUE MATERIAL IR TRANSPARENT WINDOW /;/; X Z
17 APERTURE WIDTH (X) – mm
MODULE DEPTH (Z) – mm 135 8 APERTURE WIDTH (X) vs MODULE DEPTH X MAX. X MIN. APERTURE HEIGHT (Y) – mm MODULE DEPTH (Z) – mm 135 8 APERTURE HEIGHT (Y) vs MODULE DEPTH 2 Y MAX. Y MIN. Module Depth Aperture Width (x, mm) Aperture Height (y, mm) (z) mm Max. Min. Max. Min. 0 8.76 6.80 3.66 1.70 1 9.92 7.33 4.82 2.33 2 11.07 7.87 5.97 2.77 3 12.22 8.41 7.12 3.31 4 13.38 8.94 8.28 3.84 5 14.53 9.48 9.43 4.38 6 15.69 10.01 10.59 4.91 7 16.84 10.55 11.74 5.45 8 18.00 11.09 12.90 5.99 9 19.15 11.62 14.05 6.52
(Second Choice) Flat Window (First Choice) Curved Front, Flat Back (Do Not Use) Shape of the Window From an optics standpoint, the window should be flat. This en- sures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical or industrial design reasons, place the same curve on the back side of the window that has an identical radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will significantly reduce the effects. The amount of change in the radiation pattern is dependent upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the win- dow is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the trans- ceiver to the back surface of the window is 3 mm. Window Material Almost any plastic material will work as a window material. Poly- carbonate is recommended. The surface finish of the plastic should be smooth, without any texture. An IR filter dye may be used in the window to make it look black to the eye, but the total optical loss of the window should be 10% or less for best optical performance. Light loss should be measured at 875 nm. The recommended plastic materials for use as a cosmetic window are available from General Electric Plastics. Recommended Plastic Materials: Material Light Refractive Number Transmission Haze Index Lexan 141L 88% 1% 1.586 Lexan 920A 85% 1% 1.586 Lexan 940A 85% 1% 1.586 Note: 920A and 940A are more flame retardant than 141L. Recommended Dye: Violet #21051 (IR transmissant above 625 nm).
www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna- tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2005 Agilent Technologies, Inc. Obsoletes 5988-8581EN April 12, 2005 5989-2869EN