HS-26CLV32RH INTERSIL | Alldatasheet

Document overview

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Technical content

Features

  • Electrically Screened to SMD # 5962-95689
  • QML Qualified per MIL-PRF-38535 Requirements
  • 1.2 Micron Radiation Hardened CMOS - Single Event Latch-up Immune
  • Input Fail Safe Circuitry
  • High Impedance Inputs when Disabled or Powered-down
  • Full -55°C to +125°C Military Temperature Range
  • Pb-Free (RoHS Compliant)

Applications

  • Line Receiver for MIL-STD-1553 Serial Data Bus Logic Diagram ENABLE ENABLE AOUTBOUTCOUT DIN DOUT DIN CIN CIN BIN BIN AIN AIN +-+-+-+-

Ordering Information

(Note) INTERNAL MKT. NO. PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # 5962F9568902QEC HS1-26CLV32RH-8 Q 5962F95 68902QEC -55 to +125 16 Ld SBDIP D16.3 5962F9568902QXC HS9-26CLV32RH-8 Q 5962F95 68902QXC -55 to +125 16 Ld FLATPACK K16.A 5962F9568902VEC HS1-26CLV32RH-Q Q 5962F95 68902VEC -55 to +125 16 Ld SBDIP D16.3 5962F9568902VXC HS9-26CLV32RH-Q Q 5962F95 68902VXC -55 to +125 16 Ld FLATPACK K16.A HS1-26CLV32RH/PROTO HS1-26CLV32RH/PROTO HS1- 26CLV32RH /PROTO -55 to +125 16 Ld SBDIP D16.3 HS9-26CLV32RH/PROTO HS9-26CLV32RH/PROTO HS9- 26CLV32RH /PROTO -55 to +125 16 Ld FLATPACK K16.A NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Data Sheet May 28, 2009 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2000, 2008, 2009.All Rights Reserved All other trademarks mentioned are the property of their respective owners.

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnishe d by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN4907.2 May 28, 2009 Pinouts HS1-26CLV32RH (16 LD SBDIP) MIL-STD-1835: CDIP2-T16 TOP VIEW HS9-26CLV32RH (16 LD FLATPACK) MIL-STD-1835: CDFP4-F16 TOP VIEW AIN AIN AOUT ENABLE COUT CIN GND CIN VDD BIN BOUT ENABLE DOUT DIN DIN BIN AIN AIN AOUT ENABLE COUT CIN CIN GND 11 6 VDD BIN BIN BOUT ENABLE DOUT DIN DIN HS-26CLV32RH

TABLE 1. HS26CLV32RH PAD COORDINATES

15 BIN