HS-303ARH RENESAS | Alldatasheet

Document overview

  • Manufacturer or author: Renesas Electronics Corporation
  • PDF pages: 7

Technical content

Features

  • QML, per MIL-PRF-38535
  • Radiation performance ○ Total dose: 3x105rad(Si) ○ SEE: For LET = 60MeV•cm2/mg at 60° incident angle, <150pC charge transferred to the output of an off switch (based on SOI design calculations)
  • No latch-up, dielectrically isolated device islands
  • Pinout and functionally compatible with Renesas HS-303RH and HI-303 series analog switches
  • Analog signal range equal to the supply voltage range
  • Low leakage: 100nA (max, post-rad)
  • L o w r ON: 70Ω (max, post-rad)
  • Low standby supply current: +150µA/-100µA (max, post-rad) Pin Configurations HS1-303ARH, HS-303BRH (SBDIP), CDIP2-T14 Top View HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH (FLATPACK) CDFP3-F14 Top View Truth Table Logic SW1 and SW2 SW3 and SW4 0O F F O N 1O N O F F N PIN D NC GND IN1 IN2 S2S1 NC GND IN1 IN2

HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH 1. Overview FN6411 Rev.4.00 Page 2 of 7 Jul.18.19 1. Overview

1.1 Ordering Information

(Note 2) Part Number (Note 1) Temp. Range (°C) Package (RoHS Compliant) Pkg. Dwg. # 5962F9581304QCC HS1-303ARH-8 -55 to +125 14 LD SBDIP D14.3 5962F9581304QXC HS9-303ARH-8 -55 to +125 14 LD Flatpack K14.A 5962F9581304V9A HS0-303ARH-Q -55 to +125 Die 5962F9581306V9A HS0-303AEH-Q -55 to +125 Die 5962F9581304VCC HS1-303ARH-Q -55 to +125 14 LD SBDIP D14.3 5962F9581306VCC HS1-303AEH-Q -55 to +125 14 LD SBDIP D14.3 5962F9581304VXC HS9-303ARH-Q -55 to +125 14 LD Flatpack K14.A N/A HS0-303ARH/SAMPLE -55 to +125 Die N/A HS1-303ARH/PROTO -55 to +125 14 LD SBDIP D14.3 N/A HS9-303ARH/PROTO -55 to +125 14 LD Flatpack K14.A 5962F9581306VXC HS9-303AEH-Q -55 to +125 14 LD Flatpack K14.A 5962F9581305QCC HS1-303BRH-8 -55 to +125 14 LD SBDIP D14.3 5962F9581305QXC HS9-303BRH-8 -55 to +125 14 LD Flatpack K14.A 5962F9581305V9A HS0-303BRH-Q -55 to +125 Die 5962F9581307V9A HS0-303BEH-Q -55 to +125 Die 5962F9581305VCC HS1-303BRH-Q -55 to +125 14 LD SBDIP D14.3 5962F9581307VCC HS1-303BEH-Q -55 to +125 14 LD SBDIP D14.3 5962F9581305VXC HS9-303BRH-Q -55 to +125 14 LD Flatpack K14.A N/A HS0-303BRH/SAMPLE -55 to +125 Die N/A HS1-303BRH/PROTO -55 to +125 14 LD SBDIP D14.3 N/A HS9-303BRH/PROTO -55 to +125 14 LD Flatpack K14.A 5962F9581307VXC HS9-303BEH-Q -55 to +125 14 LD Flatpack K14.A Notes: 1. These Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. 2. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed must be used when ordering.

2.1 Metallization Mask Layout

Table 1. Die and Assembly Related Information

HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH 3. Revision History FN6411 Rev.4.00 Page 4 of 7 Jul.18.19 3. Revision History Rev. Date Description 4.00 Jul.18.19 Applied new formatting throughout. Updated links throughout. Updated second Features bullet. Updated ordering information table removed package drawing for die related parts and updated notes. Added Revision History section. Updated Disclaimer.

HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH 4. Package Outline Dr awings FN6411 Rev.4.00 Page 5 of 7 Jul.18.19 4. Package Outline Drawings Notes: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. Dimension Q shall be measured from the seating plane to the base plane. 6. Measure dimension S1 at all four corners. 7. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead. 8. N is the maximum number of terminal positions. 9. Braze fillets shall be concave. 10. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 11. Controlling dimension: INCH. bbb C A - BS c Q L A SEATING BASE D PLANE PLANE S S -D--A- -C- eA -B- aaa C A - BM DS Sccc C A - BM DS S D E b A e M (c) (b) SECTION A-A BASE LEAD FINISH METAL eA/2 M A D14.3 MIL-STD-1835 CDIP2-T14 (D-1, Configuration C)

14 Lead Ceramic Dual In-Line Metal Seal Package (SBDIP)

A - 0.200 - 5.08 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 E 0.220 0.310 5.59 7.87 - e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC - eA/2 0.150 BSC 3.81 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 5 S1 0.005 - 0.13 - 6 S2 0.005 - 0.13 - 7 a9 0 o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2 N1 4 1 4 8 Rev. 0 4/94 For the most recent package outline drawing, see D14.3.

HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH 4. Package Outline Dr awings FN6411 Rev.4.00 Page 6 of 7 Jul.18.19 Notes: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab (dimension k) may be used to identify pin one. 2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply. 3. This dimension allows for off-center lid, meniscus, and glass overrun. 4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 5. N is the maximum number of terminal positions. 6. Measure dimension S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of the lead from the body. Dimension Q minimum shall be reduced by 0.0015 inch (0.038mm) maximum when solder dip lead finish is applied. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. -D- -C-

0.004 H A - BM DS S

-A- -B-

0.036 H A - BM DS S

e E A Q L D A SEATING AND LE2 E3 E3 BASE PLANE -H- b C M (c) (b) SECTION A-A BASE LEAD FINISH METAL PIN NO. 1 ID AREA A M K14.A MIL-STD-1835 CDFP3-F14 (F-2A, CONFIGURATION B)

14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE

A 0.045 0.115 1.14 2.92 - b 0.015 0.022 0.38 0.56 - b1 0.015 0.019 0.38 0.48 - c 0.004 0.009 0.10 0.23 - c1 0.004 0.006 0.10 0.15 - D - 0.390 - 9.91 3 E 0.235 0.260 5.97 6.60 - E 1 -0 . 2 9 0-7 . 1 13 E3 0.030 - 0.76 - 7 e 0.050 BSC 1.27 BSC - k 0.008 0.015 0.20 0.38 2 L 0.270 0.370 6.86 9.40 - Q 0.026 0.045 0.66 1.14 8 S1 0.005 - 0.13 - 6 N1 4 1 4- Rev. 0 5/18/94 For the most recent package outline drawing, see K14.A.

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