HSDL-1000 HP | Alldatasheet

Document overview

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Technical content

Features

  • Low Cost Infrared Data Link
  • Guaranteed to Meet IrDA Physical Layer Specifications 1 cm to 1 Meter Operating Distance 30° Viewing Angle 2.4 KBd to 115.2 KBd Data Rate
  • Daylight Cancellation
  • Easily Implemented Direct Connection to Various I/O Chips
  • Small Form Factor
  • Several Lead and Shipping Configurations Available
  • Excellent EMI Immunity (> 10 V/m)

Applications

  • Data Comm: Serial Data Transfer Between: Notebook Computers Subnotebooks operate from 0 to 1 meter at a data rate of 115.2 Kbd per second at a 30° viewing angle. The HSDL-1000 contains a high speed, high efficiency TS AlGaAs 875 nm LED, a PIN Silicon photo- diode and an integrated circuit. The IC contains an LED driver, amplifiers and a quantizer. The module is designed to inter- face directly with selected I/O chips that incorporate logic which performs pulse width modulation/ demodulation. Schematic VPIN CX2 GND VCC GND RXD TXD R I CX1 RXD TXD CX2CX3CX4 COMPARATOR PHOTODIODE VPIN LED LED C LED A R LED PIN ONE PIN ONE BUTTRESS LEAD* * SIDE BUTTRESS LEADS ARE FOR MECHANICAL STABILITY AND SHOULD NOT BE CONNECTED TO ANY ELECTRICAL POTENTIAL. PIN ONE INDICATOR HP 1000 YYWW Desktop PCs PDAs Printers Other Peripheral Devices
  • Telecom: Modem, Fax, Pager, Phone
  • Industrial: Data Collection Devices
  • Medical: Patient and Pharmaceutical Data Collection Description: The HSDL-1000 serial infrared module performs low cost, low power, point-to-point, through the air data transfer in a serial, half- duplex mode. The module has been designed to the IrDA (Infrared Data Associa- tion) Physical Layer Specifica- tions. The module is designed to

Option X01* Option X02* Note: The -B- datum is formed by the two highest points of the combined surface formed by this surface and the corresponding surface of the same lead on the opposite side of the package. *X position indicates packaging. 0 = tape and reel, 1 = JEDEC standard tray. 12.95 (0.51) 13.45 (0.53) 0.43 (0.017)MAX. 8.54 ± 0.15 (0.336 ± 0.01)MAX. 0.51 ± 0.08 -C- -B- 1.27 ± 0.15 (0.050 ± 0.01)(7x) 6.9 ± 0.25 (0.27 ± 0.01) 16.61 ± 0.15 (0.654 ± 0.01) 6.2 ± 0.25 (0.24 ± 0.01) -A- 5.0° (10x) DIMENSIONS IN MILLIMETERS (INCHES). 6.4 ± 0.25 (0.25 ± 0.01) 3.4 ± 0.25 (0.14 ± 0.01) 1 2345678 5.93 ± 0.25 (0.23 ± 0.01) 0.13 ± 0.08 (0.005 ± 0.003) 0.6 ± 0.25 (0.02 ± 0.01)(10x) 0.9 ± 0.25 (0.04 ± 0.01) 3.4 ± 0.25 (0.14 ± 0.01) 1.9 ± 0.25 (0.08 ± 0.01) 13.2 ± 0.25 (0.52 ± 0.01) 0.43 (0.017)MAX. 8.05 ± 0.15 (0.317 ± 0.01)MAX. 1.27 ± 0.15 (0.050 ± 0.01)(7x) -C- 0.51 ± 0.08 8.88 ± 0.15 (0.349 ± 0.01) 15.13 ± 0.15 (0.596 ± 0.01) -A- 5.0° (8x) DIMENSIONS IN MILLIMETERS (INCHES). -B- 15.39 ± 0.15 (0.606 ± 0.01) 6.9 ± 0.25 (0.27 ± 0.01) 1 2345678 6.4 ± 0.25 (0.25 ± 0.01) 3.4 ± 0.25 (0.14 ± 0.01) 5.93 ± 0.25 (0.23 ± 0.01) 3.12 ± 0.15 (0.123 ± 0.01) 6.2 ± 0.25 (0.24 ± 0.01) 3.80 ± 0.15 (0.150 ± 0.01) 0.50 ± 0.13 (0.020 ± 0.005) 3.36 ± 0.15 (0.132 ± 0.01) 0.60 ± 0.25 (0.02 ± 0.01) 4.56 ± 0.15 (0.180 ± 0.01) 1.28 ± 0.15 (0.050 ± 0.01) COPLANARITY ± 0.05 mm (0.002 INCHES). 3.4 ± 0.25 (0.14 ± 0.01) 3.28 ± 0.15 (0.129 ± 0.01)

Package Dimensions (continued) Option X03* 13.2 ± 0.25 (0.52 ± 0.01) -C- 7.87 ± 0.15 (0.310 ± 0.01) 7.62 ± 0.15 (0.300 ± 0.01) DIMENSIONS IN MILLIMETERS (INCHES). 11.68 ± 0.15 (0.460 ± 0.01) 6.9 ± 0.25 (0.27 ± 0.01) 14.73 ± 0.15 (0.580 ± 0.01) 2.79 ± 0.15 (0.110 ± 0.01) 6.2 ± 0.25 (0.24 ± 0.01) 5.08 ± 0.15 (0.200 ± 0.01) 3.81 ± 0.15 (0.150 ± 0.01) 1.27 ± 0.15 (0.050 ± 0.01) 6.75 ± 0.15 (0.266 ± 0.01) 1.39 ± 0.15 (0.05 ± 0.01) A BCS.30∅ -A- -B- A BCS.30∅ A BCS.30∅ 0.76 ± 0.15 (0.020 ± 0.01) 6.4 ± 0.25 (0.25 ± 0.01) 3.4 ± 0.25 (0.14 ± 0.01) 4.95 ± 0.15 (0.195 ± 0.01) 3.43 ± 0.15 (0.135 ± 0.01) 7.11 ± 0.15 (0.280 ± 0.01) 0.43 (0.02) MAX. 11.0 ± 0.13 (0.43 ± 0.01) 2.54 ± 0.15 (0.100 ± 0.01) COPLANARITY OF SURFACE MOUNT LEADS TO BE WITHIN 0.3 mm. 5.9 ± 0.25 (0.23 ± 0.01) 0.6 ± 0.25 (0.02 ± 0.01) Note: The -B- datum is formed by the two highest points of the combined surface formed by this surface and the corresponding surface of the same lead on the opposite side of the package. *X position indicates packaging. 0 = tape and reel, 1 = JEDEC standard tray. 13.21 ± 0.25 (0.52 ± 0.01) 8.75 ± 0.15 (0.345 ± 0.01)MAX. 1.27 ± 0.15 (0.050 ± 0.01)(7x) -C- 0.51 ± 0.08 15.89 ± 0.15 (0.626 ± 0.01) 5.00° DIMENSIONS IN MILLIMETERS (INCHES). 6.86 ± 0.25 (0.27 ± 0.01) 6.79 ± 0.25 (0.27 ± 0.01) 6.22 ± 0.25 (0.24 ± 0.01) 0.90 ± 0.25 (0.04 ± 0.01) APPROX. CG 0.61 ± 0.25 (0.02 ± 0.01) -B- 5.0° ± 3.5° 1 2345678 6.35 ± 0.25 (0.25 ± 0.010) 3.43 ± 0.25 (0.14 ± 0.010) 3.84 (0.151) 3.43 ± 0.25 (0.14 ± 0.010) 0.76 ± 0.08 5.93 ± 0.25 (0.23 ± 0.01) 4.12 ± 0.15 (0.162 ± 0.006) COPLANARITY ± 0.076 mm (0.003 INCHES). 0.43 (0.02) MAX. Option X04*

TXD EI [1] LED LEDA RXD VIH X ON Low Low [2] VIL EIH OFF High Low [2] VIL EIL OFF High High X = Don’t care. Notes: 1. EI – received in band light intensity present at detector surface. 2. Logic Low is a pulsed response. A receiver output low state VOL (RXD) is not indefinitely maintained, but is instead a pulsed response. The output low state is maintained for a duration dependent on the incident bit pattern and the incident intensity (EI). Pinout Pin Description Symbol

1 Daylight Cancellation Capacitor CX1

2 PIN Bypass Capacitor CX2

3 Supply Voltage V CC

4 Receiver Data Output RXD

5 Ground Gnd

6 Transmitter Data Input TXD

7 LED Cathode LEDC

8 LED Anode LEDA

Parameter Symbol Min. Max. Units Conditions Fig. Storage Temperature T S -20 85 C Operating Temperature T A 07 0 C Lead Solder Temperature 260 C For 10 s (1.6 mm Reflow below seating plane) Profile Average LED Current I LED (DC) 100 mA Repetitive Pulsed LED Current I LED (PK) 500 mA ≤ 90 µs Pulse Width, ≤ 20% Duty Cycle Peak LED Current I LED (RP) 1.0 A ≤ 2 µs Pulse Width, ≤ 10% Duty Cycle LED Anode Voltage V LEDA -0.5 7.0 V LED Cathode Voltage V LEDC -0.5 V LEDA V Supply Voltage V CC 0 7.0 V Transmitter Data Input Voltage V TXD -0.5 5.5 V Receiver Data Output Voltage V RXD -0.5 V CC + 0.5 V

t2 = 11.5 ± .5 MINS. (SOLDER JOINT) TIME (t) TEMPERATURE – °C (T) 250 200 150 100 300 2 4 6 8 10 12 14 t1 = 8 ± 1 MINS. (SOLDER JOINT) ANY PART OF COMPONENT BODY 3.5 ± .5 MINS. (SOLDER JOINT) T > 120 °C FOR t GREATER THAN 2.5 MINS. (SOLDER JOINT) dT/dt < 3 °C/SEC. 185 °C Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Operating Temperature T A 0° 70° C Supply Voltage V CC 4.5 5.5 V Logic High Transmitter Input Voltage V IH (TXD) 2.5 5.5 V Logic Low Transmitter Input Voltage V IL (TXD) 0.0 0.3 V Logic High Receiver Input Irradiance EI H 0.0036 500 mW/cm 2 For in-band signals* (870 nm) Logic Low Receiver Input Irradiance EI L 0.3 µW/cm2 For in-band signals* LED (Logic High) Current Pulse I LEDA 250 mA For one metre links with Amplitude daylight filters Receiver Set-up Time 10 ms For full sensitivity after transmitting Signal Rate 2.4 116 Kp/s Ambient Light See IrDA Serial Infrared Physical Layer Link Speci- fication, Appendix A for ambient levels. See Rx TH+ section at the end of this data sheet also. *Note: An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, the pulse repetition rate, PRR, is defined as 2.4 Kp/s ≤ PRR ≤ 115.2 Kp/s and the pulse width, PW, is defined as 1.6 s ≤ PW ≤ (3/16)/PRR.

Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worse case values for the parameters under test. Unspecified test condition can be anywhere in their recommended operating range. All typicals are at 25 °C and 5V unless otherwise noted. Parameter Symbol Min. Typ. Max. Unit Conditions Fig. Receiver Data Logic Low [2] VOL (RXD)[2,3] 0.4 V I O = 0.3 mA Output Voltage For In-Band EI ≥ 3.6 µW/cm2; θ ≤ 15° Logic High V OH (RXD) V CC -0.5 V I O = -20 µA, For In-Band EI ≤ 0.3 µW/cm Effective 0.2 cm 2 Detector Area Transmitter Logic Low IE L 0.3 µW/SR V I ≤ 0.3 V Logic High IE H 44 250 mW/SR I LEDA = 250 mA, 4, 6 Intensity V I = 2.5 V, θ ≤ 30° 40 mW/SR I LEDA = 250 mA, Peak λp 875 nm 6 Wavelength Spectral Line Δλ 1/2 35 nm 6 Half Width Transmitter Viewing Angle θ 30 60 ° 7 Receiver φ 30 ° Transmitter Logic Low I IL(TXD) -1.0 1.0 µA Gnd ≤ VI ≤ 0.3 V Logic High I IH(TXD) 4.5 mA V I = 2.5 V 1 LED Anode On V ON (LEDA) 2.50 V I LEDA = 250 mA, 1, 3 State Voltage T j = 25°C LED Anode Off I LK (LEDA) 100 µAV LEDA = VCC = 5.5 V , State Leakage V I = 0.3V Supply Current ICC1 1.1 mA V CC = 5.5, 11 TXD High V I (TXD) = VIH, ILED = 250 mA, EI = 0 Supply Current ICC2 13 mA V CC = 5.5, 1 RXD Low[2] VI (TXD) = VIL, EI = 500 mW/cm2 Receiver Peak λp 880 nm 9 Sensitivity Wavelength Radient Intensity Data Input Current Notes: 1. EI – received in band light intensity present at detector surface. 2. Pulsed Response – Logic Low is a pulsed response. A receiver output low state V OL (RXD) is not indefinitely maintained but is instead a pulsed response. The output low state is maintained for a duration dependent on the incident bit pattern and incident intensity (EI). 3. The EI ≥ 3.6 µW/cm2 condition guarantees the IrDA minimum receiver sensitivity of 4.0 µW/cm2 while allowing for 10% light loss through a cosmetic window placed in front of the HSDL-1000. (See the Rx TH+ section at the end of this data sheet for information on receiver sensitivity over temperature, and in the presence of ambient light.)

Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worst case values for the parameters under test. Unspecified test conditions can be anywhere in their recommended operating range. All typicals are at 25 °C and 5V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Conditions Fig. Transmitter Turn On Time 0.1 µsI LED = 250 mA, 1.6 µs PW 13, 14 Transmitter Turn Off Time 0.4 1.0 µs Transmitter Rise Time 0.6 µs Transmitter Fall Time 0.6 µs Receiver Turn On Time 0.4 µs EI = 3.6 µW/cm2, 1.6 µs PW 15, 16 Receiver Turn Off Time 5.4 µs EI = 500 mW/cm 2, 1.6 µs PW Receiver Rise Time 1.0 µs Receiver Fall Time 0.02 µs EI = 3.6 µW/cm2, 1.6 µs PW Receiver Recovery Time 10 ms Application Circuit Component Recommended Value RI 300 Ohms ± 5% RLED 8.0 Ohms maximum CX1 0.22 µF ± 10% CX2 0.4 µF minimum CX3 0.10 µF ± 22%. Low inductance is critical CX4 4.7 µF minimum. Larger value is recommended for noisy supplies or environments.

Test Name Reference Test Conditions Tested Failed Solder Heat (IR Profile) See absolute profile 60 0 Solder Heat Resistance 3 times thru IR Profile + 20 Temp. Cycles 60 0 Solder Rework Cycle Solder iron tip temp. 370 °C/700°F1 7 0 Time per lead 1 second # of rework cycles = 4 Temperature Cycle 1010 -40 °C to +100°C, Dwell = 15 Minutes Transfer = 5 Minutes

20 Cycles 120 0

100 Cycles 120 0

Power Temp. Cycle -40 °C/+100°C, Dwell = 15 minutes, 60 0 Transfer = 5 Minutes, VCC = 5 Vdc, If = 100 mAdc, LED On/Off = 1 Second Total Cycles = 35 Mechanical Shock 2002 2 Blows each X1, X2, Y1, Y2, Z1, Z2 10 0 Condition B 1500 G’s, 0.5 msec Pulse Vibration Variable 2007 (4) 4 Minute Cycles, X, Y, Z 10 0 Frequency Condition A at 50 G’s Min., 20 to 2,000 Hz Resistance to Solvents 2015 3 one minute immersion 20 0 Brush after solvent High Temp. Operating T A= 70°C, If = 100 mAdc, VCC = 5 Vdc, 60 0 Life Time = 500 hours Low Temp. Opearting Life T A = 0°C, If = 100 mAdc, VCC = 5 Vdc 60 0 Time = 500 hours Wet Operating Life T A = 35°C, R.H., = 85% If = 100 mAdc 60 0 VCC = 5 VCC, Time = 500 hours ESD - Human Body Model 3015 RI = 1500 Ohms, C = 100 µF1 0 0 Level = 4000 V ESD - Machine Model EIAJ Rload = 0 Ohms, C = 200 µF1 0 0 Level = 300 V HSDL-1000 Reliability Test Results Rx TH+ (Receiver On- Threshold) The maximum receiver on- threshold is equivalent to the minimum receiver sensitivity. Both are terms for the amount of light signal which must be present at the HSDL-1000 detector in order to trigger a low pulse on the receiver output (RXD). The IrDA Physical Layer Specification requires a minimum receiver sensitivity of 4.0 µW/cm 2, at a Bit Error Rate of 10-9, and in the presence of the 10 klux of sunlight, 0-1000 lux of fluorescent light, or 0-1000 lux of incandes- cent light. The fluorescent and incandescent specifications require minimum receiver sensitivity with 1000 lux incident onto the horizontal surface of the IR link. The resulting amount of fluorescent or incandescent light actually reaching the detector surface may vary between 0 and 500 lux depending upon the design of the housing around the HSDL-1000 module. The HSDL-1000 V OL(RXD) specification guarantees a maximum receiver on-threshold of EI = 3.6 µW/cm 2, at a BER ≤ 10-9, and TA = 0-70°C. The EI = 3.6 µW/cm2 threshold guarantees the IrDA minimum receiver sensitivity of 4.0 µW/cm while allowing for 10% light loss through a cosmetic window placed in front of the HSDL-1000. The EI = 3.6 µW/cm 2 threshold also guarantees receiver sensitivity with 10 klux of sunlight, 0-500 lux fluorescent light, or 0-500 lux of incandescent light incident on the HSDL-1000 detector surface. Note: At the time of this publication, Light Emitting Diodes (LEDs) that are contained in this product are regulated for eye safety in Europe by the Commission for European Electrotechnical Standardization (CENELEC) EN60825-1. Please refer to Application Briefs I-008, I-009, I-015 for more information.