HS-26CT31RH INTERSIL | Alldatasheet

Document overview

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Technical content

Features

  • Electronically Screened to SMD #5962-95632
  • QML Qualified Per MIL-PRF-38535 Requirements
  • 1.2 Micron Radiation Hardened CMOS
  • Total Dose Up to 300kRAD(Si)
  • Latchup Free
  • EIA RS-422 Compatible Outputs (Except for IOS)
  • Operation with TTL Based on V IH = VDD/2
  • High Impedance Outputs when Disabled or Powered Down
  • Low Power Dissipation 2.75mW Standby (Max)
  • Single 5V Supply
  • Low Output Impedance 10 Ω or Less
  • Full -55°C to +125°C Military Temperature Range

Applications

  • Line Transmitter for MIL-STD-1553 Serial Data Bus
  • Line Transmitter for RS422

Ordering Information

MKT. NUMBER PART MARKING TEMP . RANGE (°C) PACKAGE PKG. DWG. # 5962F9563201QEC HS1-26CT31RH-8 Q 5962F95 63201QEC -55 to +125 16 LD SBDIP D16.3 5962F9563201QXC HS9-26CT31RH-8 Q 5962F95 63201QXC -55 to +125 16 LD FLATPACK K16.A 5962F9563201VEC HS1-26CT31RH-Q Q 5962F95 63201VEC -55 to +125 16 LD SBDIP D16.3 5962F9563201VXC HS9-26CT31RH-Q Q 5962F95 63201VXC -55 to +125 16 LD FLATPACK K16.A HS1-26CT31RH/PROTO HS1-26CT31RH/PROTO HS1 - 26CT31RH/PROTO -55 to +125 16 LD SBDIP D16.3 HS9-26CT31RH/PROTO HS9-26CT31RH/PROTO HS9 - 26CT31RH/PROTO -55 to +125 16 LD FLATPACK K16.A 5962F9563201V9A HS0-26CT31RH-Q -55 to +125 Data Sheet August 25, 2008 [ /Title (HS- 26C31 RH) /Subje ct (Radia tion Harde ned Quad Differe ntial Line Driver) /Autho r () /Keyw ords (Inters il Corpo ration, semic onduc tor, Radiat ion Harde ned, RH, Rad Hard, QML, Satellit SMD, Class Data CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2000, 2008. All Rights Reserved Satellite Applications Flow™ (SAF) is a trademark of Intersil Corporation. All other trademarks mentioned are the property of their

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnishe d by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN2929.3 August 25, 2008 Pinouts HS1-26CT31RH (16 LD SBDIP) CDIP2-T16 TOP VIEW HS9-26CT31RH (16 LD FLATPACK) CDFP4-F16 TOP VIEW Logic Diagram AIN AO AO ENABLE BO BO GND BIN VDD DO DO ENABLE CO CO CIN DIN AIN AO AO ENABLE BO BO BIN GND 11 6 VDD DIN DO DO ENABLE CO CO CIN ENABLE ENABLE AIN AO BIN BO CIN CO DIN DO DO CO BO AO HS-26CT31RH

3 FN2929.3 August 25, 2008 Die Characteristics DIE DIMENSIONS: 96.5 milx195 milsx21 mils (2450x4950) INTERFACE MATERIALS: Glassivation: Type: PSG (Phosphorus Silicon Glass) Thickness: 10k Å ± 1kÅ Metallization: M1: Mo/TiW Thickness: 5800Å M2: Al/Si/Cu (Top) Thickness: 10k Å ±1kÅ Substrate: AVLSI1RA Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up): V DD ADDITIONAL INFORMATION: Worst Case Current Density: <2.0x105A/cm2 Bond Pad Size: 110µmx100µm Metallization Mask Layout HS26CT31RH (14) DO (13) DO (12) ENABLE (11) CO (10) CO AO (2) AO (3) ENABLE (4) BO (5) BO (6) BIN (7) GND (8) CIN (9) GND (8) (1) AIN (16) VDD (15) DIN (16) VDD HS-26CT31RH