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High intensity Choice of four bright colors: — High Efficiency Red — Orange — Yellow — High Performance Green Popular T-1 diameter package Selected minimum intensities Wide viewing angle General purpose leads Reliable and rugged Available on tape and reel Package Dimensions NOTE 1. All dimensions are in mm (inches). 2. An epoxy meniscus may extend about 1 mm (0.040 in.) down the leads. 3. For PCB hole recommendations, see Precautions. 0.65 (0.026) max. 24.1(.95) MIN. 4.70 (.185) 4.19 (.165) 3.43 (.135) 2.92 (.115) 1.52 (.060) 1.02 (.040) 2.79 (.110) 2.29 (.090) 1.14 (.045) 0.51 (.020) (0.022) 0.55 3.17 (.125) 2.67 (.105) 6.35 (.250) 5.58 (.220) CATHODE HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 T-1 (3-mm) Diffused LED Lamps Data Sheet
- 2 - HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Device Selection Guide Absolute Maximum Ratings at TA = 25°C Material Color Part Number Luminous Intensity Iv (mcd) at 10 mA Min. Max. GaAsP on GaP Red HLMP-1301 3.4 — HLMP-1301-E00xx 3.4 — HLMP-1301-G00xx 8.6 — HLMP-1301-GH0xx 8.6 27.6 Yellow HLMP-1401 2.2 — HLMP-1401-D00xx 3.6 — HLMP-1401-E0000 5.7 — Orange HLMP-K401 2.1 — HLMP-K401-E00xx 3.4 — HLMP-K401-FGDxx 5.4 17.2 HLMP-K401-FH000 5.4 27.6 GaP Green HLMP-1503 1.0 — HLMP-1503-C00xx 2.6 — HLMP-1503-D00xx 4.2 — HLMP-1503-DE000 4.2 13.4 HLMP-1503-E00xx 6.7 — Emerald Green a a. Refer to Application Note 1061 for in formation comparing standard green and emerald green light output degradation. HLMP-K600 1.0 — Parameter HER/Orange Ye l l o w Green Units Peak Forward Current 90 60 90 mA Average Forward Currenta a. See Figure 5 (HER/Orange), Figure 10 (Yellow), or Figure 15 (Green/Emerald Green) to establish pulsed operating conditions. 25 20 25 mA DC Currentb, c 30 20 30 mA Reverse Voltage (IR = 100 A) 5 5 5 V Transient Forward Current d (10s Pulse) d. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings. 500 500 500 mA LED Junction Temperature 110 110 110 °C Operating Temperature Range –40 to +100 –40 to +100 –20 to +100 °C Storage Temperature Range –40 to +100 –40 to +100 –40 to +100 °C
- 3 - HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Electrical/Optical Characteristics at TA = 25°C Parameter Symbol Device Min. Typ. Max. Units Test Conditions Included Angle Between Half Luminous Intensity Points 21/2 All — 60 — Deg. IF = 10 mA, See Note a a. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. Peak Wavelength PEAK High Efficiency Red — 635 — nm Measurement at Peak Orange — 600 — Yellow — 583 — Green — 565 — Emerald Green — 558 — Dominant Wavelength d High Efficiency Red — 626 — nm See Note b b. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. Orange — 602 — Yellow — 585 — Green — 569 — Emerald Green — 560 — Spectral Line Halfwidth 1/2 High Efficiency Red — 40 — nm Yellow — 36 — Green — 28 — Emerald Green — 24 — Speed of Response s High Efficiency Red — 90 — ns Orange — 280 — Yellow — 90 — Green — 500 — Emerald Green — 3100 — Capacitance C High Efficiency Red — 11 — pF V F = 0; f = 1 MHz Orange — 4 — Yellow — 15 — Green — 18 — Emerald Green — 35 — Thermal Resistance R J-PIN All — 290 — °C/W Junction to Cathode Lead Forward Voltage V F HER/Orange 1.5 1.9 2.4 V I F = 10 mA Yellow 1.5 2.0 2.4 Green 1.5 2.1 2.7 Emerald Green — 2.1 2.7 Reverse Breakdown Voltage V R All 5.0 — — V I R = 100 μA Luminous Efficacy V High Efficiency Red — 145 — lumens/ watt See Note c c. Radiant intensity, l e, in watts/steradian, may be found from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. Orange — 380 — Yellow — 500 — Green — 595 — Emerald Green — 655 —
- 4 - HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Part Numbering System HLM P -x 1 x2 x3 x4 -x 5 x6 x7 x8 x9 Code Description Option x1 Package type 1 T-1 (3 mm) K T-1 (3 mm) x2 Color 3 GaP HER
4 GaP Yellow (except K4xx series)
5 GaP Green
6 GaP Emerald Green
x 3 x4 Product specific designation — x5 Minimum intensity bin Refer to Intensity Bin Limits Table x6 Maximum intensity bin x7 Color bin selection 0 Full range D Color Bin 4 and 5 only x8 x9 Packaging option 00 Bulk packaging
02 Tape and Reel, Straight Leads
A1 Right Angle Housing, Uneven Leads A2 Right Angle Housing, Even Leads FG Products need inventory control for customer IDI
- 5 - HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Intensity Bin Limts Table 1 Intensity Bin Limits Color Bin Intensity Range (mcd) Min. Max. Red/Orange D2 . 4 3 . 8 E3 . 8 6 . 1 F6 . 1 9 . 7 G 9.7 15.5 H 15.5 24.8 I 24.8 39.6 J 39.6 63.4 K 63.4 101.5 L 101.5 162.4 M 162.4 234.6 N 234.6 340.0 O 340.0 540.0 P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 Yellow C2 . 5 4 . 0 D4 . 0 6 . 5 E 6.5 10.3 F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 L 173.2 250.0 M 250.0 360.0 N 360.0 510.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 Table 1 Intensity Bin Limits (Continued) Color Bin Intensity Range (mcd) Min. Max.
- 6 - HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet NOTE Maximum tolerance for each bin limit is ±1 8 % . NOTE All categories are established for classification of products. Products may not be available in all categories. Contact your local Broadcom representative for further clarification or information. Color Categories NOTE Tolerance for each bin limit is ± 0.5 nm. Packaging Option Matrix Green/Emerald Green A1 . 1 1 . 8 B1 . 8 2 . 9 C2 . 9 4 . 7 D4 . 7 7 . 6 E 7.6 12.0 F 12.0 19.1 G 19.1 30.7 H 30.7 49.1 I 49.1 78.5 J 78.5 125.7 K 125.7 201.1 L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Table 1 Intensity Bin Limits (Continued) Color Bin Intensity Range (mcd) Min. Max. C olor Category # Lambda (nm) Min. Max. Emerald Green 9 522.5 555.5 8 555.5 558.5 7 558.5 561.5 6 561.5 564.5 Green 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 Yellow 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Orange 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 Packaging Option Code Definition
00 Bulk Packaging, minimum increment,
02 Tape & Reel, straight leads, minimum increment,
A1 Right Angle Housing, uneven leads, minimum increment, 500 pcs/bag A2 Right Angle Housing, even leads, minimum increment, 500 pcs/bag FG Inventory Control for Customer IDI
- 7 - HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Figure 1 Relative Intensity vs. Wavelength ORANGE HIGH EFFICIENCY RED WAVELENGTH – nm RELATIVE INTENSITY 1.0 0.5 0500 550 600 650 700 750 YELLOW EMERALD GREEN HIGH PERFORMANCE GREEN T A = 25° CAlGaAs RED
- 11 - HLMP-1301, HLMP-1401, HLMP-1503, HLMP-K401, HLMP-K600 Data Sheet Precautions Lead Forming Preform or cut the leads of an LED lamp to length before they are inserted and soldered into the PC board. If forming a lead is required before it is soldered, take care to avoid any excessive mechanical stress induced to the LED package. Otherwise, cut the LED leads to length after soldering at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. Make tooling precisely and cut the leads cut to length, rather than relying on your hand. Soldering Conditions Take care during PCB assembly and soldering process to prevent damage to LED component. The closest an LED is allowed to be soldered on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. Follow the recommended soldering conditions in this table. Set and maintain the wave soldering parameter according to the recommended temperature and dwell time in the solder wave. You are advised to periodically check the soldering profile to ensure the soldering profile used always conforms to recommended soldering condition. If necessary, use a fixture during soldering process to hold the LED component in the proper orientation with respect to the PCB. Handle the LED properly to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. To ensure solderability, pay special attention to board fabrication, solder masking, surface plating, and lead hole size and component orientation. Follow the recommended PC board plated through-hole sizes for LED component leads in this table. NOTE Refer to application note AN1027 for more information on soldering LED components. Figure 17 Recommended Wave Soldering Profile Wave Soldering Manual Solder Dipping Pre-heat Temperature 105°C Max. — Pre-heat Time 30s Max. — Peak Temperature 250°C Max. 260°C Max. Dwell Time 3s Max. 5s Max. LED Component Lead Size Diagonal Plated Through-Hole Diameter Lead size (typ.) 0.45 × 0.45 mm 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in.) Dambar shear-off area (max.) 0.65 mm (0.026 in.) 0.919 mm (0.036 in) Lead size (typ.) 0.50 × 0.50 mm 0.707 mm (0.028 in) 1.05 to 1.15 mm (0.041 to 0.045 in.) Dambar shear-off area (max.) 0.70 mm (0.028 in.) 0.99 mm (0.039 in) LAMINAR WAVE BOTTOM SIDE OF PC BOARDHOT AIR KNIFE TURBULENT WAVE FLUXING PREHEAT 01 0 2 0 100 150 200 250 30 40 50 TIME – SECONDS TEMPERATURE – C 60 70 80 90 100 TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.
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