HS-5104ARH RENESAS | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 7
Technical content
Features
- Electrically screened to SMD # 5962-95690
- QML qualified per MIL-PRF-38535 requirements
- Radiation acceptance testing - HS-5104AEH
- Radiation acceptance testing - HS-5104ARH
- No latch-up, dielectrically isolated device islands
- L o w n o i s e (Typ)
Applications
- High Q, active filters
- Voltage regulators
- I n t e g r a t o r s
- Signal generators
- Voltage references
- Space environment
HS-5104ARH, HS-5104AEH FN3025 Rev 6.00 Page 2 of 6 May 18, 2021
Ordering Information
NUMBER (Note 1) INTERNAL MKT. NUMBER (Note 2) RADIATION HARDNESS (Total Ionizing Dose) PACKAGE
DESCRIPTION
(RoHS Compliant) PKG. DWG. # CARRIER TYPE TEMP. RANGE 5962R9569002VXC HS9-5104AEH-Q HDR to 100krad(Si), LDR to 50krad(Si) 14 Ld Flatpack K14.A Tray -55 to +125°C 5962R9569002VCC HS1-5104AEH-Q 14 Ld SBDIP D14.3 Tube 5962R9569002V9A HS0-5104AEH-Q (Note 3) Die - - N/A HS1-5104AEH/PROTO (Note 4) N/A 14 Ld SBDIP D14.3 Tube HS0-5104AEH/SAMPLE (Notes 3, 4) Die - - HS9-5104AEH/PROTO (Note 4) 14 Ld Flatpack K14.A Tray 5962R9569001VXC HS9-5104ARH-Q No longer available or supported HDR to 100krad(Si) 14 Ld Flatpack K14.A Tray 5962R9569001VCC HS1-5104ARH-Q No longer available or supported 14 Ld SBDIP D14.3 Tube 5962R9569001V9A HS0-5104ARH-Q (Note 3) No longer available or supported Die - - NA HS1-5104ARH/PROTO (Note 4) No longer available or supported N/A 14 Ld SBDIP D14.3 Tube HS0-5104ARH/SAMPLE (Notes 3, 4) No longer available or supported Die - - HS9-5104ARH/PROTO (Note 4) No longer available or supported 14 Ld Flatpack K14.A Tray 1. Specifications for Rad Hard QML devices are controlled by the De fense Logistics Agency Land and Maritime (DLA). The SMD numbers listed must be used when ordering. 2. These Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. 3. Die product tested at T A = + 25°C. The wafer probe test includes functional and parametric testing sufficient to make the die capable of meeting the electrical performance outlined in the SMD. 4. The /PROTO and /SAMPLE are not rated or certified for Total Ionizing Dose (TID) or Single Event Effect (SEE) immunity. These parts are intended for engineering evaluation purposes only. The /PROTO parts meet the electrical limits and conditions across temperature specified in the DLA SMD and are in the same form and fit as the qualified device. The /SAMPLE parts are capable of meeting the electrical limits and conditions specified in the DLA SMD. The /SAMPLE parts do not receive 100% screening across temperature to the DLA SMD electrical limits. These part types do not come with a Certificate of Conformance because they are not DLA qualified devices.
HS-5104ARH, HS-5104AEH FN3025 Rev 6.00 Page 3 of 6 May 18, 2021 Pin Configuration HS1-5104ARH, HS1-5104AEH (14 LD SBDIP) TOP VIEW HS9-5104ARH, HS9-5104AEH (14 LD FLATPACK) TOP VIEW Irradiation Circuit NOTES: 5. +V = 15V 6. -V = -15V 7. Group E Sample Size = 4 Die Per Wafer Burn In Circuit NOTES: 9. C1 = C2 = 0.01µF/Socket (Min) or 0.1µF/Row (Min) 10. D1 = D2 = IN4002 or Equivalent/Board OUT 1 -IN1 +IN1 +IN2 -IN2 OUT 2 OUT 3 OUT 4 -IN3 +IN3 +IN4 -IN4 OUT 1 -IN1 +IN1 +IN2 -IN2 OUT 2 OUT 3 OUT 4 -IN3 +IN3 +IN4 -IN4 +15V -15V (ONE OF FOUR) 1 4 2 3C1 C2D2 +- +- +-+-
HS-5104ARH, HS-5104AEH FN3025 Rev 6.00 Page 4 of 6 May 18, 2021 Die Characteristics DIE DIMENSIONS: 95mils x 99mils x 19 mils ±1mils (2420µm x 2530µm x 483µm ±25.4µm) INTERFACE MATERIALS: Glassivation: Type: Silox (SIO2) 1:6:1 Thickness: 8kÅ ±0.8kÅ (1kÅ undopped, 6kÅ dopped, cap 1kÅ undopped) Top Metalization: Type: Al/Cu 16kÅ ±2kÅ Substrate: HFSTD: Single poly dielectrically isolated complementary bipolar. Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate potential: Insulator Special assembly instructions: None ADDITIONAL INFORMATION: Worst Case Current Density: <2.0 x 105 A/cm2 Transistor Count: 175 Metalization Mask Layout HS-5104ARH, HS-5104AEH
Revision History
+IN2 V+ +IN1 -IN1 OUT1 OUT4 -IN4-IN3 OUT3 OUT2 -IN2 +IN4V-+IN3 REVISION DATE DESCRIPTION 6.0 May 18, 2021 Updated Radiation Acceptance testing features bullets. Updated the Ordering Information table. Updated Die Characteristics for Glassivation, Top Metalization, Substrate, and Assembly Related Information. Added Revision History.
HS-5104ARH, HS-5104AEH FN3025 Rev 6.00 Page 5 of 6 May 18, 2021 Ceramic Metal Seal Flatpack Packages (Flatpack) NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternatel y, a tab (dimension k) may be used to identify pin one. 2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply. 3. This dimension allows for off-c enter lid, meniscus, and glass over- run. 4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. N is the maximum number of terminal positions. 6. Measure dimension S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materi- als shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the me- niscus) of the lead from the body. Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. -D- -C-
0.004 H A - BM DS S
-A- -B-
0.036 H A - BM DS S
e E A Q L D A SEATING AND LE2 E3 E3 BASE PLANE -H- b C M (c) (b) SECTION A-A BASE LEAD FINISH METAL PIN NO. 1 ID AREA A M K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B)
14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
A 0.045 0.115 1.14 2.92 - b 0.015 0.022 0.38 0.56 - b1 0.015 0.019 0.38 0.48 - c 0.004 0.009 0.10 0.23 - c1 0.004 0.006 0.10 0.15 - D - 0.390 - 9.91 3 E 0.235 0.260 5.97 6.60 - E 1 -0 . 2 9 0 -7 . 1 1 3 E3 0.030 - 0.76 - 7 e 0.050 BSC 1.27 BSC - k 0.008 0.015 0.20 0.38 2 L 0.270 0.370 6.86 9.40 - Q 0.026 0.045 0.66 1.14 8 S1 0.005 - 0.13 - 6 N1 4 1 4- Rev. 0 5/18/94 For the most recent package outline drawing, see K14.A.
HS-5104ARH, HS-5104AEH FN3025 Rev 6.00 Page 6 of 6 May 18, 2021 Ceramic Dual-In-Line Metal Seal Packages (SBDIP) NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be mea- sured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a par- tial lead paddle. For this configur ation dimension b3 replaces di- mension b2. 5. Dimension Q shall be measured from the seating plane to the base plane. 6. Measure dimension S1 at all four corners. 7. Measure dimension S2 from the top of the ceramic body to the near- est metallization or lead. 8. N is the maximum number of terminal positions. 9. Braze fillets shall be concave. 10. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 11. Controlling dimension: INCH. bbb C A - BS c Q L A SEATING BASE D PLANE PLANE S S -D--A- -C- eA -B- aaa CA - BM DS Sccc CA - BM DS S D E b A e M (c) (b) SECTION A-A BASE LEAD FINISH METAL eA/2 M A D14.3 MIL-STD-1835 CDIP2-T14 (D-1, CONFIGURATION C)
14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
A - 0.200 - 5.08 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 E 0.220 0.310 5.59 7.87 - e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC - eA/2 0.150 BSC 3.81 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 5 S1 0.005 - 0.13 - 6 S2 0.005 - 0.13 - 7 90o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2 N1 4 1 4 8 Rev. 0 4/94 For the most recent package outline drawing, see D14.3.
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