HS25B60DC HUIXIN | Alldatasheet

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Parameter Symbol Value Unit Storage junction temperature range Tstg -40-150 ℃ Operating junction temperature range T j -40-125 ℃ Repetitive peak off-state voltage (Tj=25℃) V DRM 600 V Repetitive peak reverse voltage (Tj=25℃) V RRM 600 V RMS on-state current (TC≤97℃) IT(RMS) 25 A Non repetitive surge peak on-state current (full cycle , tp=20ms , Tj=25℃) ITSM 250 A Non repetitive surge peak on-state current (full cycle , tp=16.6ms , Tj=25℃) 275 I2t value for fusing (tp=10ms , Tj=25℃) I 2t 340 A2s Critical rate of rise of on-state current (IG=2×IGT , f=100Hz , Tj=125℃) dI/dt 100 A/μs Peak gate current (tp=20μs , Tj=125℃) I GM 4 A Average gate power dissipation (Tj=125℃) P G(AV) 0.5 W Peak gate power PGM 10 W Peak pulse voltage (Tj=25℃; non-repetitive,off-state;FIG.8) Vpp 2.5 k V Symbol Value Unit IT(RMS) 25 A VDRM /VRRM 600 V IGTⅠ/Ⅱ/Ⅲ 50/50/50 mA HS25B60DC 25A TRIAC Rev.01 DESCRIPTION: The HS25B60DC triac is suitable for general purpose AC switching. It can be used as an ON/OFF function in applications such as heating regulation, induction motor starting circuits, for phase control operation in light dimmers, motor speed controllers. HS25B60DC snubberless triac is especially recommended for use on inductive loads. Package TO-263 is RoHS compliant. 3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832Rev. 1.0 Page 1of 5

ELECTRICAL CHARACTERISTICS (Tj=25℃ unless otherwise specified) Symbol Test Condition Quadrant Value Unit IGT VD =12V RL =33Ω Ⅰ-Ⅱ-Ⅲ MAX. 50 mA VGT Ⅰ-Ⅱ-Ⅲ MAX. 1 V VGD VD =VDRM Tj =125℃ RL =3.3KΩ Ⅰ-Ⅱ-Ⅲ MIN. 0.2 V IL IG =1.2IGT Ⅰ-Ⅲ MAX. mA Ⅱ 100 IH IT =500mA MAX. 75 mA dV/dt V D=400V Gate Open Tj =125℃ MIN. 2500 V/μs (dI/dt)c (dV/dt)c=20V/μs T j=125℃ MIN. 25 A/ms ton IG=80mA IA=400mA IR=40mA Tj=25℃ TYP. μs toff 70 STATIC CHARACTERISTICS Symbol Parameter Value(MAX.) Unit VTM I TM =35A tp=380μs T j=25℃ 1.5 V VTO Threshold voltage T j=125℃ 0.75 V RD Dynamic resistance T j=125℃ 18 mΩ IDRM VD =VDRM VR =VRRM Tj=25℃ 5 μ A IRRM Tj=125℃ 1.5 m A THERMAL RESISTANCES Symbol Parameter Value Unit Rth(j-c) junction to case (AC) 0.8 ℃/W Rth(j-a) junction to ambient ( AC, in free air, S=2cm2) 45 ℃/W 3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832Rev. 1.0 Page 2of 5

FIG.1 Maximum power dissipation versus RMS on-state current FIG.2: RMS on-state current versus case temperature 0 5 10 15 20 25 30 P(W) IT(RMS)(A) 97℃ 0 25 50 75 100 125 IT(RMS)(A) TC(℃) FIG.3: RMS on-state current versus ambient temperature (printed circuit board FR4,copper thickness:35μm)(full cycle) FIG.4: Surge peak on-state current versus number of cycles 0.5 1.5 2.5 0 2 55 07 5 1 0 0 1 2 5 IT(RMS)(A) Ta(℃) 100 150 200 250 300 ITSM(A) Number of cycles Tc=25℃,tp=20ms,one cycle,sine FIG.5: On-state characteristics SHNCDJDFKVFKPJDFGPSDJFPAJFJOFJOJ SOPGJOPRJGJOSDHSDHHHSEHUISHFSUI H FIG.6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp<20ms, and corresponding value of I2t (dI/dt<100A/μs) 100 00 . 511 . 522 . 53 ITM(A) VTM(V) Tj=25℃typ Tj=25℃max Tj=125℃typ dI/dt ITSM I2t 100 1000 10000 0.01 0.1 1 10 tp(ms) ITSM(A), I2t(A2s) 3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832Rev. 1.0 Page 3of 5

FIG.7: Relative variations of gate trigger current, holding current and latching current versus junction temperature 0.5 1.5 2.5 ‐ 4 0 ‐ 2 002 04 06 08 0 1 0 0 1 2 0 1 4 0 Tj(℃) IGT,IH,IL(Tj)/IGT,IH,IL(Tj=25℃) IGT(I/II)&IH IGT(III) IL FIG.8：Test circuit for inductive and resistive loads to IEC-61000-4-5 standards AC INPUT Filtering Unit IEC61000-4-5 Standards Surge Generator 1.2/50μS voltage surge 8/20μS current surge RGen Load Model R L 8.2μH RG 300Ω 3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832 Rev. 1.0 Page 4of 5

Reflow Condition Pb-Free assembly (see figure at right) Pre Heat -Temperature Min (Ts(min)) +150℃ -Temperature Max(Ts(max)) +200℃ -Time (Min to Max) (ts) 60-180 secs. Average ramp up rate (Liquidus Temp (TL)to peak) 3℃/sec. Max Ts(max) to TL - Ramp-up Rate 3℃/sec. Max Reflow -Temperature(TL)(Liquidus) +217℃ -Temperature(tL) 60-150 secs. Peak Temp (Tp) +260(+0/-5)℃ Time within 5℃of actual Peak Temp (tp) 20-40secs. Ramp-down Rate 6℃/sec. Max Time 25℃ to Peak Temp (TP) 8 min. Max Do not exceed +260℃ Reflow condition Temperature TS(min) TS(max) TL TP tp tL time to peak temperatue Time (t 25℃ to pea k) Ramp-up Ramp-down Preheat Critical Zone TL to TP ts PACKAGE MECHANICAL DATA Dimensions Millimeters InchesRef. A B C D E F G H J K 9.90 14.70 9.40 2.40 10.20 15.80 9.60 0.390 0.579 0.37 0.094 0.402 0.622 0.378 1.20 1.50 0.047 0.059 0.75 0.85 0.029 0.033 4.40 4.70 0.173 0.185 2.30 2.70 0.091 0.106 0.38 0.55 0.015 0.022 L M 1.50 0 0.25 1.25 1.35 A B C E D F G M H J 0.059 0 0.010 0.049 0.053 L 0.10 0.004 K 2.70 0.106 1.00 0.039 P P 1.20 1.50 0.047 0.059 3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832Rev. 1.0 Page 5of 5