HLMX-16500D00

HLMP-1600 BOARDCOM | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 8

Technical content

Features

• Integral current limiting resistor
• TTL compatible Requires no external current Limiter with 5 volt/12 volt supply
• Cost effective Saves space and resistor cost
• Wide viewing angle
• Available in all colors Red, High Efficiency Red, Yellow, and High Performance Green in T-1 and T-13/4 packages

Description

The 5 volt and 12 volt series lamps contain an integral cur rent limiting resistor in series with the LED. This allows the lamp to be driven from a 5 volt/12 volt source without an external current limiter. The red LEDs are made from GaAsP on a GaAs substrate. The High Efficiency Red and Yellow devices use GaAsP on a GaP substrate. The green devices use GaP on a GaP substrate. The diffused lamps provide a wide off-axis viewing angle. The T-13/4 lamps are provided with sturdy leads suitable for wire wrap applications. The T-13/4 lamps may be front panel mounted by using the HLMP-0103 clip and ring. Package Dimensions Notes: 1. All dimensions are in mm (inches). 2. An epoxy meniscus may extend about 1 mm (0.040") down the leads. 3. For PCB hole recommendations, see the Precautions section. 0.65 (0.026) max. 24.1(.95) MIN. 4.70 (.185) 4.19 (.165) 3.43 (.135) 2.92 (.115) 1.52 (.060) 1.02 (.040) 2.79 (.110) 2.29 (.090) 1.14 (.045) 0.51 (.020) (0.016) 0.40 Ø 3.17 (.125) 2.67 (.105) 6.35 (.250) 5.58 (.220) 6.1 (0.240) 5.6 (0.220) 23.0 (0.90) MIN. 0.46 (0.018) SQUARE NOMINAL 2.54 (0.100) NOM. CATHODE 1.27 (0.050) NOM. 0.89 (0.035) 0.64 (0.025) 9.19 (0.362) 8.43 (0.332) 12.34 (0.486) 1.02 (0.040) 5.08 (0.200) 4.57 (0.180)

Outline 2q1/2[1] Operating Voltage (V) Part Number HLMP- Luminous Intensity Iv (mcd) Min. Max. Red T-1 Tinted Diffused A 60 5 1600 2.1 - 1600-D00xx 2.1 - 12 1601 2.1 - 1601-D00xx 2.1 - 1601-GH0xx 8.6 27.6 T-1 3/4 Tinted Diffused B 60 5 3600 2.1 - 3600-D00xx 2.1 - 12 3601 2.1 - 3601-D00xx 2.1 - Yellow T-1 Tinted Diffused A 60 5 1620 2.2 - 1620-C00xx 2.2 - 1620-C0Bxx 2.2 - 1620-EFBxx 3.4 10.8 12 1621 2.2 - 1621-C00xx 2.2 - T-1 3/4 Tinted Diffused B 60 5 3650 2.2 - 3650-C00xx 2.2 - 12 3651 2.2 - 3651-C00xx 2.2 - Green T-1 Tinted Diffused A 60 5 1640 1.6 - 1640-B00xx 1.6 - 1640-B0Dxx 1.6 - 1640-DE0xx 4.2 13.4 12 1641 1.6 - 1641-B00xx 1.6 T-1 3/4 Tinted Diffused B 60 5 3680 1.6 - 3680-B00xx 1.6 - 12 3681 1.6 - 3681-B00xx 1.6 - Note: 1. q1/2 is the off-axis angle at which the luminous intensity is 1/2 the axial luminous intensity.

Absolute Maximum Ratings at TA = 25°C Red/HER/Yellow

5 Volt Lamps

12 Volt Lamps

DC Forward Voltage (TA = 25°C) 7.5 Volts[2] 15 Volts[3] 7.5 Volts[2] 15 Volts[3] Reverse Voltage (IR = 100 μA) 5 Volts 5 Volts 5 Volts 5 Volts Operating Temperature Range -40°C to 85°C -40°C to 85°C -20°C to 85°C -20°C to 85°C Storage Temperature Range -40°C to 100°C -40°C to 100°C -40°C to 100°C -40°C to 100°C Notes: 2. Derate from TA = 50°C at 0.071 V/°C, see Figure 3. 3. Derate from TA = 50°C at 0.086 V/°C, see Figure 4. Part Numbering System HLMX-X 6 X X X X X XX Mechanical Option 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads A1,B1: Right Angle Housing, Uneven Leads A2,B2: Right Angle Housing, Even Leads Color Bin Options 0: Full color bin distribution B: Color bin 2&3 only D: Color bin 4&5 only Maximum Iv Bin Options 0: Open (No. max. limit) Others: Please refer to the Iv bin Table Minimum Iv Bin Options Please refer to the Iv bin Table Operating Voltage 0: 5 V 1: 12 V Color Options 0: GaP HER 2,5: GaP Yellow 4,8: GaP Green Package Options 3: T-13/4 (5 mm) 1: T-1 (3 mm)

Electrical/Optical Characteristics at TA = 25°C Symbol High Efficiency Red Yellow Green lP Peak Wavelength 635 583 565 nm ld Dominant Wavelength 626 585 569 nm Note 4 Dl1/2 Spectral Line Halfwidth 40 36 28 nm RqJ-PIN Thermal Resistance 290 290 290 °C/W Junction to Cathode Lead (Note 6) RqJ-PIN Thermal Resistance 210 210 210 °C/W Junction to Cathode Lead (Note 7) IF Forward Current

12 V Devices

13 20 13 20 13 20 mA VF = 12 V IF Forward Current

5 V Devices

10 15 10 15 10 15 mA VF = 5 V hV Luminous Efficacy 145 500 595 lumen /Watt Note 2 VR Reverse Breakdown Voltage 5.0 5.0 5.0 V IR = 100 μA Notes: 4. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 5. Radiant intensity, Ie, in watts/steradian, may be found from the equation I e = l V/hV, where l V is the luminous intensity in candelas and hV is the luminous efficacy in lumens/Watt. 6. For Figure A package type. 7. For Figure B package type.

Figure 8. Relative luminous intensity vs. applied forward voltage. 12 volt Figure 7. Relative luminous intensity vs. applied forward voltage. 5 volt Maximum tolerance for each bin limit is ±18%.

5 VOLT DEVICES

12 VOLT DEVICES

Color Cat # Lambda (nm) Min. Max. Green 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 Yellow 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Tolerance for each bin limit is ±0.5 nm. Mechanical Option Matrix Mechanical Option Code Definition

00 Bulk Packaging, minimum increment 500 pcs/bag

01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag

02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag

A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag A2 T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bag B1 T-13/4 Angle Housing, uneven lead, minimum increment 500 pcs/bag B2 T-13/4 Angle Housing, even leads, minimum increment 500 pcs/bag Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. Intensity Bin Limit (Con't) Color Bin Intensity Range (mcd) Min. Max. Green B 1.8 2.9 C 2.9 4.7 D 4.7 7.6 E 7.6 12.0 F 12.0 19.1 G 19.1 30.7 H 30.7 49.1 I 49.1 78.5 J 78.5 125.7 K 125.7 201.1 L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Z 21400.0 30900.0

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005‑2015 Avago Technologies. All rights reserved. Figure 9. Recommended wave soldering profile.

• The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions
• Care must be taken during PCB assembly and soldering process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff.
• Recommended soldering conditions: Wave Soldering Manual Solder Dipping Pre-heat Temperature 105°C Max. – Pre-heat Time 60 sec Max. – Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. Note:s 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED.
• Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition.
• If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process.
• Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability.
• Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size Diagonal Plated Through- Hole Diameter Lead size (typ.) 0.45 × 0.45 mm 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Dambar shear- off area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Lead size (typ.) 0.50 × 0.50 mm 0.707 mm (0.028 in) 1.05 to 1.15 mm (0.041 to 0.045 in) Dambar shear- off area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) Note: Refer to application note AN1027 for more information on soldering LED components. 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 TIME (SECONDS) PREHEAT TURBULENT WAVE LAMINAR HOT AIR KNIFE TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead-free solder alloy) Flux: Rosin /f_lux Solder bath temperature: 245 °C ± 5 °C (maximum peak temperature = 250 °C) Dwell time: 1.5 sec – 3.0 sec (maximum = 3 sec) Note: Allow for board to be sufficiently cooled to room temperature before you exert mechanical force.