HSB226S

HSB226S HITACHI | Alldatasheet

Document overview

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Technical content

Features

• Low reverse current, Low capacitance.
• CMPAK Package is suitable for high density surface mounting and high speed assembly.

Ordering Information

Type No. Laser Mark Package Code HSB226S CMPAK Outline

1 Cathode 2

2 Anode 1

3 Cathode 1

(Top View)

Rev.0, Jul. 2000, page 2 of 5 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Value Unit Repetitive peak reverse voltage VRRM V Non-Repetitive peak forward surge current IFSM * 1 * 200 mA forward current IF * mA Junction temperature Tj 125 Storage temperature Tstg −55 to +125 Notes: 1. 10msec sine wave 1 pulse 2. Two device total

Electrical Characteristics

(Ta = 25°C) Item Symbol Min Typ Max Unit Test Condition Forward voltage VF1 0.33 V IF = 1 mA VF2 0.38 V IF = 5 mA Reverse current IR 0.45 µA VR = 20 V Capacitance C 2.80 pF VR = 1 V, f = 1 MHz Note: Per one device

Rev.0, Jul. 2000, page 3 of 5 Main Characteristic Fig.1 Forward current Vs. Forward voltage Fig.2 Reverse current Vs. Reverse voltage Forward voltage V (V) F Forward current I (A) F Reverse current I (A) R Reverse voltage V (V) R Fig.3 Capacitance Vs. Reverse voltage Reverse voltage V (V) R Capacitance C (pF) 10-4 Ta=25°C Ta=75°C Pulse test 1.0 0.8 10-2 10-4 10-6 0.2 0.4 0.6 10-8 10-3 10-5 10-1 100 101 Ta=25°C Ta=75°C 0.1 0.1 1.0 1.0 f=1MHz

Rev.0, Jul. 2000, page 4 of 5 Package Dimensions Hitachi Code JEDEC EIAJ Mass (reference value) CMPAK Conforms 0.006 g Unit: mm 2.0 ± 0.2 0.3 2.1 ± 0.3 (0.425) 1.25 ± 0.1 (0.425) (0.65) (0.65) 1.3 ± 0.2 0.16 0 − 0.1 0.2 0.9 ± 0.1 + 0.1 − 0.05 0.3 + 0.1 − 0.05 0.3 + 0.1 − 0.05 + 0.1 − 0.06

Rev.0, Jul. 2000, page 5 of 5 Disclaimer 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail- safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Sales Offices Hitachi, Ltd. Semiconductor & Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109 Copyright © Hitachi, Ltd., 2001. All rights reserved. Printed in Japan. Hitachi Asia Ltd. Hitachi Tower

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