HLMA-SH05 HP | Alldatasheet
Document overview
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Technical content
Features
- Rectangular light emitting surface
- Excellent for flush mounting on panels
- Long life: solid state reliability
- Excellent uniformity of light output
Description
encapsulated lamp in rectangular package which are easily stacked in arrays or used for discrete front panel indicators. Contrast and light uniformity are enhanced by a special epoxy diffusion and tinting process. Technology This 2x5 rectangular solid state lamp utilizes the newly developed Aluminum Indium Gallium Phosphide (AlInGaP) LED technology. This material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents.
- The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the device.
- q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Figure 6. NORMALIZED INTENSITY
- The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board.
- If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.
- It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions
- Care must be taken during PCB assembly and soldering process to prevent damage to LED component.
- The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff.
- Recommended soldering conditions:
- Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition.
- If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process.
- Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling.
- Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability.
- Recommended PC board plated through hole sizes for LED component leads: Manual Solder Wave Soldering Dipping Pre-heat Temperature 105 °C Max. – Pre-heat Time 30 sec Max. – Peak Temperature 250 °C Max. 260 °C Max. Dwell Time 3 sec Max. 5 sec Max. LED Component Plated Through Lead Size Diagonal Hole Diameter Note: Refer to application note AN1027 for more information on soldering LED components.
Figure 7. Recommended wave soldering profile.
www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna- tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2002-2005 Agilent Technologies, Inc. Obsoletes 5989-3269EN November 14, 2005 5989-4267EN