HS008L

HS008L HUIXIN | Alldatasheet

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Parameter Symbol Value Unit Storage junction temperature range T stg -40-150 ℃ Operating junction temperature range T j -40-125 Repetitive peak off-state voltage (Tj=25℃) V DRM 800 V Repetitive peak reverse voltage (Tj=25℃) V RRM 800 V Average on-state current (TC≤63℃) I T(AV) 0.5 A RMS on-state current (TC≤63℃) I T(RMS) 0.8 A Non repetitive surge peak on-state current (tp=10ms , Tj=25℃) ITSM ANon repetitive surge peak on-state current (tp=8.3ms , Tj=25℃) 9 I2t value for fusing (tp=10ms , Tj=25℃) I2t 0.32 A2s Critical rate of rise of on-state current (IG=2×IGT , f=100Hz , Tj=125℃) dI/dt 50 A/μs Peak gate current (tp=20μs, Tj=125℃) IGM 1 A Average gate power dissipation (Tj=125℃) PG(AV) 0.1 W HS008L 0.8A Sensitive SCR Rev.01 DESCRIPTION: The HS008L SCR provides high dV/dt rate with strong resistance to electromagnetic interface. It is especially recommended for use on residual current circuit breaker, straight hair, igniter etc. Package SOT-23 is RoHS compliant. MAIN FEATURES Symbol Value Unit IT(RMS) 0.8 A VDRM /VRRM 800 V IGT ≤200 μA 3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832Rev. 1.0 Page 1of 6

(Tj=25℃; non-repetitive,off-state;FIG.8) Vpp 1 kV NOTE 1: When we parallel connect a ≤1KΩ resistor between Gate and Cathode, the Tj can reach 125℃; if without this resistor, the Tj only can reach 110℃. ELECTRICAL CHARACTERISTICS (Tj=25℃ unless otherwise specified) Symbol Test Condition Value Unit MIN. TYP. MAX. IGT VD=12V RL=33Ω - 50 200 μA VGT - 0.6 0.8 V VGD VD=VDRM Tj=125℃ 0.2 - - V IL IG=1.2 IGT - - 4 mA IH IT=0.05A - - 3 mA dV/dt VD=540V Tj=125℃ RGK=1KΩ 200 - - V/μs VD=540V Tj=125℃ RGK=220Ω 500 - - ton IG=10mA IA=20mA IR=2mA Tj=25℃ - 2 - μs toff - 50 - μs STATIC CHARACTERISTICS Symbol Parameter Value(MAX.) Unit VTM IT=1A tp=380μs Tj=25℃ 1.35 V VTO Threshold voltage Tj=125℃ 0.93 V RD Dynamic Resistance Tj=125℃ 0.34 Ω IDRM VD=VDRM VR=VRRM Tj=25℃ 2 μA IRRM Tj=125℃ 0.2 mA 3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832Rev. 1.0 Page 2of 6 THERMAL RESISTANCES Symbol Parameter Value Unit Rth(j-c) junction to case (DC) 60 ℃/W Rth(j-a) junction to ambient (DC, in free air,S=5 cm 2) 120 ℃/W

3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832Rev. 1.0 Page 3of 6 FIG.1 Maximum power dissipation versus RMS on-state current FIG.2: RMS on-state current versus case temperature 0.2 0.4 0.6 0.8 1.2 1.4 0 0.2 0.4 0.6 0.8 1 P(W) IT(RMS)(A) 63℃ 0.2 0.4 0.6 0.8 02 55 07 5 1 00 1 25 IT(RMS)(A) TC(℃) FIG.3: RMS on-state current versus ambient temperature (printed circuit board FR4,copper thickness:35μm)(full cycle) FIG.4: Surge peak on-state current versus number of cycles 0.2 0.4 0.6 0.8 1.2 02 55 07 5 1 0 0 1 2 5 IT(RMS)(A) Ta(℃) ITSM(A) Number of cycles Tc=25℃,tp=10ms,one cycle,half‐sine FIG.5: On-state characteristics XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXXXXXXXXXX FIG.6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and corresponding value of I2t (dI/dt<50A/μs) 0.1 00 . 511 . 522 . 53 ITM(A) VTM(V) Tj=25℃typ Tj=25℃max Tj=125℃typ dI/dt ITSM I2t 0.1 100 1000 0.01 0.1 1 10 ITSM(A), I2t(A2s) tp(ms)

FIG.7: Relative variations of gate trigger current, holding current and latching current versus junction temperature 0.5 1.5 2.5 -40 -20 0 20 40 60 80 100 120 140 Tj(℃) IGT,IH,IL(Tj)/IGT,IH,IL(Tj=25℃) IGT IL&IH 3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832Rev. 1.0 Page 4of 6

FIG.8：Test circuit for inductive and resistive loads to IEC-61000-4-5 standards. AC INPUT Filtering Unit IEC61000-4-5 Standards Surge Generator 1.2/50μS voltage surge 8/20μS current surge RGen Load Model R 50Ω L 66μH RG 1kΩ SOLDERING PARAMETERS Reflow Condition Pb-Free assembly (see figure at right) Pre Heat -Temperature Min (Ts(min)) +150℃ -Temperature Max (Ts(max)) +200℃ -Time (Min to Max) (ts) 60-180 secs. Average ramp up rate (Liquidus Temp (TL)to peak) 3℃/sec. Max Ts(max) to TL - Ramp-up Rate 3℃/sec. Max Reflow -Temperature(TL) (Liquidus) +217℃ -Temperature(tL) 60-150 secs. Peak Temp (Tp) +260(+0/-5)℃ Time within 5℃of actual Peak Temp (tp) 20-40secs. Ramp-down Rate 6℃/sec. Max Time 25℃ to Peak Temp (TP) 8 min. Max Do not exceed +260℃ Reflow condition Temperature TS(min) TS(max) TL TP tp tL time to peak temperatue Time (t 25℃ to pea k) Ramp-up Ramp-down Preheat Critical Zone TL to TP ts 3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832Rev. 1.0 Page 5of 6

3 of 1Page 1.0Rev. huixin@hxkj.hk+86-769-22857832 huixin@hxkj.hk+86-769-22857832Rev. 1.0 Page 6of 6 PACKAGE MECHANICAL DATA Dimensions Millimeters InchesRef. A B C D E F G H 2.65 0.30 2.95 0.50 0.104 0.115 0.075 0.012 0.116 0.020 1.17 0.046 0.15 0.006 0.25 0.55 0.010 0.063 A 2.92 B 1.90 C D 1.60 E F G H 0.022 2.82 3.02 1.80 2.00 0.35 2.80 1.07 0.05 1.50 1.27 0.25 1.70 0.40 0.110 0.111 0.119 0.071 0.079 0.014 0.059 0.067 0.042 0.050 0.002 0.010 0.016 SOT-23-3L FOOTPRINT‐SOT‐23‐3L (dimensions in mm) 0.8 1.7 4.19 0.97